In one embodiment, acoustic devices are formed on a substrate which is then placed on a first HAF layer, a screen, and a second HAF layer. The layers of HAF each have apertures aligned with acoustic ports of the devices. The substrate is heated such that the first layer of HAF adheres to the substrate and the screen and the second layer of HAF adheres to the screen. The substrate is cut to separate the devices into modules. In other embodiments, a waterproof membrane covering the acoustic port of an acoustic module may be bonded to a screen to form a gap such that it moves under pressure until restrained by the screen. In still other embodiments, back volume covers for acoustic devices are formed by stacking and heating a first HAF layer, a glass-reinforced epoxy laminate layer, a second HAF layer, and a top layer on a substrate.

The invention relates to an ultrasonic sensor device (1) for a motor vehicle, comprising an ultrasonic sensor (2), which has a membrane (5) for emitting and/or receiving ultrasonic waves, and comprising a stiffening unit (15) for attachment to a trim element (27) of the motor vehicle and for stiffening the trim element (27), wherein the stiffening unit (15) has a through-opening (17) for the membrane (5) of the ultrasonic sensor (2), wherein the stiffening unit (15) is formed from at least two separate stiffening elements (18 to 21) for attachment to a trim element (27).

The invention relates to an ultrasonic sensor device (1) for a motor vehicle, comprising an ultrasonic sensor (2), which has a membrane (5) for emitting and/or receiving ultrasonic waves, and comprising a stiffening unit (15) for attachment to a trim element (27) of the motor vehicle and for stiffening the trim element (27), wherein the stiffening unit (15) has a through-opening (17) for the membrane (5) of the ultrasonic sensor (2), wherein the stiffening unit (15) is formed from at least two separate stiffening elements (18 to 21) for attachment to a trim element (27).

A sensor module, including a main body shell and a sensing device provided in the main body shell; the sensing device includes a sensor, an upper cover plate, a lower cover plate and a circuit plate; the sensor is mounted on the circuit plate; the upper cover plate and the lower cover plate are respectively mounted on the upper and lower sides of the circuit plate, and are configured to support the main body shell and fix the circuit plate; an accommodation cavity for storing an insulating fluid is provided between the upper cover plate and the circuit plate, between the upper cover plate and the sensor, and between the lower cover plate and the circuit plate; and a first acoustic window is provided at a portion of the upper cover plate located above the sensor. Further disclosed are a sensor assembly and an acoustic logging tool.

A vehicle structure includes a cooling device, an air guide member, and a horn. The cooling device is cooled with a flow of moving air which a vehicle receives while traveling. The air guide member guides the moving air into the cooling device. The air guide member has a single opening in a front of the vehicle. The horn is disposed at a side of the air guide member. The cooling device and the horn are arranged in a vehicle-width direction. The cooling device and the horn face the single opening viewed form the front of the vehicle.

A vehicle structure includes a cooling device, an air guide member, and a horn. The cooling device is cooled with a flow of moving air which a vehicle receives while traveling. The air guide member guides the moving air into the cooling device. The air guide member has a single opening in a front of the vehicle. The horn is disposed at a side of the air guide member. The cooling device and the horn are arranged in a vehicle-width direction. The cooling device and the horn face the single opening viewed form the front of the vehicle.

The ultrasonic sensor includes a wave transmitting and receiving device and a cover. The wave transmitting and receiving device has a front surface including a wave transmitting and receiving surface and is configured to transmit and receive an ultrasonic wave through the wave transmitting and receiving surface. The cover covers the wave transmitting and receiving device so as to expose the wave transmitting and receiving surface. The cover is constituted by multiple portions, and the multiple portions are individually made of multiple materials different from each other.

The ultrasonic sensor includes a wave transmitting and receiving device and a cover. The wave transmitting and receiving device has a front surface including a wave transmitting and receiving surface and is configured to transmit and receive an ultrasonic wave through the wave transmitting and receiving surface. The cover covers the wave transmitting and receiving device so as to expose the wave transmitting and receiving surface. The cover is constituted by multiple portions, and the multiple portions are individually made of multiple materials different from each other.

A sensor has a sensor element (5) with two opposite sides (11, 9) and an interconnect (7) with first and second terminal segments (13B, 13F) interconnected by an intermediate segment (42). The first terminal segment (13F) is positioned against a first side (11) of the sensor element and comprises a first contact terminal (50). The second terminal segment (13B) is positioned against the second side (9) of the two opposite sides of the sensor element and comprises a second contact terminal (52) on a surface facing the second side (11). There are third and fourth, external, contact terminals (54, 56). The interconnect provided electrical connections between the first and fourth contact terminals (50, 56) and between the second and third contact terminals (52, 54).

An acoustic device includes a micro-machined acoustic transducer element, an acoustically attenuating region, and an acoustic matching region arranged between the acoustic transducer element and the acoustically attenuating region. The acoustic transducer element is formed in a first substrate housing a cavity delimiting a membrane. A second substrate of semiconductor material integrating an electronic circuit is arranged between the acoustic transducer element and the acoustically attenuating region. The acoustic matching region has a first interface with the second substrate and a second interface with the acoustically attenuating region. The acoustic matching region has an impedance matched to the impedance of the second substrate in proximity of the first interface, and an impedance matched to the acoustically attenuating region in proximity of the second interface.