A thermally and structurally optimized disaster resistant housing for a vertically stacked array of computer digital data storage devices such as hard drives is provided. An external, fire resistant housing has an internally mounted water resistant enclosure for the array. The water resistant enclosure includes a plurality of much thicker plates than known which significantly increase dissipation of heat and simultaneously greater increase the crush and impact load resistance of the device. An automatic method is also provided for producing complex molded gypsum or cement components.

A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of thermally conductive plastic that combine to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

A semiconductor memory device includes a semiconductor memory unit, a memory controller, a cover unit having a first portion covering the semiconductor memory unit and a second portion covering the memory controller, a first heat conduction member disposed between the semiconductor memory unit and the first portion of the cover unit, and a second heat conduction member disposed between the memory controller and the second portion of the cover. The cover unit has a gap formed between the first and second portions.

A hard drive includes a base deck with sidewalls to define a cavity. The hard drive further includes a weld lip that is positioned along and extends from the sidewalls. The weld lip includes a thermal choke that is configured to reduce heat transfer from the weld lip to the sidewalls.

Methods, apparatuses, and systems related to a memory device are described. A controller may be configured to predict a temperature of a memory based on a real-time temperature of the controller. Based on the predicted temperature of the memory, the controller may execute a remedial action to reduce an actual temperature of the memory for executing an upcoming operation.

A video coder is configured to form, in a symmetric motion vector difference mode, a List 0 (L0) base vector using a L0 Advanced Motion Vector Prediction (AMVP) candidate list and a List 1 (L1) base vector using a L1 AMVP candidate list; determine a refined L0 motion vector and a refined L1 motion vector by performing a decoder-side motion vector refinement process that refines the L0 base vector and the L1 base vector; and use the refined L0 motion vector and the refined L1 motion vector to determine a prediction block for a current block of a current picture of the video data.

Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.

Described are hard disk drives that include a low density atmosphere, with which is included a passivating gas, and methods of using these hard disk drives and methods of assembling these hard disk drives.

Disclosed herein is an electronic device that includes a pedestal that extends from a mounting surface of a base of the electronic device. The electronic device also includes a thermal interface material that is interposed between an interface surface of the pedestal and a data processing component, is in direct contact with the data processing component, and is in direct contact with a first portion and a second portion of the interface surface. The first portion of the interface surface of the pedestal has a first height, relative to the mounting surface of the base, and the second portion of the interface surface of the pedestal has a second height, relative to the mounting surface of the base and different than the first height.

A video coder is configured to form, in a symmetric motion vector difference mode, a List 0 (L0) base vector using a L0 Advanced Motion Vector Prediction (AMVP) candidate list and a List 1 (L1) base vector using a L1 AMVP candidate list; determine a refined L0 motion vector and a refined L1 motion vector by performing a decoder-side motion vector refinement process that refines the L0 base vector and the L1 base vector; and use the refined L0 motion vector and the refined L1 motion vector to determine a prediction block for a current block of a current picture of the video data.