Embodiments provide an integrated capacitor disposed directly over and aligned to a vertical gate all around memory cell transistor. In some embodiments, an air gap may be provided between adjacent word lines to provide a low k dielectric effect between word lines. In some embodiments, a bottom bitline structure may be split across multiple layers. In some embodiments, a second tier of vertical cells may be positioned over a first tier of vertical cells.

A semiconductor memory device according to an embodiment includes first to ninth conductive layers, first and second insulating members, and first to fourth pillars. A distance between the first and second pillars in a cross section including the second conductive layer and the sixth conductive layer is smaller than a distance between the first and second pillars in a cross section including the third conductive layer and the seventh conductive layer. A distance between the third and fourth pillars in a cross section including the fourth conductive layer and the eighth conductive layer is greater than a distance between the third and fourth pillars in a cross section including the fifth conductive layer and the ninth conductive layer.

Row and/or column electrode lines for a memory device are staggered such that gaps are formed between terminated lines. Vertical interconnection to central points along adjacent lines that are not terminated are made in the gap, and vertical interconnection through can additionally be made through the gap without contacting the lines of that level.

A memory device including a memory array configured to store data, a sense amplifier circuit coupled to the memory array, and a read circuit coupled to the sense amplifier circuit, wherein the read circuit includes a first input that receives a read column select signal for activating the read circuit to read the data out of the memory array through the read circuit during a read operation.

In some embodiments, an integrated circuit (IC) device includes an active semiconductor layer, a circuitry formed within the active semiconductor layer, a region including conductive layers formed above the active semiconductor layer, and a memory module formed in the region. The memory device includes a three-dimensional array of memory cells, each adapted to store a weight value, and adapted to generate at each memory cell a signal indicative of a product between the stored weight value and an input signal applied to the memory cell. The memory module is further adapted to transmit the product signals from the memory cell simultaneously in the direction of the active semiconductor layer.

A clock circuit includes at least two first driving circuits and a plurality of discrete first wires located between adjacent first driving circuits, the adjacent first driving circuits are connected through at least one first wire and at least two second wires, the first driving circuits are connected with the second wires, all of the first wires connected between two second wires are connected in series with each other, the first wires are located on a first metal layer, the second wires are located on a second metal layer, and the second metal layer is above the first metal layer.

A semiconductor device comprises: a first or a second path configured to transmit a first signal which swings between a ground level and a first level, a third path configured to transmit a second signal which swings between the ground level and a second level lower than the first level, a transmitter configured to output received the first signal through the first or second path as the second signal to the third path, and initialize in response to an enable signal, and a receiver configured to output received the second signal through the third path as the first signal through the first or second path, determine level of the second signal through a reference level that is regulated according to a fed-back level of an output terminal thereof, and initialize in response to the enable signal.

A semiconductor device comprises: a first or a second path configured to transmit a first signal which swings between a ground level and a first level, a third path configured to transmit a second signal which swings between the ground level and a second level lower than the first level, a transmitter configured to output received the first signal through the first or second path as the second signal to the third path, and initialize in response to an enable signal, and a receiver configured to output received the second signal through the third path as the first signal through the first or second path, determine level of the second signal through a reference level that is regulated according to a fed-back level of an output terminal thereof, and initialize in response to the enable signal.

A method of testing a semiconductor device includes providing a first wafer that includes a first surface, a second surface that is allocated at an opposite side of the first surface, a first electrode penetrating the first wafer from the first surface to the second surface, and a pad formed on the first surface and coupled electrically with the first electrode, providing a second wafer that includes a second electrode penetrating the second wafer, stacking the first wafer onto the second wafer to connect the first electrode with the second electrode such that the second surface of the first wafer faces the second wafer, probing a needle to the pad, and supplying, in such a state that the first wafer is stacked on the second wafer, a test signal to the first electrode to input the test signal into the second wafer via the first electrode and the second electrode.

Some embodiments include a method of forming a conductive structure. A metal-containing conductive material is formed over a supporting substrate. A surface of the metal-containing conductive material is exposed to at least one radical form of hydrogen and to at least one oxidant. The exposure alters at least a portion of the metal-containing conductive material to thereby form at least a portion of the conductive structure. Some embodiments include a conductive structure which has a metal-containing conductive material with a first region adjacent to a second region. The first region has a greater concentration of one or both of fluorine and boron relative to the second region.