A semiconductor device may implement a command-over-data function on a multi-level signaling data bus architectures. The multi-level signaling data bus architecture may support a multi-level communication architecture that includes a plurality of channels each including conversion of M bitstreams to N multi-level signals, where M is greater than N. A bitstream includes a plurality of bits provided serially, with each bit of the bitstream provided over a period of time. The multi-level signaling data bus is adapted to transmit data using a first set of assigned states of the data bus, and to transmit commands using at least a second assigned state of the data bus.

A three-dimensional memory device, such as 3D AND Flash memory device, includes a first page buffer, a second page buffer, a sense amplifier, a first path selector, and a second path selector. The first page buffer and the second page buffer are respectively configured to temporarily store a first write-in data and a second write-in data. The first path selector couples the sense amplifier or the first page buffer to a first global bit line according to a first control signal. The second path selector couples the sense amplifier or the second page buffer to a second global bit line according to a second control signal.

A caching system including a first sub-cache and a second sub-cache in parallel with the first sub-cache, wherein the second sub-cache includes a set of cache lines, line type bits configured to store an indication that a corresponding cache line of the set of cache lines is configured to store write-miss data, and an eviction controller configured to flush stored write-miss data based on the line type bits.

A solid-state storage drive and a solid-state storage drive control method are provided. The solid-state storage drive includes a controller, a selector, and N NAND flash memory chips, where N is an integer greater than 1. The controller is configured to output a plurality of gating signals to the selector. The plurality of gating signals indicate M of the N NAND flash memory chips, where M is an integer greater than or equal to 1 and less than or equal to N. The selector is configured to select, based on the plurality of gating signals, the M NAND flash memory chips to perform data transmission. This improves an interface rate of the solid-state storage drive, so that performance requirements of a high interface rate and a high storage capacity of the solid-state storage drive can be satisfied.

A memory device including a memory array operatively coupled to an array data bus and a deserializer circuit operatively coupled with the array data bus. The deserializer circuit includes a first ring counter including a first set of flip-flops to sequentially output a set of rising edge clock signals based on a reference clock input and a second ring counter portion including a second set of flip-flop circuits to sequentially output a set of falling edge clock signals based on the reference clock input. A rising data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a rising data portion from a respective latch circuit in response to a rising edge clock signal. A falling data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a falling data portion from a respective latch circuit in response to a falling edge clock signal. The third set of flip-flops outputs the set of rising data portions and the fourth set of flip-flop circuits outputs the set of falling data portions to generate a synchronized data stream to output to the array data bus in response to a common clock signal.

Methods and apparatus for opportunistic full duplex DRAM for tightly coupled compute die and memory die. A memory controller includes one or more memory channel input-output (IO) interfaces having sets of read data (RdDQ) lines and write data (WrDQ) lines, and includes logic to implement concurrent read and write operations utilizing the RdDQ lines and WrDQ lines. A memory channel IO interface may be coupled to one or more memory devices such as DRAM DIMMs or DRAM/SDRAM dies having a mating IO interface, such as using through-silicon vias (TSVs) and die-to-die interconnects. Circuitry in a memory device or die includes a macro block of IO drivers coupled to the memory channel IO circuitry via a macro interface supporting full duplex operations. IO drivers in a macro block may be connected to memory banks using half-duplex bi-direction links to different banks or full duplex links to the same bank.

A memory device including a memory array operatively coupled to an array data bus and a deserializer circuit operatively coupled with the array data bus. The deserializer circuit includes a first ring counter including a first set of flip-flops to sequentially output a set of rising edge clock signals based on a reference clock input and a second ring counter portion including a second set of flip-flop circuits to sequentially output a set of falling edge clock signals based on the reference clock input. A rising data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a rising data portion from a respective latch circuit in response to a rising edge clock signal. A falling data circuit portion of the deserializer circuit includes a set of flip-flops that each receive a falling data portion from a respective latch circuit in response to a falling edge clock signal. The third set of flip-flops outputs the set of rising data portions and the fourth set of flip-flop circuits outputs the set of falling data portions to generate a synchronized data stream to output to the array data bus in response to a common clock signal.

A disclosed system may include (1) a memory package having a physical memory and optical circuitry, (2) a processor package, separate and distinct from the memory package, having at least one physical processor and additional optical circuitry, and (3) an optical medium communicatively coupling the optical circuitry of the memory package with the additional optical circuitry of the processor package. Various other systems, apparatuses, and methods are also disclosed.

Apparatuses and methods for writing data to a memory array are disclosed. When data is duplicative across multiple data lines, data may be transferred across a single line of a bus rather than driving the duplicative data across all of the data lines. The data from the single data line may be provided to the write amplifiers of the additional data lines to provide the data from all of the data lines to be written to the memory. In some examples, error correction may be performed on data from the single data line rather than all of the data lines.

Methods, apparatus, systems and articles of manufacture are disclosed for allocation in a victim cache system. An example apparatus includes a first cache storage, a second cache storage, a cache controller coupled to the first cache storage and the second cache storage and operable to receive a memory operation that specifies an address, determine, based on the address, that the memory operation evicts a first set of data from the first cache storage, determine that the first set of data is unmodified relative to an extended memory, and cause the first set of data to be stored in the second cache storage.