Embodiments relate to a sense amplifier circuit and a data read method. The sense amplifier circuit includes: a first P-type transistor connected to a first signal terminal; a second P-type transistor connected to a second signal terminal; a first N-type transistor connected to a third signal terminal; a second N-type transistor connected to a fourth signal terminal; a first offset cancellation subcircuit configured to connect a first read bit line to a second complementary read bit line in response to a first offset cancellation signal; a second offset cancellation subcircuit configured to connect a first complementary read bit line to a second read bit line in response to a second offset cancellation signal; a first write-back subcircuit configured to connect the first complementary read bit line to the second complementary read bit line in response to a first write-back signal; and a second write-back subcircuit.

An Input/Output (I/O) circuit for a memory device is provided. The I/O circuit includes a charge integration circuit coupled to a bitline of the memory device. The charge integration circuit provides a sensing voltage based on a decrease of a voltage on the bitline. A comparator is coupled to the charge integration circuit. The comparator compares the sensing voltage with a reference voltage and provides an output voltage based on the comparison. A time-to-digital converter coupled to the comparator. The time-to-digital convertor converts a time associated with the output voltage to a digital value.

A system and method for operating a memory cell is provided. A non-volatile memory storage device includes an array of memory cells of differential or single-ended type. In an embodiment, a regulator is coupled to a sense amplifier. The regulator is configured to generate a voltage to gate terminals of one or two transistors of the sense amplifier. In the differential type, the voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a maximum current flowing in a memory cell being in a RESET state and a fixed current. In the single-ended type, the regulated voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a fixed current and the reference current generated by the reference current source across temperature.

A non-volatile memory device includes a floating-node memory cell disposed in an integrated circuit (IC). The memory cell includes a floating-node, a control node, an erase node, a source node, and a drain node. The memory device also includes a high-voltage input node for coupling to an external programmable high-voltage source external to the IC. The memory device also includes a high-voltage switch circuit coupled to the high-voltage input node for providing a voltage signal for performing hot-electron programming of charges to the floating node and tunneling erase of charges from the floating node.

A sense amplifying device includes a bit line bias voltage adjuster and a sense amplifying circuit. The bit line bias voltage adjuster receives a power voltage to be an operation voltage. The bit line bias voltage adjuster includes a first amplifier, a first transistor and a first current source. The first amplifier, based on the power voltage, generates an adjusted reference bit line voltage according to a reference bit line voltage and a feedback voltage. The first transistor receives the adjusted reference bit line voltage and generates the feedback voltage, wherein the first transistor is a native transistor. The sense amplifying circuit receives the power voltage to be the operation voltage, and generates a sensing result according to the adjusted reference bit line voltage.

Apparatuses, systems, and methods for single-ended global and local input/output architecture. A conventional memory may use local input/output (LIO) and global input/output (GIO) lines which are paired and carry complimentary signals. The present disclosure includes single ended LIO and GIO architecture where a single LIO couples a single GIO between a read/write amplifier and bit line as part of an access operation. This may reduce a footprint of the memory device.

The present disclosure provides a readout circuit, a memory, and a method of reading out data of a memory. The readout circuit includes: a sense amplifier and an isolation unit, the sense amplifier being connected to a bit line and a complementary bit line through the isolation unit, the bit line being connected to a memory cell and the complementary bit line being connected to a memory cell, and the isolation unit being configured to disconnect the sense amplifier from the bit line and the complementary bit line in response to an isolation signal; and an offset canceling unit, configured to perform an offset cancellation on the sense amplifier in response to an offset canceling signal, at least a part of a stage of a charge sharing being performed at the same time as at least a part of a stage of an operation of the offset canceling unit.

A memory device includes a memory array of memory cells. A page buffer is to apply, to a bit line, a first voltage or a second voltage that is higher than the first voltage during a program verify operation. Control logic operatively coupled with the page buffer is to perform operations including: causing a plurality of memory cells to be programmed with a first program pulse; measuring a threshold voltage for the memory cells; forming a threshold voltage distribution from the measured threshold voltages; classifying, based on the threshold voltage distribution, a first subset of the memory cells as having a faster quick charge loss than that of a second subset of the memory cells; and causing, in response to the classifying, the page buffer to apply the second voltage to the bit line during a program verify operation performed on any of the first subset of memory cells.

A memory device, such as an MRAM memory, includes a memory array with a plurality of bit cells. The memory array is configured to store trimming information and store user data. A sense amplifier is configured to read the trimming information from the memory array, and a trimming register is configured to receive the trimming information from the sense amplifier. The sense amplifier is configured to receive the trimming information from the trimming register so as to operate in a trimmed mode for reading the user data from the memory array.

A semiconductor device includes a substrate, a first external connection pad separated from the substrate in a first direction, which is a thickness direction thereof, a first coil separated from the substrate in the first direction and electrically connected to the connection pad, a first stacked body between the connection pad and the substrate and between the first coil and the substrate, the first stacked body including a first insulator, a first wiring therein, and a first pad electrically connected to the wiring, and a second stacked body between the first stacked body and the substrate, the second stacked body including a second insulator, a second wiring therein, a second pad electrically connected to the second wiring, and a second coil. The first insulator contacts the second insulator. The first pad contacts the second pad. A part of the first coil overlaps the second coil in the first direction.