The present application provides a storage system including a data port. The data port includes a data output unit. The data output unit includes: a pull-up unit having a control terminal, a first terminal and a second terminal, a first input signal being inputted to the control terminal, the first terminal being electrically connected to a power supply, the second terminal being connected to an output terminal of the data output unit, and the pull-up unit being a first NMOS transistor; and a pull-down unit having a control terminal, a first terminal and a second terminal, a second input signal being inputted to the control terminal, the first terminal being electrically connected to a ground terminal, and the second terminal being connected to the output terminal of the data output unit.

A nonvolatile memory device comprises a first semiconductor layer including, an upper substrate, and a memory cell array in which a plurality of word lines on the upper substrate extend in a first direction and a plurality of bit lines extend in a second direction. The nonvolatile memory device comprises a second semiconductor layer under the first semiconductor layer in a third direction perpendicular to the first and second directions, the second semiconductor layer including, a lower substrate, and a substrate control circuit on the lower substrate and configured to output a bias voltage to the upper substrate. The second semiconductor layer is divided into first through fourth regions, each of the first through fourth regions having an identical area, and the substrate control circuit overlaps at least a portion of the first through fourth regions in the third direction.

Performing refresh operation in a memory device is provided. A refresh operation without address rotation is performed in a cell array of the memory device. Performing the refresh operation without address rotation is repeated for a predetermined number of times. After repeating performing the refresh operation with address rotation for the predetermined number of times, a refresh operation with address rotation is performed in the cell array.

A memory controller includes an interface and a processor. The interface communicates with memory cells that store data in predefined Programming Voltages (PVs). The processor is configured to produce observation samples that each includes (i) a target sample read from a target memory cell in a target Word Line (WL), and (ii) neighbor samples read from neighbor memory cells. Based on the observation samples, the processor is further configured to jointly estimate Cross-Coupling Coefficients (CCFs), by searching for CCFs that aim to minimize a predefined function of distances calculated between transformed observation samples that have been transformed using the CCFs and combinations of PVs that are closest to the respective transformed observation samples, to apply, based on the CCFs, cross-coupling cancelation to readout samples retrieved from the memory cells to produce enhanced readout samples, and to perform a storage operation related to reading data, using the enhanced readout samples.

Described herein are embodiments related to first-pass continuous read level calibration (cRLC) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device then adjusts a read level threshold of the memory cell to be centered between a first programming distribution and a second programming distribution before the second programming pass of the programming operation is performed on the memory cell.

A bit line is pre-charged based on a clock signal internal to a bit line pre-charge circuit when a bit line pre-charge window is within a margin of a predetermined pre-charge window. A bit line is pre-charged based on a clock signal external to the bit line pre-charge circuit when the bit line pre-charge window is outside the margin of the predetermined pre-charge window.

A semiconductor device including an error amplifier configured to receive a voltage of an output node and a reference voltage, a flipped voltage follower (FVF) circuit configured to receive an output of the error amplifier and maintain the voltage of the output node at the reference voltage, and a bias current control circuit configured to receive first to third mode signals, control a magnitude of a bias current flowing through the FVF circuit based on the first to third mode signals, control the bias current of a first magnitude, based on the first mode signal, control the bias current of a second magnitude smaller than the first magnitude, based on the second mode signal, and control the bias current of a third magnitude smaller than the second magnitude, based on the third mode signal.

Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication. The device may transmit, from the first portion, a signal instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The signal may be provided at an ODT I/O terminal of the first portion coupled to an ODT I/O terminal of the second portion.

Systems, apparatuses, and methods related to a selectively operable memory device are described. An example method corresponding to a selectively operable memory device can include receiving, by a resistance variable memory device, a command to operate the resistance variable memory device in a first mode or a second mode and operating the resistance variable memory device in the first mode or the second mode based, at least in part, on the received command to perform, in the first mode, a read operation or a write operation, or both, or, in the second mode, a compute operation. The method can further include performing, using a processing unit resident on the resistance variable memory device, the compute operation, the testing operation, or both based, at least in part, on a determination that the resistance variable memory device is operating in the second mode.

Methods, systems, and devices for timing signal delay compensation in a memory device are described. In some memory devices, operations for accessing memory cells may be performed with timing that is asynchronous relative to an input signal. To support asynchronous timing, a memory device may include delay components that support generating a timing signal having aspects that are delayed relative to an input signal. In accordance with examples as disclosed herein, a memory device may include delay components having a variable and configurable impedance, where the configurable impedance may be based at least in part on a configuration signal generated at the memory device. A configuration signal may be generated based on fabrication characteristics of the memory device, or based on operating conditions of the memory device, or various combinations thereof.