G11C7/222

SIGNAL GENERATOR AND MEMORY

The signal generator includes the following: an oscillation generation circuit, configured to generate an initial oscillation signal based on an oscillation control signal; a duty cycle correction circuit, connected to an output end of the oscillation generation circuit and configured to adjust a duty cycle of the initial oscillation signal based on a duty cycle control signal, to generate an adjusted oscillation signal; an output interface, connected to an output end of the duty cycle correction circuit and configured to output the adjusted oscillation signal to an external test system; and an amplitude adjustment circuit, connected to the output end of the duty cycle correction circuit and configured to adjust an amplitude of the adjusted oscillation signal based on an amplitude control signal, to generate a test signal.

CLOCK CIRCUIT, MEMORY AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
20230028479 · 2023-01-26 · ·

A clock circuit includes at least two first driving circuits and a plurality of discrete first wires located between adjacent first driving circuits, the adjacent first driving circuits are connected through at least one first wire and at least two second wires, the first driving circuits are connected with the second wires, all of the first wires connected between two second wires are connected in series with each other, the first wires are located on a first metal layer, the second wires are located on a second metal layer, and the second metal layer is above the first metal layer.

COMMAND DECODER CIRCUIT, MEMORY, AND ELECTRONIC DEVICE
20230021725 · 2023-01-26 ·

A command decoder circuit, a memory, and an electronic device are provided. The circuit includes a first decoder unit, configured to perform decoding for a first command signal based on a dynamic clock signal; a second decoder unit, configured to perform decoding for a second command signal based on the dynamic clock signal; and the clock gate, configured to generate the dynamic clock signal after a chip select signal of the first decoder unit indicates that decoding to be started for the first command signal and before the second decoder unit has performed decoding for the second command signal, and cut off the dynamic clock signal before the chip select signal of the first decoder unit indicates that the decoding to be started for the first command signal or after the second decoder unit has performed decoding for the second command signal.

SEMICONDUCTOR MEMORY DEVICE

A semiconductor memory device includes: first pad transmitting and receiving first timing signal; second pad transmitting and receiving data signal in response to the first timing signal; third pad receiving second timing signal; fourth pad receiving control information in response to the second timing signal; memory cell array; sense amplifier connected to the memory cell array; first register connected to the sense amplifier; second register storing first control information; third register storing second control information; and control circuit executing data-out operation. The first control information is stored in the second register based on an input to the fourth pad in response to the second timing signal consisting of i cycles, and the second control information is stored in the third register based on an input to the fourth pad in response to the second timing signal consisting of j cycles.

MEMORY DEVICE AND OPERATING METHOD OF THE MEMORY DEVICE
20230024668 · 2023-01-26 · ·

A memory device including a plurality of memory cells, a peripheral circuit, and control logic. The peripheral circuit is configured to generate a plurality of operating voltages used in a memory operation, based on a target pump clock, and perform the memory operation by using the plurality of operating voltages. The control logic is configured to select the target pump clock among a plurality of pump clocks, based on a number of data bits which selected memory cells on which the memory operation is to be performed among the plurality of memory cells store, and control the peripheral circuit to perform the memory operation on the selected memory cells.

Semiconductor device
11562775 · 2023-01-24 · ·

A semiconductor device including a FIFO circuit in which a data capacity can be increased while minimizing an increase in a circuit scale is provided. The semiconductor device includes a single-port type storage unit (11) which stores data, a flip-flop (12) which temporarily stores write data (FIFO input) or read data (FIFO output) of the storage unit (11), and a control unit (14, 40) which controls a write timing of a data signal, which is stored in the flip-flop (12), to the storage unit (11) or a read timing of the data signal from the storage unit to avoid an overlap between a write operation and a read operation in the storage unit (11).

Memory device and memory system including the same

A memory device includes a memory cell array configured to store data; and a data output circuit configured to transmit status data to an external device through at least one data line in a latency period in response to a read enable signal received from the external device and transmit the data read from the memory cell array to the external device through the at least one data line in a period subsequent to the latency period.

Semiconductor device, semiconductor system including the same and operating method for a semiconductor system
11705179 · 2023-07-18 · ·

A semiconductor device includes a monitoring circuit suitable for generating a monitoring signal indicating whether a speed of a memory clock signal is changed based on a speed information signal representing speed information of the memory clock signal; a cycle control circuit suitable for generating a refresh cycle control signal for controlling a refresh cycle based on a system clock signal, the memory clock signal, the monitoring signal and a refresh flag signal; and a control circuit suitable for generating the memory clock signal and the refresh flag signal based on the speed information signal, the system clock signal and the refresh cycle control signal.

Memory devices with low pin count interfaces, and corresponding methods and systems

A method can include, in an integrated circuit device: at a unidirectional command-address (CA) bus having no more than four parallel inputs, receiving a sequence of no less than three command value portions; latching each command value portion in synchronism with rising edges of a timing clock; determining an input command from the sequence of no less than three command value portions; executing the input command in the integrated circuit device; and on a bi-directional data bus having no more than six data input/outputs (IOs), outputting and inputting sequences of data values in synchronism with rising and falling edges of the timing clock. Corresponding devices and systems are also disclosed.

Shared decoder circuit and method

A circuit includes a plurality of registers, each register including SRAM cells, a read port configured to receive a read address, a write port configured to receive a write address, a selection circuit, a latch circuit, and a decoder coupled in series between the read and write ports and the plurality of registers, and a control circuit. Responsive to a clock signal and read and write enable signals, the control circuit causes the selection circuit, the latch circuit, and the decoder to select a first register of the plurality of registers in a read operation based on the read address, and select a second register of the plurality of registers in a write operation based on the write address.