An Integrated Circuit (IC) includes a memory, circuit interconnections and control logic. The memory includes multiple standard-library Static Random Access Memory (SRAM) cells disposed on a substrate of the IC in multiple first layers, so that access to a respective SRAM cell to read and write data is through a cell-interface. The circuit interconnections, fabricated in one or more second layers separate from the first layers, interconnect cell-interfaces of a subgroup of the SRAM cells to form a ring oscillator that includes a cascade of N stages defined by the interconnected SRAM cells. The control logic is coupled to the cell-interfaces via the circuit interconnections, and is configured to apply an input signal to one or more of the cell-interfaces so as to trigger an oscillation of the ring oscillator whose frequency of oscillation is indicative of a speed of the SRAM cells of the memory.

Systems, devices, and methods related to reset read are described. A reset read may be employed to initiate a transition of a portion of memory array into a first state or maintain a portion of memory array in a first state, such as a transient state. A reset read may provide a highly-parallelized, energy-efficient option to ensure memory blocks are in the first state. Various modes of reset read may be configured according to different input.

An integrated circuit for storing data comprises a memory cell array comprising a plurality of bit cells (BC1, . . . , BCn) comprising a first and a second one of the bit cells (BC1, BC2) having a static random access memory architecture. The first and the second bit cells (BC1, BC2) are coupled to a common wordline (WL_TOP) and are arranged in different columns (C1, C2) of the memory cell array (100). During a write access to the first bit cell (BC1), the first bit cell (BC1) undergoes a write operation, whereas the second bit cell (BC2) is a half-selected bit cell which undergoes a pseudo read operation. The integrated circuit uses a two-phase write scheme to improve the write-ability in low operating voltage environment.

A memory system includes a memory cell array and a controller coupled to the memory cell array. The controller is configured to control applying a first program voltage to a word line to program memory cells in the memory cell array, the memory cells being coupled to the word line, and in response to receiving a suspend command, control applying a positive bias discharge voltage to the word line when the first program voltage ramps down.

A first timing reference signal and a second timing reference signal are sent to a memory device. The second timing reference signal has approximately a quadrature phase relationship with respect to the first timing reference signal. A plurality of serial data patterns are received from the memory device. The transitions of the first timing reference and the second timing reference determining when transitions occur between the bits of the plurality of data patterns. Timing indicators associated with when received transitions occur between the bits of the plurality of data patterns are received from the memory device. The timing indicators are each measured using a single sampler. Based on the timing indicators, a first duty cycle adjustment for the first timing reference signal, a second duty cycle adjustment for the second timing reference signal, and a quadrature phase adjustment are determined and applied.

Embodiments herein relate to circuitry which allows data to be processed and written back within an SRAM device. In a toggle operation, a memory cell is read and the bit at the complementary output node of a sense amplifier is written back to the memory cell. In a copy operation, a memory cell is read and the bit at the primary output node of the sense amplifier is written to another memory cell in the column. In another aspect, logic operations such as AND, OR, majority, AND-OR, OR-AND, and associated inverse operations can be performed within the SRAM device. This can involve writing data to one or more control memory cells in the same column as the data memory cells involved in the logic operation, and setting the respective word lines to be active concurrently.

A memory device includes a memory array with memory cells arranged in rows and columns and with word lines and bit lines. A dummy structure includes a dummy row of dummy cells and a dummy word line. A first pre-charging stage biases a word line of the memory array. An output stage includes a plurality of sense amplifiers. Each sense amplifier generates a corresponding output signal representing a datum stored in a corresponding memory cell pre-charged by the first pre-charging stage. A second pre-charging stage biases the dummy word line simultaneously with the word line biased by the first pre-charging stage. The output stage includes an enable stage, which detects a state of complete pre-charging of an intermediate dummy cell.

In a flash semiconductor memory, sense and contiguous ECC coding operations are carried out over a range of V.sub.CC values without wasted time by allocating a predetermined number of clocks to the combined operations rather than to the individual operations and operating at higher frequency for high V.sub.CC values, and lower frequency for low V.sub.CC values.

An integrated circuit includes a memory cell array coupled to a bitline and a first wordline and a negative-type metal-oxide-semiconductors (NMOS) pull-down structure coupled to the bitline and PMOS transistors. The positive-type metal-oxide-semiconductors (PMOS) transistors may be coupled to a second wordline, where a logic value carried on the second wordline is based on a logic value carried on the first wordline, and the PMOS transistors are structured to pre-charge respective drains of the NMOS pull-down structure to a high logic value based on a low logic value carried on the second wordline. The NMOS pull-down structure may be structured to discharge the bitline based on a high logic value carried on the second wordline.

Disclosed herein is an electronic device including a bit line and a complementary bit line, first and second cross coupled inverters, a first pass gate coupled between the complementary bit line and the first inverter, and a second pass gate coupled between the bit line and the second inverter. The electronic device also includes third and fourth cross coupled inverters, a third pass gate coupled between the complementary bit line and the third inverter, and a fourth pass gate coupled between the bit line and the fourth inverter. The first, second, and fourth inverters are powered between a supply node and a reference node, and the third inverter is powered between a floating node and the reference node. The first pass gate and third pass gate are coupled in parallel.