A memory device includes a first interconnect extending in a first direction, a second interconnect extending in a second direction crossing the first direction, a third interconnect extending in a third direction crossing a plane including the first direction and the second direction, a fourth interconnect extending in the third direction, a semiconductor member, a first resistance change film, and a second resistance change film. The semiconductor member is connected between a first end of the second interconnect and the first interconnect. The first resistance change film is connected between a side surface of the second interconnect and the third interconnect. The second resistance change film is connected between a second end of the second interconnect and the fourth interconnect.

According to one embodiment, a resistance-change memory includes a memory cell and a control circuit. The memory cell comprises first and second electrodes, and a variable resistance layer disposed between the first electrode and the second electrode. The control circuit applies a voltage between the first electrode and the second electrode to perform writing, erasing, and reading. During the writing, the control circuit applies a first voltage pulse between the first electrode and the second electrode, and then applies a second voltage pulse different in polarity from the first voltage pulse after applying the first voltage pulse.

A memory device includes a first interconnect extending in a first direction, a second interconnect extending in a second direction crossing the first direction, a third interconnect extending in a third direction crossing a plane including the first direction and the second direction, a fourth interconnect extending in the third direction, a semiconductor member, a first resistance change film, and a second resistance change film. The semiconductor member is connected between a first end of the second interconnect and the first interconnect. The first resistance change film is connected between a side surface of the second interconnect and the third interconnect. The second resistance change film is connected between a second end of the second interconnect and the fourth interconnect.

Memory sense amplifiers and memory verification methods are described. According to one aspect, a memory sense amplifier includes a first input coupled with a memory element of a memory cell, wherein the memory element has different memory states at different moments in time, a second input configured to receive a reference signal, modification circuitry configured to provide a data signal at the first input from the memory element having a plurality of different voltages corresponding to respective ones of different memory states of the memory cell at the different moments in time, and comparison circuitry coupled with the modification circuitry and configured to compare the data signal and the reference signal at the different moments in time and to provide an output signal indicative of the memory state of the memory cell at the different moments in time as a result of the comparison to implement a plurality of verify operations of the memory states of the memory cell at the different moments in time.

A device for performing a multiplication of a matrix with a vector. The device comprises a plurality of memory elements, a signal generator and a readout circuit. The signal generator is configured to apply programming signals to the memory elements. The signal generator is further configured to control a first signal parameter of the programming signals in dependence on matrix elements of the matrix and to control a second signal parameter of the programming signals in dependence on vector elements of the vector. The readout circuit is configured to read out memory values of the memory elements. The memory values represent result values of vector elements of a product vector of the multiplication. The memory elements may be in particular resistive memory elements or photonic memory elements. Additionally there is provided a related method and design structure for performing the multiplication of a matrix with a vector.

A programming method of a memory device comprising a multi-level cell is introduced. The programming method includes applying a sequence of program pulses comprising at least one set pulse and at least one reset pulse to the multi-level cell; determining whether the resistance of the multi-level cell is in a target range after each program pulse of the sequence of program pulses is applied to the multi-level cell; keeping applying the sequence of program pulses to the multi-level cell in response to determining that the resistance of the multi-level cell is not in the target range; and stopping applying the sequence of program pulses to the multi-level cell in response to determining that the resistance of the multi-level cell is in the target range.

A three-dimensional array especially adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.

A memory system according to the embodiment comprises a cell array of plural cells having three or more settable physical quantity levels and operative to store a code composed of symbols expressed by elements in a finite field Zp (p is a prime), wherein a set of two cells is defined as a pair cell and a combination of physical quantity levels of the two cells contained in the pair cell is defined as a pair cell level, wherein the pair cell uses a pair cell level of plural pair cell levels, which maximizes or minimizes a physical quantity level of one cell contained in the pair cell, to assign elements in the Zp to the pair cell levels, thereby storing symbols of the code.

A method is disclosed for operating a Conductive Bridge Random Access Memory (CBRAM) device that includes an electrolyte element sandwiched between a cation supply top electrode and a bottom electrode. The method comprises conditioning the CBRAM device by applying a forming current pulse having a pulse width (t.sub.f) of 100 ns or less and a pulse amplitude (I.sub.f) of 10 uA or less, and when programming, setting the conditioned CBRAM device to a Low Resistance State (LRS) by applying a set current pulse having a pulse width (t.sub.s) of 100 ns or less and a pulse amplitude (I.sub.s) equal to or larger than the forming current pulse amplitude (I.sub.f).

A method of reading a memory device that includes a memory cell that stores data of at least two bits includes determining whether a cell resistance level is no greater than a threshold resistance level. If the cell resistance level is smaller than or equal to the threshold resistance level, then the data is read based on a first factor that is inversely proportional to the cell resistance level. If the cell resistance level is greater than the threshold resistance level, then the data is read based on a second factor that is proportional to the cell resistance level.