A flash memory method includes: classifying data into a plurality of groups of data; respectively executing error code encoding to generate first corresponding parity check code to store the groups of data and first corresponding parity check code into flash memory module as first blocks; reading out the groups of data from first blocks; executing error correction and de-randomize operation upon read out data to generate de-randomized data; executing randomize operation upon de-randomized data according to a set of seeds to generate randomized data; performing error code encoding upon randomized data to generate second corresponding parity check code; and, storing randomized data and second corresponding parity check code into flash memory module as second block; a cell of first block is used for storing data of first bit number which is different from second bit number corresponding to a cell of second block.

In certain aspects, a circuit includes a page buffer including a plurality of portions, a clock path coupled to the plurality of portions of the page buffer, and a clock level set module coupled to the page buffer. Each of the portions is configured to sequentially receive a clock signal, and sequentially return a clock return signal in response to receiving the corresponding clock signal. The clock path is configured to merge the plurality of clock return signals. The clock level set module is configured to set a start level of a first clock return signal of the plurality of clock return signals based on a number of cycles in a first clock signal of the plurality of clock signals. The first clock return signal corresponds to the first clock signal.

The application provides a Content Addressable Memory (CAM) cell, a CAM memory device and an operation method thereof. The CAM cell includes: a plurality of parallel-coupled flash memory cells: wherein a storage data of the CAM cell is based on a combination of a plurality of threshold voltages of the parallel-coupled flash memory cells.

A memory device according to one embodiment includes a memory cell array, bit lines, amplifier units, a controller, and a register. The memory cell array includes a memory cell that stores data nonvolatilely. The bit lines are connected to the memory cell array. The sense amplifier units are connected to the bit lines, respectively. The controller performs a write operation. The register stores status information of the write operation. The memory cell array includes a first storage region specified by a first address. The plurality of sense amplifier modules include a buffer region capable of storing data.

Embodiments of three-dimensional (3D) memory devices with a 3D NAND memory array having a plurality of pages, an on-die cache coupled to the memory array on a same chip and configured to cache a plurality of batches of program data between a host and the memory array, the on-die cache having SRAM cells, and a controller coupled to the on-die cache on the same chip. The controller is configured to check a status of an (N−2).sup.th batch of program data, N being an integer equal to or greater than 2, program an (N−1).sup.th batch of program data into respective pages in the 3D NAND memory array, and cache an N.sup.th batch of program data in respective space in the on-die cache as a backup copy of the N.sup.th batch of program data.

Systems and methods related to low power cryo-CMOS circuits with non-volatile threshold voltage offset compensation are provided. A system includes a plurality of devices configured to operate in a cryogenic environment, where a first distribution of a threshold voltage associated with the plurality of devices has a first value indicative of a measure of spread of the threshold voltage. The system further includes control logic, coupled to each of the plurality of devices, configured to modify a threshold voltage associated with each of the plurality of devices such that the first distribution is changed to a second distribution having a second value of the measure of spread of the threshold voltage representing a lower variation among threshold voltages of the plurality of devices.

The non-volatile memory includes a control circuitry that is communicatively coupled to an array of memory cells that are arranged word lines. The control circuitry is configured to program the memory cells using a multi-pass programming operation which includes a first pass and a second pass. The first pass programs the memory cells to a first number of data states, and the second pass programs the memory cells to a greater second number of data states. For at least one word line, during the second pass, a voltage that is applied to at least one memory cell is reduced from a verify voltage by an offset which is determined as a function of a data state of an adjacent memory cell of an adjacent word line and wherein the first pass but not the second pass has been completed in the adjacent word line.

According to one embodiment, a memory system includes a semiconductor memory and a controller. The memory system is capable of executing a first operation and a second operation. In the first operation, the controller issues a first command sequence, the semiconductor memory applies a first voltage to a first word line and applies a second voltage to a second word line to read data from the first memory, and the read data is transmitted to the controller from the semiconductor memory. In the second operation, the controller issues a second command sequence, the semiconductor memory applies a third voltage to the first word line and applies a fourth voltage to the second word line, and data held in the memory cell array is left untransmitted to the controller.

Dual-precision analog memory cells and arrays are provided. In some embodiments, a memory cell, comprises a non-volatile memory element having an input terminal and at least one output terminal; and a volatile memory element having a plurality of input terminals and an output terminal, wherein the output terminal of the volatile memory element is coupled to the input terminal of the non-volatile memory element, and wherein the volatile memory element comprises: a first transistor coupled between a first supply and a common node, and a second transistor coupled between a second supply and the common node; wherein the common node is coupled to the output terminal of the volatile memory element; and wherein gates of the first and second transistors are coupled to respective ones of the plurality of input terminals of the volatile memory element.

Embodiments of bonded unified semiconductor chips and fabrication and operation methods thereof are disclosed. In an example, a method for forming a unified semiconductor chip is disclosed. A first semiconductor structure is formed. The first semiconductor structure includes one or more processors, an array of embedded DRAM cells, and a first bonding layer including a plurality of first bonding contacts. A second semiconductor structure is formed. The second semiconductor structure includes an array of NAND memory cells and a second bonding layer including a plurality of second bonding contacts. The first semiconductor structure and the second semiconductor structure are bonded in a face-to-face manner, such that the first bonding contacts are in contact with the second bonding contacts at a bonding interface.