G11C11/5621

3D SEMICONDUCTOR DEVICE AND STRUCTURE
20210375921 · 2021-12-02 · ·

A 3D device, the device including: a first level including logic circuits; and a second level including a plurality of memory cells, where the first level is bonded to the second level, where the bonded includes oxide to oxide bonds, and where the logic circuits include a programmable logic circuit.

MEMORY DEVICE AND METHOD OF OPERATING THE SAME
20220208289 · 2022-06-30 · ·

A memory device includes a memory cell array including a plurality of memory cells connected to a plurality of word lines. The memory device also includes a peripheral circuit configured to perform a plurality of program loops to program memory cells, among the plurality of memory cells, connected to a selected word line among the plurality of word lines. The memory device further includes control logic configured to control the peripheral circuit to set a step voltage based on the number of turned off memory cells among the selected memory cells and then apply a program voltage, to which the step voltage is added, to the selected word line in a next program loop, during a verify operation of a program operation and the verify operation included in each of the plurality of program loops.

Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same

Embodiments of semiconductor devices and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure including a processor, an array of static random-access memory (SRAM) cells, and a first bonding layer including a plurality of first bonding contacts. The semiconductor device also includes a second semiconductor structure including an array of NAND memory cells and a second bonding layer including a plurality of second bonding contacts. The semiconductor device further includes a bonding interface between the first bonding layer and the second bonding layer. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.

Memory system and method for read operation based on grouping of word lines

A memory system includes a memory device and a controller. The controller determines a target word line group to which a target word line corresponding to a read command belongs. The controller identifies a reference voltage corresponding to the target word line group. The controller controls the memory device to perform a read operation on a target page coupled to the target word line, using the reference voltage.

Bad block management for memory sub-systems
11367502 · 2022-06-21 · ·

A processing device in a memory system performs operations comprising determining a first pool of data blocks of the memory device, wherein data blocks of the first pool are associated with storing data at a first number of bits per memory cell; determining a second pool of data blocks of the memory device, wherein data blocks of the second pool are associated with storing data at a second number of bits per memory cell that is larger than the first number of bits per memory cell; detecting a failure associated with a particular data block of the second pool of data blocks; and in response to detecting the failure associated with the particular data block, removing the particular data block from the second pool of data blocks and adding the particular data block to the first pool of data blocks.

Low power cryo-CMOS circuits with non-volatile threshold voltage offset compensation

Systems and methods related to low power cryo-CMOS circuits with non-volatile threshold voltage offset compensation are provided. A system includes a plurality of devices configured to operate in a cryogenic environment, where a first distribution of a threshold voltage associated with the plurality of devices has a first value indicative of a measure of spread of the threshold voltage. The system further includes control logic, coupled to each of the plurality of devices, configured to modify a threshold voltage associated with each of the plurality of devices such that the first distribution is changed to a second distribution having a second value of the measure of spread of the threshold voltage representing a lower variation among threshold voltages of the plurality of devices.

NAND FLASH MEMORY WITH VERTICAL CELL STACK STRUCTURE AND METHOD FOR MANUFACTURING SAME
20230268447 · 2023-08-24 ·

Disclosed is a method of manufacturing flash memory with a vertical cell stack structure. The method includes forming source lines in a cell area of a substrate having an ion-implanted well and forming an alignment mark relative to the source lines. The alignment mark is formed in the substrate outside the cell area of the substrate. After formation of the source lines, cell stacking layers are formed. After forming the cell stacking layers, cell pillars in the cell stacking layers are formed at locations relative to the previously formed source lines using the alignment mark to correctly locate the cell pillars.

Block-on-block memory array architecture using bi-directional staircases
11335700 · 2022-05-17 · ·

A memory device stores data in non-volatile memory. The memory device includes a non-volatile memory array. The memory array includes tiers for accessing data stored in blocks of the memory array, including a block having a left block portion and a right block portion. A first staircase is positioned between the left block portion and the right block portion, and a bottom portion of the first staircase includes steps corresponding to first tiers of the left block portion. A second staircase is positioned between the left block portion and the right block portion, and a top portion of the second staircase includes steps corresponding to second tiers of the right block portion. The steps of the first staircase and the steps of the second staircase descend in opposite directions.

Calibrating pages of memory using partial page read operations

A computer-implemented method, according to one embodiment, is for calibrating read voltages for a block of memory. The computer-implemented method includes: determining a calibration read mode of the block, and using the calibration read mode to determine whether pages in the block should be read using full page read operations. In response to determining that the pages in the block should not be read using full page read operations, a current value of a partial page read indicator for the block is determined. The block is further calibrated by reading only a portion of each page in the block, where the current value of the partial page read indicator determines which portion of each respective page in the block is read. Moreover, the current value of the partial page read indicator is incremented.

Storage system and method for boundary wordline data retention handling

A storage system and method for boundary wordline data retention handling are provided. In one embodiment, the storage system includes a memory having a single-level cell (SLC) block and a multi-level cell (MLC) block. The system determines if the boundary wordline in the MLC block has a data retention problem (e.g., by determining how long it has been since the boundary wordline was programmed). To address the data retention problem, the storage system can copy data from a wordline in the SLC block that corresponds to the boundary wordline in the MLC block to a wordline in another SLC block prior to de-committing the data in the SLC block. Alternatively, the storage system can reprogram the data in the boundary wordline using a double fine programing technique.