Memories are provided. A memory includes a plurality of ferroelectric random access memory (FRAM) cells arranged in a first memory array, and a plurality of static random access memory (SRAM) cells arranged in a second memory array. There are more FRAM cells than SRAM cells. The first memory array and the second memory array share the same bus.

A depletion-mode FeFET (“FeDFET”) is programmable to a first programmed state, under a first set of voltage biasing conditions, and to a second programmed state, under a second set of voltage biasing conditions. In both the first and second programmed states, the storage transistor has a threshold voltage that is not greater than 0 volts. A memory circuit may be organized as memory cells, with each memory cell including select transistors, transistor switches and FeDFETs in a static random-access memory (SRAM) cell configuration.

A semiconductor circuit of the present disclosure includes: a first circuit that is configured to apply an inverted voltage of a voltage at a first node to a second node; a second circuit that is configured to apply an inverted voltage of a voltage at the second node to the first node; a first transistor that is configured to couple the first node to a third node to which a first memory element is coupled; a second transistor having a drain coupled to the third node and a gate coupled to a first predetermined node; a third transistor having a drain coupled to the third node and a gate coupled to a second predetermined node; a fourth transistor that is configured to couple the second node to a fourth node to which a second memory element is coupled; a fifth transistor having a drain coupled to the fourth node and a gate coupled to the second predetermined node; and a sixth transistor having a drain coupled to the fourth node and a gate coupled to the first predetermined node.

A semiconductor circuit of the present disclosure includes: a first circuit that is configured to apply an inverted voltage of a voltage at a first node to a second node; a second circuit that is configured to apply an inverted voltage of a voltage at the second node to the first node; a first transistor that is configured to couple the first node to a third node; a first memory element having a first terminal coupled to the third node and a second terminal to which a control voltage is to be applied; a second transistor having a source to which a first voltage is to be applied, a drain coupled to the third node, and a gate coupled to a first predetermined node being one of the first node and the second node; a third transistor having a source to which a second voltage is to be applied, a drain coupled to the third node, and a gate coupled to a second predetermined node being the other of the first node and the second node; and a driver.

A semiconductor circuit according to the disclosure includes a first circuit that can generate an inverted voltage of a voltage at a first-node and apply the inverted voltage to a second-node, a second circuit that can generate an inverted voltage of the voltage at the second-node and apply the inverted voltage to the first-node, a first transistor coupling the first-node to the third-node by turning on, a first storage element having a first terminal coupled to the third-node and a second terminal supplied with a control voltage and being able to take a first or second resistance state, a first voltage setting circuit that is coupled to the third-node and can set a voltage at the third-node to a voltage corresponding to a voltage at a predetermined node out of the first and second nodes, and a driver controlling an operation of the first transistor and setting the control voltage.

A semiconductor circuit includes a first circuit to apply an inverted voltage of a voltage at a first node to a second node, a second circuit to apply an inverted voltage of a voltage at the second node to the first node, a first transistor that includes a gate, a drain, and a source, and stores a threshold state, a second transistor that couples the first node to a first terminal by being turned on, a third transistor that couples a first predetermined node to the gate of the first transistor, and a driving section that controls operations of the second transistor and the third transistor, and applies a control voltage to a second terminal. The first terminal is one of the drain or the source of the first transistor. The second terminal is another of the drain or the source of the first transistor.

[Overview] [Problem to be Solved] To provide a non-volatile semiconductor memory that is capable of high-speed writing or reading and suitable for high-density integration. [Solution] A semiconductor device including: a first inverting circuit including n-type FET and p-type FET; a second inverting circuit including n-type FET and p-type FET; a first ferroelectric capacitor; a second ferroelectric capacitor; and a plate line. The second inverting circuit has an output coupled to an input of the first inverting circuit and has an input coupled to an output of the first inverting circuit. The first ferroelectric capacitor has one of electrodes coupled to the input of the first inverting circuit. The second ferroelectric capacitor has one of electrodes coupled to the input of the second inverting circuit. The plate line is coupled to another of the electrodes of the first ferroelectric capacitor and another of the electrodes of the second ferroelectric capacitor.

A memory circuit includes a memory cell and a source line transistor. The memory cell includes a first transistor, a second transistor, a third transistor, and a fourth transistor. The second transistor and the third transistor form an inverter electrically connected to a drain of the first transistor. The inverter is configured to store two states with different applied voltages. The fourth transistor is electrically connected to a node of the inverter. The source line transistor is electrically connected to the fourth transistor.

In one embodiment, a device is described for using ferroelectric material in a memory cell. In another embodiment, a method of operating a ferroelectric memory cell is described. Other embodiments are likewise described.

A random bit cell includes a latch, a voltage selector, a first non-volatile storage element, and a second non-volatile storage element. The latch has a first terminal coupled to a first local bit line, and a second terminal coupled to a second local bit line. The first non-volatile storage element has a first terminal coupled to the first local bit line, and a second terminal coupled to the voltage selector. The second non-volatile storage element has a first terminal coupled to the second local bit line, and a second terminal coupled to the voltage selector. During an initial operation, the first terminals of the first non-volatile storage element and the second non-volatile storage element are floating. During an enroll operation, the first terminals of the first non-volatile storage element and the second non-volatile storage element receive a program voltage from the voltage selector.