A memory controller configured to control a non-volatile memory device includes: a signal generator configured to generate a plurality of control signals comprising a first signal and a second control signal; a core configured to provide a command for an operation of the non-volatile device; and a controller interface circuit configured to interface with the non-volatile memory device, wherein the controller interface circuit comprises a first transmitter connected to a first signal line and a second signal line; and a first receiver connected to the first signal line, and the first control signal and the second control signal are respectively transmitted to the non-volatile memory device through the first signal line and the second signal line.

The present invention includes apparatus and a method for reading one or more data states from an integrated circuitry memory cell, including the steps of connecting the memory cell to a bit line which is connected to an amplifier having an offset control which introduces an offset during the sensing portion of a read cycle to identify a data state stored in the memory cell.

A semiconductor apparatus may include a repair circuit configured to activate a redundant line of a cell array region by comparing repair information and address information. The semiconductor apparatus may include a main decoder configured to perform a normal access to the cell array region by decoding the address information. The address information may include both column information and row information.

An electronic device includes a light-emitting element whose one end is connected to a first voltage source. A control circuit is connected between the other end of the light-emitting element and a host computer and controls the light-emitting element in accordance with a signal from the host computer. A resistance element is connected between a first connecting portion, which is located between the light-emitting element and the control circuit, and a reference potential source.

A signal generator includes a first amplifier for outputting an amplified voltage in response to a reference voltage and a feedback voltage, a divider circuit for dividing the amplified voltage to generate a divided voltage and the feedback voltage, and a buffer group for outputting a common sensing signal in response to the amplified voltage and outputting a sensing signal in response to the divided voltage, and a memory device including the signal generator.

A signal generator includes a first amplifier for outputting an amplified voltage in response to a reference voltage and a feedback voltage, a divider circuit for dividing the amplified voltage to generate a divided voltage and the feedback voltage, and a buffer group for outputting a common sensing signal in response to the amplified voltage and outputting a sensing signal in response to the divided voltage, and a memory device including the signal generator.

A memory device includes a memory cell array configured to store data, a control circuit configured to control the memory cell array in response to a command; and a receiver configured to be placed in an active state based on a first signal, a second signal, or an operation result of an address and the command, and be enabled to receive a command or data.

A memory device includes a memory cell array configured to store data, a control circuit configured to control the memory cell array in response to a command; and a receiver configured to be placed in an active state based on a first signal, a second signal, or an operation result of an address and the command, and be enabled to receive a command or data.

Embodiments of three-dimensional (3D) memory devices having a shielding layer and methods for forming the 3D memory devices are disclosed. In an example, a method for forming a 3D memory device is disclosed. A peripheral device is formed on a substrate. A first interconnect layer including a first plurality of interconnects is formed above the peripheral device. A shielding layer including a conduction region is formed above the first interconnect layer. A second interconnect layer including a second plurality of interconnects is formed above the shielding layer. The conduction region of the shielding layer covers an area of the first and second plurality of interconnects in the first and second interconnect layers. A plurality of memory strings each extending vertically above the second interconnect layer are formed.

Described are systems and methods for providing power loss immunity in memory programming operations. An example memory device comprises: a memory array comprising a plurality of memory cells electrically coupled to a plurality of wordlines and a plurality of bitlines; and a controller coupled to the memory array, the controller to perform operations comprising: causing a programming pulse to be applied to to one or more wordlines of the memory array; responsive to determining that a threshold voltage of one or more memory cells of the memory array has reached a pre-program verify level, causing a first bias voltage level to be applied to a first subset of bitlines of the memory array and causing a second bias voltage level to be applied to a second subset of bitlines of the memory array.