Patent classifications
G11C17/143
FUSE ARRAY AND MEMORY DEVICE
A fuse array and a memory device are provided in the invention. The fuse array includes a plurality of fuses and a plurality of first D flip-flops. The fuses are configured to generate a plurality of data signals. Each of the first D flip-flops is respectively coupled to one corresponding fuse of the fuses to receive the data signal from the corresponding fuse and the first D flip-flops transmit a clock signal and the data signal to a plurality of second D flip-flops comprised in a plurality of memory cells. The first D flip-flops are connected in series and the second D flip-flops are connected in series.
Image Storage with In-Situ Image-Searching Capabilities
A preferred image storage with in-situ image-searching capabilities comprises a plurality of storage-processing units (SPU), with each SPU comprising at least a three-dimensional memory (3D-M) array vertically stacked above a pattern-processing circuit. The 3D-M array stores at least a portion of image data from an image database. An image pattern from the input is sent to all SPUs, which perform pattern recognition simultaneously.
DELAY ELEMENTS FOR COMMAND TIMING IN A MEMORY DEVICE
A timing of an execution of a command in a memory device can be affected delay elements. The delay elements of a unit of delay elements can cause variable delays of the command paths. The delay elements can be activated based on settings stored in a fuse array of a memory device. The delay elements can be used to change a timing of current draw of the memory devices.
Light-erasable embedded memory device and method of manufacturing the same
A light-erasable embedded memory device and a method for manufacturing the same are provided in the present invention. The light-erasable embedded memory device includes a substrate with a memory region and a core circuit region, a floating gate on the memory region of the substrate, at least two light-absorbing films above the floating gate, wherein each light-absorbing film is provided with at least one dummy via hole overlapping the floating gate, and a dielectric layer on each light-absorbing film and filling up the dummy via holes.
ANTIFUSE ELEMENT USING SPACER BREAKDOWN
Techniques and circuitry are disclosed for efficiently implementing programmable memory array circuit architectures, including both non-volatile and volatile memories. The memory circuitry employs an antifuse scheme that includes an array of 1T bitcells, wherein each bitcell effectively contains one gate or transistor-like device that provides both an antifuse element and a selector device for that bitcell. In particular, the bitcell device has asymmetric trench-based source/drain contacts such that one contact forms a capacitor in conjunction with the spacer and gate metal, and the other contact forms a diode in conjunction with a doped diffusion area and the gate metal. The capacitor serves as the antifuse element of the bitcell, and can be programmed by breaking down the spacer. The diode effectively provides a Schottky junction that serves as a selector device which can eliminate program and read disturbs from bitcells sharing the same bitline/wordline.
Configurable Computing Array Based on Three-Dimensional Printed Memory
The present invention discloses a configurable computing array based on three-dimensional printed memory (3D-P). It comprises an array of configurable computing elements, an array of configurable logic elements and a plurality of configurable interconnects. Each configurable computing element can selectively realize a basic function in a math library. It comprises a plurality of 3D-P arrays storing the look-up tables (LUT) for the basic functions in the math library.
Memory device and semiconductor device including the same
A memory device is provided. The memory device includes a plurality of memory chips that are stacked, wherein each of the memory chips includes a memory cell array, which includes a plurality of memory cell rows, a chip identifier generator configured to generate a chip identifier signal indicating a chip identifier of each of the memory chips, a refresh counter configured to generate a target row address for refreshing the memory cell rows in response to a refresh command, and a refresh row address generator, which receives the chip identifier signal and the target row address and outputs one of the target row address and an inverted target row address, obtained by inverting the target row address, as a refresh row address based on the chip identifier signal, and performs a refresh operation on a memory cell row corresponding to the refresh row address.
Semiconductor device
The invention provides a semiconductor device which is non-volatile, easily manufactured, and can be additionally written. A semiconductor device of the invention includes a plurality of transistors, a conductive layer which functions as a source wiring or a drain wiring of the transistors, and a memory element which overlaps one of the plurality of transistors, and a conductive layer which functions as an antenna. The memory element includes a first conductive layer, an organic compound layer and a phase change layer, and a second conductive layer stacked in this order. The conductive layer which functions as an antenna and a conductive layer which functions as a source wiring or a drain wiring of the plurality of transistors are provided on the same layer.
Semiconductor apparatus and repair method thereof
A semiconductor apparatus includes a memory region; a fuse array including a plurality of fuse groups, each fuse group being configured to store a failed address of the memory region; a remaining-fuse information storage unit configured to store remaining-fuse information on a fuse group that includes a fuse corresponding to the failed address among the plurality of fuse groups; and a control unit configured to perform a control operation for updating the remaining-fuse information for the fuse group that includes a fuse corresponding to the failed address among the plurality of fuse groups and for storing the failed address when the failed address is detected.
Configurable gate array based on three-dimensional printed memory
The present invention discloses a configurable gate array based on three-dimensional printed memory (3D-P). It comprises an array of configurable computing elements, an array of configurable logic elements and a plurality of configurable interconnects. Each configurable computing element can selectively realize a math function from a math library. It comprises a plurality of 3D-P arrays storing the look-up tables (LUT) for the math functions in the math library.