A one-time write, read-only memory for storing trimming parameters includes an address pointer table, a fixed packet portion, and a flexible packet portion. The fixed packet portion includes one or more fixed packets, each fixed packet including trimming parameters for a component identified for trimming during a design phase. The flexible packet portion includes one or more flexible packets of different types. Each flexible packet includes trimming parameters for a component identified for trimming after the design phase. One packet type includes a length section and a number of fields equal to a value stored in the length section. Each field includes an address, a trimming parameter, and a mask. Another packet type includes trimming parameters associated with operands in operating instructions for a microcontroller, where the operands include an address and a mask.

In a method of forming a one-time-programming (OTP) bit, a thin-film memory device is provided, which includes at least one memory element and a transistor, and the memory element is coupled to the transistor in series. Then, an alternating current is applied to the memory element and the transistor, the power applied to the memory element is constrained, and the transistor is turned on to change the resistance of the memory element for a plurality of cycles of the alternating current until the resistance of the memory element is irreversibly changed.

A semiconductor structure includes a first processor on a first die of a substrate. There is a second processor on a second die of the substrate. There is a one-time programmable (OTP) memory programming circuit, outside of the first and second die, and shared by the first and second processors. Each of the first and second processors include a one-time programmable (OTP) memory. The OTP memory programming circuit is configured to program each OTP memory.

A memory device, includes: a memory array comprising a plurality of bit cells arranged along a plurality of rows and along a plurality of columns, respectively; and a control logic circuit coupled to the memory array, and configured to determine respective locations of a first plurality of diagonal bit cells of the memory array for testing one or more peripheral circuits coupled to the memory array, wherein the control logic circuit is further configured to determine respective locations of at least a second plurality of diagonal bit cells of the memory array for testing the one or more peripheral circuits, wherein a number of the plurality of rows is different than a number of the plurality of columns and the first plurality of diagonal bit cells span a first equal number of rows and columns and the second plurality of diagonal bit cells also span a second equal number of rows and columns.

A storage device includes a basic memory to store a message received from an external device, a security memory to store an authentication key for authenticating the message, a controller to output a control signal, and a security engine to obtain the authentication key from the security memory with an authority to access the security memory in response to the control signal from the controller and to block an access of the controller to the security memory.

A one-time write, read-only memory for storing trimming parameters includes an address pointer table, a fixed packet portion, and a flexible packet portion. The fixed packet portion includes one or more fixed packets, each fixed packet including trimming parameters for a component identified for trimming during a design phase. The flexible packet portion includes one or more flexible packets of different types. Each flexible packet includes trimming parameters for a component identified for trimming after the design phase. One packet type includes a length section and a number of fields equal to a value stored in the length section. Each field includes an address, a trimming parameter, and a mask. Another packet type includes trimming parameters associated with operands in operating instructions for a microcontroller, where the operands include an address and a mask.

A semiconductor system according to an embodiment includes: a semiconductor system including a normal memory cell array and a redundancy memory cell array for repairing a defective cell among memory cells within the normal memory cell array, and configured to output to an external a fail flag generated according to a number of fail bits within read data output from the redundancy memory cell array; and a host configured to store an address corresponding to the read data into a selected register group from among a plurality of register groups, the selected register group being matched to the fail flag.

According to one embodiment, a semiconductor storage device includes a first wiring, a first resistance change element which is connected to the first wiring, a first nonlinear element which is connected to the first resistance change element, and a second wiring which is connected to the first nonlinear element. In a read operation for the first resistance change element, a voltage between the first wiring and the second wiring increases to a first voltage, and after the voltage between the first wiring and the second wiring increases to the first voltage, the voltage between the first wiring and the second wiring increases to a second voltage which is larger than the first voltage.

A one-time write, read-only memory for storing trimming parameters includes an address pointer table, a fixed packet portion, and a flexible packet portion. The fixed packet portion includes one or more fixed packets, each fixed packet including trimming parameters for a component identified for trimming during a design phase. The flexible packet portion includes one or more flexible packets of different types. Each flexible packet includes trimming parameters for a component identified for trimming after the design phase. One packet type includes a length section and a number of fields equal to a value stored in the length section. Each field includes an address, a trimming parameter, and a mask. Another packet type includes trimming parameters associated with operands in operating instructions for a microcontroller, where the operands include an address and a mask.

A semiconductor structure includes a first processor on a first die of a substrate. There is a second processor on a second die of the substrate. There is a one-time programmable (OTP) memory programming circuit, outside of the first and second die, and shared by the first and second processors. Each of the first and second processors include a one-time programmable (OTP) memory. The OTP memory programming circuit is configured to program each OTP memory.