A memory device, includes: a memory array comprising a plurality of bit cells arranged along a plurality of rows and along a plurality of columns, respectively; and a control logic circuit coupled to the memory array, and configured to determine respective locations of a first plurality of diagonal bit cells of the memory array for testing one or more peripheral circuits coupled to the memory array, wherein the control logic circuit is further configured to determine respective locations of at least a second plurality of diagonal bit cells of the memory array for testing the one or more peripheral circuits, wherein a number of the plurality of rows is different than a number of the plurality of columns and the first plurality of diagonal bit cells span a first equal number of rows and columns and the second plurality of diagonal bit cells also span a second equal number of rows and columns.

A device, including: an unsecure non-volatile memory; a secure device including: a processor; and a secure non-volatile memory; wherein the secure device is configured to: calculate a TMC value from an offset and a base value; store a TMC version value in the secure non-volatile memory and the insecure non-volatile memory, wherein the TMC version value is updated when TMC value is incremented the first time after the secure device is powered up; store the base value in the unsecure non-volatile memory; store the offset value in the unsecure non-volatile memory when the secure device is in a system power down state; store the offset value in the secure non-volatile memory when the secure device is in a rescue state; and store a TMC link value in the unsecure memory, wherein the TMC link value is based upon the base value and TMC version value stored in the unsecure memory.

A one-time write, read-only memory for storing trimming parameters includes an address pointer table, a fixed packet portion, and a flexible packet portion. The fixed packet portion includes one or more fixed packets, each fixed packet including trimming parameters for a component identified for trimming during a design phase. The flexible packet portion includes one or more flexible packets of different types. Each flexible packet includes trimming parameters for a component identified for trimming after the design phase. One packet type includes a length section and a number of fields equal to a value stored in the length section. Each field includes an address, a trimming parameter, and a mask. Another packet type includes trimming parameters associated with operands in operating instructions for a microcontroller, where the operands include an address and a mask.

A memory device, includes: a memory array comprising a plurality of bit cells arranged along a plurality of rows and along a plurality of columns, respectively; and a control logic circuit coupled to the memory array, and configured to determine respective locations of a first plurality of diagonal bit cells of the memory array for testing one or more peripheral circuits coupled to the memory array, wherein the control logic circuit is further configured to determine respective locations of at least a second plurality of diagonal bit cells of the memory array for testing the one or more peripheral circuits, wherein a number of the plurality of rows is different than a number of the plurality of columns and the first plurality of diagonal bit cells span a first equal number of rows and columns and the second plurality of diagonal bit cells also span a second equal number of rows and columns.

Gate oxide breakdown in the programming element of an OTP (One-Time Programmable) memory cell can vary widely. The resulting large variations in the conductivity of the programmed memory cells in an OTP memory cell array is used for a PUF (Physically Unclonable Function). A method of obtaining a PUF value from an OTP memory cell array is described.

A one-time programmable (OTP) memory device includes an access transistor, a word line, a voltage line, a well, a first filling oxide layer, a first semiconductor layer, and a bit line. The access transistor includes a gate structure on a substrate, and first and second impurity regions at portions of the substrate adjacent to the gate structure. The word line is electrically connected to the gate structure. The voltage line is electrically connected to the first impurity region. The well is formed at an upper portion of the substrate, and is doped with impurities having a first conductivity type. The first filling oxide layer is formed on the well. The first semiconductor layer is formed on the first filling oxide layer, and is doped with impurities having the first conductivity type and electrically connected to the second impurity region. The bit line is electrically connected to the well.

A semiconductor apparatus includes a transistor connected to a first potential terminal having a first potential, an anti-fuse element connected between the transistor and a second potential terminal having a second potential, a resistive element connected in parallel with the anti-fuse element between the transistor and the second potential terminal, and a temperature adjustment unit disposed to face the resistive element.

A memory device includes: a memory array comprising a plurality of bit cells arranged along a plurality of rows and along a plurality of columns, respectively; a plurality of row circuits respectively arranged along the plurality of rows; a plurality of column circuits respectively arranged along the plurality of columns; and a control logic circuit coupled to the memory array, and configured to determine respective locations of a first plurality of diagonal bit cells of the memory array for testing the pluralities of the row and column circuits.

Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as a volatile memory by erasing or degrading data in the event of a changed power condition such as a power-loss event, a power-off event, or a power-on event. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to detect a changed power condition of the memory device, and to erase or degrade data at the one or more addresses in response to detecting the changed power condition.

A memory system comprising: a memory cell. The memory cell comprising a poly-fuse-resistor; and a bipolar junction transistor having a collector-emitter channel and a base-terminal. The collector-emitter channel of the bipolar junction transistor is connected in series with the poly-fuse resistor between a supply-voltage-terminal and a ground-terminal. The base-terminal of the bipolar junction transistor is configured to receive a transistor-control-signal to selectively control a current flow through the poly-fuse-resistor.