A device may include a first die having a first circuit and a second die having a second circuit. The die may be separated by a material layer. The material layer may include multiple through-silicon vias (TSVs) for electrically coupling the first die to the second die. A first TSV of the TSVs may electrically couple the first circuit to the second circuit and a second TSV of the TSVs may include a redundant TSV that electrically bypasses the first TSV to couple the first circuit to the second circuit if a fault is detected in the first TSV.

A memory device and a method of correcting error in a memory device is provided. The memory device controller includes a memory array, a tie-breaker array, a write controller, a verify circuit, and a controller. The memory array includes a plurality of memory cells. The tie-breaker array includes a plurality of tie-breaker rows. The write controller is configured to apply a programming voltage to the memory array. The verify circuit is configured to apply a verify voltage to verify whether the memory cells in the memory array are in an unambiguous state or not. The controller is configured to enable one or more tie-breaker rows in additions to the memory array to adjust an output of the memory array when the memory cells in the memory array are in an ambiguous state.

A memory device includes a memory array and control logic, operatively coupled with the memory array, to perform operations including causing a first current to be obtained with respect to cells of a wordline maintained at a first voltage, determining that the cells are at a second voltage lower than the first voltage, in response to determining that the cells are the second voltage, causing a voltage ramp down process to be initiated, causing a second current to be sampled with respect to the cells during the voltage ramp down process, and detecting an existence of charge loss by determining whether the second current satisfies a threshold condition in view of the first current.

A storage circuit includes: the array of a memory cell MC including a variable-resistance element; a conversion circuit that converts the resistance value of each memory cell into the signal level of an electric signal; a reference signal generation circuit that generates a reference signal common to a plurality of columns; a correction circuit that corrects one of the signal level of the reference signal and the signal level of the electric signal for each column of the array of the memory cell; and an RW circuit that determines data stored in the memory cell belonging to a corresponding column by comparing one of the reference level and the signal level of the electric signal, corrected by the correction circuit, and the other of the reference level and the signal level of the electric signal.

A method and system provides for execution of calibration cycles from time to time during normal operation of the communication channel. A calibration cycle includes de-coupling the normal data source from the transmitter and supplying a calibration pattern in its place. The calibration pattern is received from the communication link using the receiver on the second component. A calibrated value of a parameter of the communication channel is determined in response to the received calibration pattern. The steps involved in calibration cycles can be reordered to account for utilization patterns of the communication channel. For bidirectional links, calibration cycles are executed which include the step of storing received calibration patterns on the second component, and retransmitting such calibration patterns back to the first component for use in adjusting parameters of the channel at first component.

A method for obtaining circuit noise parameters and an electronic device are provided. The method includes: determining a plurality of circuits to be tested, where each circuit includes one or more signal lines, and each circuit has at least one operating state; obtaining a parasitic capacitance between each signal line and all others signal lines, and determining a logic state of each signal line under each of the operating states; determining a plurality of operating state combinations for the plurality of circuits to be tested, and determining one target operating state combination from the plurality of operating state combinations; and under the target operating state combination, determining noise parameters of each one of the signal lines to be tested according to the logic state of each one of the signal lines to be tested and the parasitic capacitance.

The present application provides a memory test circuit and a device wafer including the memory test circuit. The memory test circuit is coupled to a memory array having intersecting first and second signal lines, and includes a fuse element and a transistor. The fuse element has a first terminal coupled to a first group of the first signal lines and a test voltage, and has a second terminal coupled to second and third groups of the first signal lines. The transistor has a source/drain terminal coupled to the second terminal of the fuse element and another source/drain terminal coupled to a reference voltage. The first group of the first signal lines are selectively coupled to the test voltage when the transistor is turned on, and all of the first signal lines are coupled to the test voltage when the transistor is kept off.

The present disclosure provides a method for detecting a memory and a device for detecting a memory. The memory includes first memory cells, second memory cells, bit lines, complementary bit lines, word lines, and a plurality of sense amplifiers, where each of the sense amplifiers is electrically coupled to a bit line and a complementary bit line; and the method includes: writing storage data into each of the first memory cells and each of the second memory cells; performing a read operation; obtaining a test result based on a difference between real data and the storage data; and obtaining a leakage position of the bit line and the word line or a leakage position the complementary bit line and the word line based on the test result.

A word line control method, a word line control circuit device, and a semiconductor memory are provided. The method includes: acquiring a row address input signal; acquiring a test mode signal; performing logical and decoding operations on the row address input signal and the test mode signal to generate a row address control signal, wherein the row address control signal includes at least two valid activation signals; and simultaneously activating at least two non-adjacent word lines based on the at least two valid activation signals. The row address control signal obtained allows simultaneous activation of at least two non-adjacent word lines. Since none of any two non-adjacent word lines share a common contact area, a test will not be affected by the disconnection of a contact area or the presence of high impedance, thus improving test accuracy.

Disclosed is an operation method of a memory device which includes floating a first driving line corresponding to a first word line from the first word line and precharging the first driving line with a first voltage, floating the first driving line from the first voltage to sense a first voltage variation of the first driving line, storing the first voltage variation in a first capacitor, electrically connecting the first driving line to the first word line and precharging the first driving line and the first word line with the first voltage, floating the first driving line and the first word line from the first voltage to sense a second voltage variation of the first driving line and the first word line, and outputting a first detection signal corresponding to a first leakage current through the first word line based on the first voltage variation and the second voltage variation.