Disclosed herein is a semiconductor device including a non-volatile memory unit. The non-volatile memory unit has a subject current path disposed in a semiconductor integrated circuit and a fuse element inserted in series on the subject current path, and changes output data according to a voltage between both ends of the fuse element when supply of a subject current to the subject current path is intended. A current supply part that switches the subject current between a plurality of stages is disposed in the non-volatile memory unit.

Embodiments of the present disclosure provide a method and an apparatus of testing a word line. After repair of a memory array is completed, if a target word line in a failure state exists in the memory array, a second numerical value is written into the target word line, and then it is determined, according to a numerical value outputted by each word line in the memory array, whether there are at least two word lines in an on-state in the memory array; if there are at least two word lines in an on-state simultaneously in the memory array, a current value generated by the target word line in an on-to-off process is detected; when the current value generated by the target word line in the on-to-off process is greater than a preset current threshold, it is determined that the target word line has a repair fault.

Fuse logic is configured to selectively enable certain group of fuses of a fuse array to support one of column (or row) redundancy in one application or error correction code (ECC) operations in another application. For example, the fuse logic may decode the group of fuses to enable a replacement column (or row) of memory cells in one mode or application, and decodes a subset of the group of fuses to retrieve ECC data corresponding to a second group of fuses are encoded to enable a different replacement column or row of memory cells in a second mode or application. The fuse logic includes an ECC decode logic circuit that is selectively enabled to detect and correct errors in data encoded in the second group of fuses based on the ECC data encoded in the subset of fuses of the first group of fuses.

A semiconductor device structure is provided. The semiconductor device structure includes a plurality of fuse elements, a reference resistor unit, a first conductive terminal, a first switching circuit, and a second switching circuit. Each of the plurality of fuse elements has a first terminal and a second terminal. The reference resistor unit is configured to receive a first power signal and electrically couple with the first terminal of each of the plurality of fuse elements. The first conductive terminal is configured to receive a second power signal and is electrically connected to the second terminal of each of the plurality of fuse elements.

A semiconductor device includes a flag generation circuit configured to receive region fuse data and used fuse data which are generated from a fuse set selected based on a fuse set selection signal among from fuse sets and generate a bank resource flag to control a repair operation for a bank on which a repair operation has not been performed, based on the region fuse data and the used fuse data. The semiconductor device also includes a repair control circuit configured to control the repair operation for banks sharing the fuse sets based on the bank resource flag.

An integrated circuit includes a TSV extending from a first surface of a semiconductor substrate to a second surface of the semiconductor substrate and having a first end and a second end, and a non-volatile repair circuit. The non-volatile repair circuit includes a one-time programmable (OTP) element having a programming terminal, wherein in response to an application of a fuse voltage to the programming terminal, the OTP element electrically couples the first end of the TSV to the second end of the TSV.

An integrated circuit (IC) includes a non-volatile memory and boot circuitry. The boot circuitry is configured to boot the IC, including reading from the non-volatile memory one or more values indicative of whether production testing of the IC was completed successfully, and initiating a responsive action if the one or more values indicate that the production testing was not completed successfully.

The present application discloses a semiconductor chip, an electronic device and an electrostatic discharge (ESD) protection method for an electronic device thereof. The semiconductor chip includes an operation electrical contact, a detection electrical contact, an ESD protection unit, and a logic circuit. The operation electrical contact receives an operation signal. The detection electrical contact receives a chip connection signal. The ESD protection unit is coupled to the operation electrical contact. The logic circuit is coupled to the detection electrical contact, and adjusts capacitance of the ESD protection unit according to a chip connection signal received by the detection electrical contact.

Methods, systems, and devices for adjustable column address scramble using fuses are described. A testing device may detect a first error in a first column plane of a memory array and a second error in a second column plane of the memory array. The testing device may identify a first column address of the first column plane associated with the first error and a second column address of the second column plane based on detecting the first error and the second error. The testing device may determine, for the first column plane, a configuration for scrambling column addresses of the first column plane to different column addresses of the first column plane. In some cases, the testing device may perform a fuse blow of a fuse associated with the first column plane to implement the determined configuration.

A method for testing a memory and a memory testing device are provided. The method for testing the memory includes writing data to a memory including a candidate storage unit, a fuse, and a redundant unit for replacing the candidate storage unit through the fuse when the candidate storage unit is determined to be defective; adjusting a temperature of the memory, and while adjusting the temperature, repeatedly refreshing the memory and recording the state of the fuse; reading the data of the memory if the temperature of the memory is stable at a predetermined temperature; and determining that the fuse is defective if the read data of the memory has an error.