A deterioration detection device includes a storage including a first current path and a second current path and configured such that a current is applied to the first current path and the second current path, a storage input control unit configured to compare an internal operating condition of a memory device with a target condition in a first operating mode and to select one of the first current path and the second current path of the storage based on a result of the comparison, and an output unit configured to output an output signal indicated deterioration, accumulated in one of the first current path and the second current path, in a second operating mode.

A latch circuit includes a plurality of latch sets, each including an enable latch and a plurality of address latches; and a plurality of latch-width adjusting circuits respectively corresponding to the latch sets, wherein, in each of the plurality of latch sets, the corresponding latch-width adjusting circuit is disposed between the enable latch of the corresponding latch set and the address latch adjacent to the enable latch, and couples the enable latch to the adjacent address latch depending on whether or not the corresponding latch set is used, at an end of a boot-up operation.

An integrated circuit includes a front-side horizontal conducting line in a first metal layer, a front-side vertical conducting line in a second metal layer, a front-side fuse element, and a backside conducting line. The front-side horizontal conducting line is directly connected to the drain terminal-conductor of a transistor through a front-side terminal via-connector. The front-side vertical conducting line is directly connected to the front-side horizontal conducting line through a front-side metal-to-metal via-connector. The front-side fuse element having a first fuse terminal conductively connected to the front-side vertical conducting line. The backside conducting line is directly connected to the source terminal-conductor of the transistor through a backside terminal via-connector.

An anti-fuse sensing device and an operation method thereof are provided. The anti-fuse sensing device is adapted for sensing a resistance state of an anti-fuse. The anti-fuse sensing device includes a voltage generating circuit, a comparison circuit, and a sensing circuit. The voltage generating circuit is configured to generate a comparison voltage that changes with temperature. The comparison circuit is coupled to the voltage generating circuit to receive the comparison voltage. The comparison circuit is configured to compare the comparison voltage with a reference voltage, and convert a difference between the comparison voltage and the reference voltage into a bias voltage that changes with temperature. The sensing circuit is coupled to the comparison circuit to receive the bias voltage. The sensing circuit is configured to sense the resistance state of the anti-fuse according to the bias voltage.

An example fuse error detection circuit configured to receive a first data set from a fuse array during a first fuse data broadcast and to encode the first data set to provide first signature data. The fuse error detection circuit is further configured to receive a second data set from the fuse array during a second fuse data broadcast and to encode the second data set to provide second signature data. The fuse error detection circuit is further configured to compare the first signature data and the second signature data and to provide a match indication having a value based on the comparison between the first signature data and the second signature data.

According to one embodiment, a memory device includes: a memory cell array including a first and a second array; a fuse circuit to hold first data; and a control circuit to control a replacement process on the first and second arrays based on the first data. When a first address in a first direction in the first array is supplied, the fuse circuit transfers the first data corresponding to the first address to the control circuit, and when a second address in a second direction in the first array is supplied after the first data is transferred, the control circuit accesses one of the first and second arrays based on a comparison result for the second address and the first data.

An anti-fuse readout circuit, an anti-fuse memory, and a testing method are provided. The anti-fuse readout circuit includes: a latch circuit configured to latch data read out from an anti-fuse storage array; and a transmission circuit connected to an output terminal of the latch circuit, the transmission circuit being configured to transmit data latched in the latch circuit to a data port in response to a read test command.

A read-write circuit of a one-time programmable memory, including: an antifuse array including: n*n antifuse units, between a first node and a second node, the control terminals of switching elements in the antifuse units coupled to AND signals of different word line signals and bit line signals; the first switching device and the first capacitor connected in parallel between the second node and the second voltage source; the reference array including reference resistance and reference switching elements connected in series between the first and third nodes, the reference switching element's control end coupled to OR signals of the n*n AND signals; the second switching device and the second capacitor connected in parallel between the third node and second voltage source; a comparison circuit's first input terminal coupled to the second node and second input terminal coupled to the third node. The circuit has simpler connections, smaller area, and higher reliability.

An integrated circuit includes a TSV extending from a first surface of a semiconductor substrate to a second surface of the semiconductor substrate and having a first end and a second end, and a non-volatile repair circuit. The non-volatile repair circuit includes a one-time programmable (OTP) element having a programming terminal, wherein in response to an application of a fuse voltage to the programming terminal, the OTP element electrically couples the first end of the TSV to the second end of the TSV.

An e-fuse device includes a transferring circuit, a detecting-and-outputting circuit, and a fusing circuit. The transferring circuit transfers an input signal to a data node. The detecting-and-outputting circuit generates an output signal according to the logic level of the data node. The fusing circuit includes an e-fuse cell, a first transistor, a second transistor, and a switch element. The e-fuse cell is coupled between a high-voltage node supplied with the high voltage or a ground and a first node. The first transistor is coupled between the first node and a second node and is controlled by the output signal. The second transistor is coupled between the second node and the ground and is controlled by a fusing signal. The switch element is coupled between the first node and the data node and is controlled by a switch signal.