A method for bit error rate testing a processing unit using a bit error rate tester (BERT) includes transmitting a signal pair to a receiver of the processing unit, the signal pair having jitter levels complying with a jitter threshold, tuning the signal pair to obtain a first stressed eye measurement for the receiver, wherein the first stressed eye measurement complies with a stressed eye mask, placing the processing unit into a loop-back mode, wherein data transmitted to the processing unit by the BERT is transmitted back to the BERT, transmitting a data pattern to the processing unit, receiving a looped back version of the data pattern from the processing unit, and calculating a bit error rate in accordance with the data pattern and the looped back version of the data pattern.

An apparatus for performing thermal testing of a memory device and a method of thermally testing the memory device. The apparatus includes a tester; an interface board disposed over the tester and configured to receive the semiconductor device and connect the semiconductor device to the tester; a shield disposed over the interface board and including a recess; a gas-supplying unit including a conduit extending through the shield and accessible to the recess; a temperature-sensing device disposed within the recess; and a controller configured to control and communicate with the tester, the gas-supplying unit and the temperature-sensing device.

In certain aspects, a pattern generation system includes a pattern generator, a memory, a pin function register, a pin function mapper, and a set of source selectors. The pattern generator generates a plurality of source patterns. The memory stores a lookup table set. The lookup table set describes a mapping relationship between the plurality of source patterns and a set of test channels, and is indexed based on a pin function index. The pin function register stores a value of the pin function index. The pin function mapper executes a pin-mapping operation to generate a set of source selection signals based on the value of the pin function index and the lookup table set. Each source selector selects and outputs a source signal from the plurality of source patterns to a corresponding test channel based on a corresponding source selection signal received from the pin function mapper.

Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a multiple-name-space testing system comprises a load board, testing electronics, and a namespace testing tracker. The load board is configured to couple with a plurality of devices under test (DUTs). The testing electronics are configured to test the plurality of DUTs, wherein the testing electronics are coupled to the load board. The controller is configured to direct testing of multiple-name-spaces across the plurality of DUTs at least in part in parallel. The controller can be coupled to the testing electronics. The namespace testing tracker is configured to track testing of the plurality of DUTs, including the testing of the multiple-name-spaces across the plurality of DUTs at least in part in parallel. In one embodiment, the DUTs are NVMe SSD devices.

A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

A system and method are provided for self-testing one or more digital data storage drives. In particular, a drive tester system connects to the one or more digital data storage drives via a standard two-wire interface, such as a system management bus interface or an I.sup.2C interface. The drive tester system performs a self-test on the on more digital data storage drives via the standard two-wire interface. The self-test of the digital data storage drive includes a burn-in and endurance test.

A layout of a driving circuit, a semiconductor structure and a semiconductor memory are provided. The layout includes P-type transistors, N-type transistors and four test modules. The four test modules are distributed on both sides of the P-type transistors and the N-type transistors in an upper-lower symmetrical structure, and the P-type transistors and the N-type transistors have an upper-lower structure distribution in the middle of the four test modules.

A test apparatus includes a device under test (DUT) configured to exchange data using a serial interface protocol and a test controller configured to receive a binary vector corresponding to a physical layer of the serial interface protocol from an external device and to buffer and transmit the received binary vector to the DUT.

A semiconductor memory device included in each of a plurality of chips which are divided by a scribe lane and formed on an upper surface of a wafer, includes a memory core and a built-in self test (BIST) circuit. The memory core includes a memory cell array that stores data and a data input/output circuit connected to a data input/output pad. The BIST circuit is connected to a test pad that is separate from the data input/output pad. The BIST circuit generates test pattern data including first parallel bits based on commands and addresses received from an external automatic test equipment (ATE) during a wafer level test process performed on the semiconductor memory device. The BIST circuit tests the memory core by applying the test pattern data to the memory cell array through the data input/output circuit.

An exemplary testing environment can operate in a testing mode of operation to test whether a memory device or other electronic devices communicatively coupled to the memory device operate as expected or unexpectedly as a result of one or more manufacturing faults. The testing mode of operation includes a shift mode of operation, a capture mode of operation, and/or a scan mode of operation. In the shift mode of operation and the scan mode of operation, the exemplary testing environment delivers a serial input sequence of data to the memory device. In the capture mode of operation, the exemplary testing environment delivers a parallel input sequence of data to the memory device. The memory device thereafter passes through the serial input sequence of data or the parallel input sequence of data to provide an output sequence of data in the shift mode of operation or the capture mode of operation or passes through the serial input sequence of data to provide a serial output sequence of scan data in the scan mode of operation.