A fault analysis method of a semiconductor fault analysis device is provided. The fault analysis method includes: receiving measurement data measured corresponding to a semiconductor device; generating double sampling data based on the measurement data and reference data; performing a fault analysis operation with respect to the double sampling data; classifying a fault type of the semiconductor device based on a result of the fault analysis operation; and outputting information about the fault type.

A memory test apparatus according to the present embodiment comprises a first storage medium temporarily retaining a test result of memory cells of a device under test in a plurality of divided portions based on data output from the device under test. A first processor reads the divided test result from the first storage medium to compress the test result. A second storage medium is provided to respectively correspond to a plurality of the devices under test and receives the compressed test result from the first processor and saves the compressed test result.

A serial arbitration for memory diagnostics and methods thereof are provided. The method includes running a built-in-self-test (BIST) on a plurality of memories in parallel. The method further includes, upon detecting a failing memory of the plurality of memories, triggering arbitration logic to shift data of the failing memory to a chip pad.

A memory test system may include: a data storage device including a nonvolatile memory device, and a controller configured to control an operation of the nonvolatile memory device; and a test device configured to: request a test to the data storage device; request, to the data storage device, an output of a variable to be generated through driving of a firmware for performing the test, while the test is performed in the data storage device; and determine whether the firmware is normally driven based on the variable outputted from the data storage device.

Disclosed in some examples are methods, systems, memory devices, machine readable mediums configured to intentionally degrade NAND performance when a value of a NAND health metric indicates a potential for failure to encourage users to replace or backup their devices before data loss occurs. For example, the system may track a NAND health metric and when that metric reaches a predetermined threshold or state, the system may intentionally degrade performance. This performance degradation may be more effective than a warning to effect device backup or replacement.

A method for monitoring communications between a device under test (DUT) and an automated test equipment (ATE) is disclosed. The method comprises programming an interface core and a protocol analyzer module onto a programmable logic device, wherein the programmable logic device is controlled by a system controller and is operable to generate commands and data to test a DUT, wherein the interface core is operable to generate signals to communicate with the DUT using a protocol associated with the DUT. The method also comprises monitoring data and command traffic associated with the protocol in the interface core using the protocol analyzer module and storing results associated with the monitoring in a memory comprised within the protocol analyzer module. The method finally comprises transmitting the results upon request to an application program associated with the protocol analyzer module executing on the system controller.

A fault analysis method of a semiconductor fault analysis device is provided. The fault analysis method includes: receiving measurement data measured corresponding to a semiconductor device; generating double sampling data based on the measurement data and reference data; performing a fault analysis operation with respect to the double sampling data; classifying a fault type of the semiconductor device based on a result of the fault analysis operation; and outputting information about the fault type.

An interface of a memory sub-system can receive a write command addressed to a first address and a read command addressed to a second address and can receive data corresponding to the write command. The interface can determine whether the first address matches the second address responsive to determining that the first address matches the second address, can drop the read command and the second address, and can provide the data to a host.

A semiconductor integrated circuit according to an embodiment includes: a first circuit, an analog-to-digital converter, an external input terminal, a selector, and a second circuit. The first circuit is configured to generate a first voltage corresponding to a temperature. The analog-to-digital converter is configured to convert the first voltage into a first digital value. The external input terminal is a terminal to which a second digital value is input from outside. The selector is configured to select either the first digital value or the second digital value. The second circuit is configured to generate a second voltage based on a third digital value being a digital value selected by the selector.

A semiconductor apparatus includes a semiconductor chip, with the semiconductor chip including a modular region and a test circuit. The modular region includes a plurality of modular areas each including a memory cell array with redundant bit lines and a peripheral memory area storing at least redundant addresses. The test circuit retrieves the redundant addresses intrinsic to the semiconductor chip. The distribution of the redundant addresses is randomly formed related to a part or an entirety of the modular area of the modular region. The distribution of the retrieved redundant addresses is irreversible, with a random number representing physical properties intrinsic to the semiconductor chip and providing copy protection. When another semiconductor chip uses the distribution of the retrieved redundant addresses the another semiconductor chip will malfunction. The test circuit outputs a random number generated from the distribution of the retrieved redundant addresses according to a specification code received from a physical-chip-identification measuring device.