G11C29/76

AGGRESSIVE WRITE FLUSH SCHEME FOR A VICTIM CACHE
20230004500 · 2023-01-05 ·

A caching system including a first sub-cache and a second sub-cache in parallel with the first sub-cache, wherein the second sub-cache includes: line type bits configured to store an indication that a corresponding cache line of the second sub-cache is configured to store write-miss data, and an eviction controller configured to evict a cache line of the second sub-cache storing write-miss data based on an indication that the cache line has been fully written.

Repair circuit and memory
11715548 · 2023-08-01 · ·

A repair circuit includes: a plurality of redundant memory cells, each redundant memory cell being configured with a state signal; and a repair module connected to the plurality of redundant memory cells and configured to determine target memory cells from the redundant memory cells based on the state signals and repair defective memory cells through the target memory cells. The target memory cells are in one-to-one correspondence to the defective memory cells. The repair module can repair, at each of multiple repair stages, different defective memory cells, the plurality of redundant memory cells being shared at the multiple repair stages.

3D memory devices and structures with control circuits

A semiconductor device, the device including: a first level including control circuits, where the control circuits include a plurality of first transistors and a plurality of metal layers; and a memory level disposed on top of the first level, where the memory level includes an array of memory cells, where each of the memory cells includes at least one second transistor, where the control circuits control access to the array of memory cells, where the first level is bonded to the memory level, where the bonded includes oxide to oxide bonding regions and a plurality of metal to metal bonding regions, and where at least a portion of the array of memory cells is disposed directly above at least one of the plurality of metal to metal bonding regions.

Column Redundancy Techniques

Various implementations described herein are directed to a device having memory architecture with an array of memory cells arranged in multiple columns with redundancy including first columns of memory cells disposed in a first region along with second columns of memory cells and redundancy columns of memory cells disposed in a second region that is laterally opposite the first region. The device may have column shifting logic that is configured to receive data from the multiple columns, shift the data from the first columns in the first region to a first set of the redundancy columns in the second region, and shift data from the second columns in the second region to a second set of the redundancy columns in the second region.

3D MEMORY DEVICES AND STRUCTURES WITH CONTROL CIRCUITS
20230020251 · 2023-01-19 · ·

A semiconductor device, the device including: a first level including control circuits, where the control circuits include a plurality of first transistors and a plurality of metal layers; a memory level disposed on top of the first level, where the memory level includes an array of memory cells, where each of the memory cells include at least one second transistor, where the control circuits control the array of memory cells, where the first level is bonded to the memory level, where the bonded includes oxide to oxide bonding regions and a plurality of metal to metal bonding regions, and where at least one of the memory cells is disposed directly above at least one of the plurality of metal to metal bonding regions.

Method and device for operating a memory assembly

The invention relates to a method for operating a memory assembly. A physical address is received. The physical address is associated with a first memory segment of a memory assembly. The physical address is modified to a modified physical address. The modified physical address is associated with a second memory segment of the memory assembly.

Efficient and selective sparing of bits in memory systems

A memory system for storing data is disclosed, the memory system including a plurality of memory devices configured to store data, each memory device having a plurality of bits, the memory devices configured and associated to work together as a rank to respond to a request; a memory control circuit associated with the plurality of memory devices and configured to output command and control signals to the plurality of memory devices; a detector for detecting a bit error in an operation; and a controller for remapping the bit error to a spare bit lane in response to the detector detecting the bit error.

Victim cache that supports draining write-miss entries

A caching system including a first sub-cache and a second sub-cache in parallel with the first sub-cache, wherein the second sub-cache includes a set of cache lines, line type bits configured to store an indication that a corresponding cache line of the set of cache lines is configured to store write-miss data, and an eviction controller configured to flush stored write-miss data based on the line type bits.

Apparatus configured to perform a repair operation
11693564 · 2023-07-04 · ·

An apparatus includes a storage area signal generation circuit configured to generate a storage area signal when performing an internal information storage operation and an external information storage operation; and an information storage circuit configured to receive internal failure information, stored in the apparatus, based on the storage area signal and store the received internal failure information as failure information in a set storage capacity, and store external failure information, applied from outside the apparatus, as the failure information in a variable storage capacity.

Memory system and method for controlling memory system
11693571 · 2023-07-04 · ·

According to one embodiment, there is provided a memory system including a non-volatile memory and a controller. The non-volatile memory includes a plurality of physical blocks. The controller is connected to any of the plurality of physical blocks via a plurality of channels. The controller is configured to construct a plurality of logical blocks and, read or write data from or into any of the plurality of logical blocks constructed. The logical blocks are management units in which any of the physical blocks is grouped across the plurality of channels. The controller is configured to construct the plurality of logical blocks so that a first number of defective blocks and a second number of pseudo defective blocks for shortfall defective blocks with respect to a target number of defective blocks are distributed into the plurality of logical blocks.