According to one embodiment, a memory arrangement is described a memory including a memory cell and a sense amplifier coupled to the memory cell having a node whose potential depends on the difference between a current through the memory cell and a reference current, a detection circuit configured to generate a signal representing whether the current through the memory cell is above or below the reference current based on the potential of the node and a limitation circuit configured to receive the signal and to limit the change of the potential of the node caused by the difference between the current through the memory cell and the reference current in response to the signal.

According to one embodiment, a semiconductor memory device includes a first transistor which includes a first end coupled to a first node, a second end, and a gate coupled to the second end. A second transistor includes a third end coupled to the first node, a fourth end, and a gate coupled to the fourth end. A third transistor is provided between a first bit line and a second node in a first sense amplifier. A selector is configured to supply a gate of the third transistor with one of a potential of the second end and a potential of the fourth end.

In an embodiment, a semiconductor memory device may include a memory cell array, a plurality of page buffers, and a control logic. The memory cell array may include a plurality of memory cells. The plurality of page buffers may be coupled to a plurality of bit lines of the memory cell array, respectively. The control logic may control the plurality of page buffers to perform a read operation on the memory cell array. Each of the plurality of page buffers may perform data sensing by changing a voltage of a page buffer sensing signal after an internal node is precharged.

A memory circuit is provided, including at least one bit cell configured to store data and having a first terminal and a second terminal, one of the terminals being coupled to a bit-line; at least one current switch connected to the bit-line and connected to a current source and being configured to selectively provide at least a read current to the bit cell; and a sense amplifier having at least one input connected to a sensing node on the bit-line, wherein the sensing node is disposed between the bit cell and the at least one current switch.

A memory device includes source-drain structure bodies and gate structure bodies arranged along a first direction, and global word lines. The source-drain structure body includes a bit line, and first to third semiconductor layers. The first and second semiconductor layers are of first conductivity type and the first semiconductor layer is connected to the bit line. The third semiconductor layer of a second conductivity type contacts the first and second semiconductor layers. The gate structure body includes a local word line and a charge storage film. A first source-drain structure body includes a bit line forming a first reference bit line. A first global word line connects to the local word lines in the gate structure bodies formed on both sides of the first reference bit line and to the local word lines formed in alternate gate structure bodies that are formed between the remaining plurality of source-drain structure bodies.

A memory cell array of a multi-time programmable non-volatile memory includes plural memory cells. The memory cell has the structure of 1T1C cell, 2T1C cell or 3T1C cell. Moreover, the floating gate transistors of the memory cells in different rows of the memory cell array are constructed in the same well region. Consequently, the chip size is reduced. Moreover, by providing proper bias voltages to the memory cell array, the program action, the erase action or the read action can be performed normally.

A sense amplifier circuit includes a bitline node, a sense node, and a feedback circuit which is connected to the bitline node and to the sense node. The feedback circuit includes a cascode-connected pair of transistors configured to isolate the bitline node from an occurrence of a voltage variation on the sense node.

A device includes a first reference storage unit, a second reference storage unit, a first reference switch, and a second reference switch. The first reference switch includes a first terminal coupled to a first reference bit line, a second terminal coupled to the first reference storage unit, and a control terminal coupled a reference word line. The second reference switch includes a first terminal coupled to a second reference bit line, a second terminal coupled to the second reference storage unit, and a control terminal coupled the reference word line. The first reference storage unit is configured to receive a bit data through the first reference switch, and to generate a first signal having a first logic state.

A memory device includes: a memory array including a plurality of memory cells and a plurality of bit lines; and a current converting circuit, coupled to the memory array. In executing a calculation operation, the memory cells of the memory array generate a source current corresponding to a calculation operation result. The source current is converted by the current converting circuit into an output value for being an input signal provided to a next calculation operation.

A regeneration circuit includes a first inverting circuit having an input and an output, a second inverting circuit having an input and an output, a first transistor coupled to the input of the second inverting circuit, wherein a gate of the first transistor is configured to receive a first input signal, and a second transistor coupled to the input of the first inverting circuit, wherein a gate of the second transistor is configured to receive a second input signal. The regeneration circuit also includes a first switch coupled between the first transistor and the output of the first inverting circuit, wherein a control input of the first switch is configured to receive a timing signal, and a second switch coupled between the second transistor and the output of the second inverting circuit, wherein a control input of the second switch is configured to receive the timing signal.