The present disclosure provides techniques for using a multiple-port buffer to improve a transaction rate of a memory module. In an example, a memory module can include a circuit board having an external interface, first memory devices mounted to the circuit board, and a first multiple-port buffer circuit mounted to the circuit board. The first multiple-port buffer circuit can include a first port coupled to data lines of the external interface, the first port configured to operate at a first transaction rate, a second port coupled to data lines of a first plurality of the first memory devices, and a third port coupled to data lines of a second plurality of the first memory devices. The second and third ports can be configured to operate at a second transaction rate, wherein the second transaction rate is slower than the first transaction rate.

An example memory sub-system includes: a plurality bank groups, wherein each bank group comprises a plurality of memory banks; a plurality of row buffers, wherein two or more row buffers of the plurality of row buffers are associated with each bank group; and a processing logic communicatively coupled to the plurality of bank groups and the plurality of row buffers, the processing logic to perform operations comprising: receiving, from a host, a command identifying a row buffer of the plurality of row buffers; and perform an operation with respect to the identified row buffer.

Apparatuses and methods for performing concurrent memory access operations for different memory planes are disclosed herein. An example apparatus may include a memory array having a plurality of memory planes. Each of the plurality of memory planes comprises a plurality of memory cells. The apparatus may further include a controller configured to receive a group of memory command and address pairs. Each memory command and address pair of the group of memory command and address pairs may be associated with a respective memory plane of the plurality of memory planes. The internal controller may be configured to concurrently perform memory access operations associated with each memory command and address pair of the group of memory command and address pairs regardless of page types associated with the pairs of the group (e.g., even if two or more of the memory command and address pairs may be associated with different page types).

A first read operation is performed on a first set of memory cells addressable by a first wordline (WL), and a second read operation is performed on a second set of memory cells addressable by a second WL, wherein the first set of memory cells and the second set of memory cells are comprised by an open TU of memory cells. A first threshold voltage offset bin associated with the first WL is identified. A second threshold voltage offset bin associated with the second WL is identified. Respective threshold voltage offset bins for each WL of a plurality of WLs coupled to respective sets of memory cells comprised by the open TU are determined based on at least one of the first threshold voltage offset bin and the second threshold voltage offset bin. Respective default threshold voltages for each WL of the plurality of WLs are updated based on the threshold voltage offset bins.

A memory device comprises a first memory area including a first memory cell array having a plurality of first memory cells each for storing N-bit data, where N is a natural number, and a first peripheral circuit for controlling the first memory cells according to an N-bit data access scheme and disposed below the first memory cell array, a second memory area including a second memory cell array having a plurality of second memory cells each for storing M-bit data, where M is a natural number greater than N, and a second peripheral circuit for controlling the second memory cells according to an M-bit data access scheme and disposed below the second memory cell array, wherein the first memory area and the second memory area are included in a single semiconductor chip and share an input and output interface, and a controller configured to generate calculation data by applying a weight stored in the first memory area to sensing data in response to receiving the sensing data obtained by an external sensor, and store the calculation data in one of the first memory area or the second memory area according to the weight, wherein the plurality of first memory cells and the plurality of second memory cells are included in a first chip having a first metal pad, the first peripheral circuit and the second peripheral circuit are included in a second chip having a second metal pad, and the first chip and the second chip are vertically connected to each other by the first metal pad and the second metal pad.

Embodiments herein describe a memory system that queues program requests to a block of flash memory until a predefined threshold is reached. That is, instead of performing program requests to write data into the block as the requests are received, the memory system queues the requests until the threshold is satisfied. Once the buffer for the block includes the threshold amount of program requests, the memory system performs the stored requests. In one embodiment, the memory system erases all the pages in the block before writing the new data in the program requests into the destination pages. The data that was originally stored in the pages that are not destination pages is rewritten into the pages. In this example, the queued program requests can be written into the pages using one erase and write step rather than individual erase and write steps for each of the requests.

The present disclosure includes apparatuses and methods related to bank coordination in a memory device. A number of embodiments include a method comprising concurrently performing a memory operation by a threshold number of memory regions, and executing a command to cause a budget area to perform a power budget operation associated with the memory operation.

A memory and a method for operating the memory are presented. The memory includes a memory cell, a sense amplifier configured to sense read data from the memory cell, a write driver configured to provide write data to the memory cell, a first circuit configured to enable the sense amplifier during a time period, and a second circuit configured to enable the write driver during at least a portion of the time period. The method includes enabling a sense amplifier to sense read data from a memory cell during a time period and enabling a write driver to provide write data to the memory cell during at least a portion of the time period. Another memory and method for operating the memory are presented. The memory and method further include an address input circuit configured to receive a write address while the sense amplifier is enabled.

A data storage device includes a memory, a controller, and a communication bus coupled to the memory and to the controller. The controller is configured to send a read-write command and write data to the memory via the communication bus. The read-write command indicates an address of requested data to be read from the memory. The controller is further configured to receive the requested data read from the memory. Communicating the requested data over the communication bus overlaps the write data being stored into the memory.

Apparatuses and methods for variable latency memory operations are disclosed herein. An example apparatus may include a memory configured to receive an activate command indicative of a type of a command during a first addressing phase and to receive the command during a second addressing phase. The memory may further be configured to provide information indicating that the memory is not available to perform a command responsive, at least in part, to receiving the command during a variable latency period and to provide information indicating that the memory is available to perform a command responsive, at least in part, to receiving the command after the variable latency period.