Technologies are generally described herein for a reconfigurable row dynamic random access memory device. The reconfigurable row may correspond to a logically addressable row, where multiple row segments can be mapped to different physical DRAM rows. In some examples, a reconfigurable row dynamic random access memory may use a row segment activator to allow memory operation access to a row segment, while maintaining the remaining part of the same row available for other memory access operations. The reconfigurable row dynamic random access memory may be operated in various modes of operation, including a pipeline mode and a burst mode.

A memory device includes a first memory area including a first memory cell array having a plurality of first memory cells and a first peripheral circuit disposed below the first memory cell array; a second memory area including a second memory cell array having a plurality of second memory cells and a second peripheral circuit disposed below the second memory cell array; and a pad area including a power wiring. The first and second memory areas respectively include first and second local lockout circuits separately determining whether to lock out of each of the memory areas. The first and second memory areas are included in a single semiconductor chip to share the pad area, and the first and second memory areas operate individually. Accordingly, in the memory device, unnecessary data loss may be reduced by selectively stopping an operation of only a memory area requiring recovery.

A disclosed example method involves performing simultaneous data accesses on at least first and second independently selectable logical sub-ranks to access first data via a wide internal data bus in a memory device. The memory device includes a translation buffer chip, memory chips in independently selectable logical sub-ranks, a narrow external data bus to connect the translation buffer chip to a memory controller, and the wide internal data bus between the translation buffer chip and the memory chips. A data access is performed on only the first independently selectable logical sub-rank to access second data via the wide internal data bus. The example method also involves locating a first portion of the first data, a second portion of the first data, and the second data on the narrow external data bus during separate data transfers.

According to one embodiment, a nonvolatile RAM includes a memory cell array, a first circuit being allowed to access the memory cell array in a write operation using a first pulse, and a second circuit being allowed to access the memory cell array in a read operation using a second pulse, the second circuit being allowed to operate in parallel with an operation of the first circuit. A width of the first pulse is longer than a width of the second pulse.

A pseudo-triple-port memory is provided that includes a plurality of pseudo-triple-port bitcells, each pseudo-triple-port first bitcell having a first read port including a first word line coupled to a first bit line through a first access transistor, a second read port including a second word line coupled to a second bit line through a second access transistor, and a write port including both the word lines, both the bit lines, and the pair of access transistors.

The present disclosure includes apparatuses and methods related to bank coordination in a memory device. A number of embodiments include a method comprising concurrently performing a memory operation by a threshold number of memory regions, and executing a command to cause a budget area to perform a power budget operation associated with the memory operation.

A memory circuit system and method for using the same are provided. In one example, the memory circuit system includes a memory array, a first precharge circuit, and a second precharge circuit. The memory array writes a first set of columns of the memory array. The first precharge circuit charges bitlines of a second set of columns of the memory array while bitlines of the first set of columns discharge. The first set of columns is different from the second set of columns. The second precharge circuit charges the bitlines of the first set of columns after the memory array has finished writing the first set of columns.

A memory system includes a non-volatile memory having a plurality of memory cells, and a controller configured to carry out write operations in a first mode in which n-bit data is written per target memory cell of the non-volatile memory until an allowable data amount of data items has been written, and then, in a second mode in which m-bit data is written per target memory cell of the non-volatile memory, where n is an integer of one or more and m is an integer greater than n. The controller is further configured to detect that an idle state, in which a command has not been received from the host, has continued for a threshold period of time or more, increase the allowable data amount in response thereto, and after the increase, carry out a write operation to write data items in the non-volatile memory in the first mode.

A memory device includes a first memory area including a first memory cell array having a plurality of first memory cells and a first peripheral circuit disposed below the first memory cell array; a second memory area including a second memory cell array having a plurality of second memory cells and a second peripheral circuit disposed below the second memory cell array; and a pad area including a power wiring. The first and second memory areas respectively include first and second local lockout circuits separately determining whether to lock out of each of the memory areas. The first and second memory areas are included in a single semiconductor chip to share the pad area, and the first and second memory areas operate individually. Accordingly, in the memory device, unnecessary data loss may be reduced by selectively stopping an operation of only a memory area requiring recovery.

A memory device includes a memory array comprising a plurality of planes, a primary plane driver circuit comprising components to support read operations, program operations, and erase operations on any of the plurality of planes, and a secondary plane driver circuit comprising components to support read operations on an associated one of the plurality of planes. The primary plane driver circuit is configured to perform a first read operation on a first plane of the plurality of planes and the secondary plane driver circuit is configured to perform a second read operation on a second plane of the plurality of planes concurrently with the first read operation.