A memory device including memory cells and edge cells is described. In one example, the memory device includes: an array of memory cells used for data storage; a plurality of first edge cells not used for data storage; and a plurality of second edge cells not used for data storage. The plurality of first edge cells and the plurality of second edge cells are arranged respectively at two opposite sides of the array of memory cells. At least one edge cell, among the plurality of first edge cells and the plurality of second edge cells, comprises a circuit configured for controlling the array of memory cells to enter or exit a power down mode.

A memory controller includes a command queue and an arbiter operating in a first voltage domain, and a physical layer interface (PHY) operating in a second voltage domain. The memory controller includes isolation cells operable to isolate the PHY from the first voltage domain. A local power state controller, in response to a first power state command, provides configuration and state data for storage in an on-chip RAM memory, causes the memory controller to enter a powered-down state, and maintains the PHY in a low-power state in which the second voltage domain is powered while the memory controller is in the powered-down state.

Apparatuses with a signal line in a semiconductor device are described. An example apparatus includes one or more power supply voltage lines in a first conductive layer, a plurality of transistors and a signal line in a second conductive layer. Each transistor of the plurality of transistors includes an active region disposed in a substrate and a gate electrode above the active region. The signal line in the second conductive layer is below the first conductive layer and above the active regions of the plurality of transistors. The signal line is coupled to the gate electrodes of the plurality of transistors. The signal line has electrical resistance higher than electrical resistance of the power supply voltage line.

An exemplary semiconductor device includes an internal clock circuit configured to intermittently enable and disable a clock signal while in a Maximum Power Savings Mode. The duty cycle of the enablement and disablement of the clock signal may be based on susceptibility to negative-bias temperature instability of a component of the semiconductor device. The clock signal may be enabled and disabled via a synchronizer.

An apparatus includes a memory circuit that includes a plurality of sub-arrays. The memory circuit is configured to implement a retention mode according to test information indicating voltage sensitivities for the plurality of sub-arrays. The apparatus also includes a voltage control circuit coupled to a power supply node. The voltage control circuit is configured, in response to activation of the retention mode for the plurality of sub-arrays, to generate, based on the test information, at least two different retention voltage levels for different ones of the plurality of sub-arrays. The at least two different retention voltage levels are lower than a power supply voltage level of the power supply node.

A memory module includes a plurality of memory components, an in-memory power manager, and an interface to a host computer over a memory bus. The in-memory power manager is configured to control a transition of a power state of the memory module. The transition of the power state of the memory module includes a direct transition from a low power down state to a maximum power down state.

Systems, methods and devices are disclosed for a smart compute memory circuitry that has the flexibility to perform a wide range of functions inside the memory via logic circuitry and an integrated processor. In one embodiment, the smart compute memory circuitry comprises an integrated processor and logic circuitry to enable adaptive System on a Chip (SOC) and electronics subsystem power or performance improvements, and adaptive memory management and control for the smart compute memory circuitry. A resistive memory array is coupled to the integrated processor.

A method of controlling a memory device can include: determining, by the memory device, a time duration in which the memory device is in a standby mode; automatically switching the memory device from the standby mode to a power down mode in response to the time duration exceeding a predetermined duration; exiting from the power down mode in response to signaling from a host device via an interface; and toggling a data strobe when data is ready to be output from the memory device in response to a read command from the host device.

In one form, a memory controller includes a controller and a memory operation array. The controller has an input for receiving a power state change request signal and an output for providing memory operations. The memory operation array comprises a plurality of entries, each entry comprising a plurality of encoded fields. The controller is responsive to an activation of the power state change request signal to access the memory operation array to fetch at least one entry, and to issue at least one memory operation indicated by the entry. In another form, a system comprises a memory system and a processor coupled to the memory system. The processor is adapted to access the memory module using such a memory controller.

An electronic device includes a flag generation circuit and a delay circuit. The flag generation circuit is configured to generate a flag signal, wherein a level of the flag signal changes based on a first internal command. The delay circuit is configured to generate a delay signal by delaying one of an operation signal and the flag signal by a predetermined period according to whether a predetermined operation is performed.