A processor-in-memory device includes a memory array, a sense amplifier, and a processing unit that has an accumulator. The processing unit is configured to receive a set of data. The processing unit then uses the sense amplifier and the accumulator to generate a first histogram of the set of data.

Apparatus and methods are provided for operating a non-volatile memory module. In an example, a method can include filling a first plurality of pages of a first non-volatile memory with first data from a first data lane that includes a first volatile memory device, and filling a second plurality of pages of the first non-volatile memory device with second data from a second data lane that includes a second volatile memory device. In certain examples, the first plurality of pages does not include data from the second data lane.

A memory system includes a memory device including a memory cell array, a first latch, a plurality of program latches, and a second latch and a memory controller configured to provide a command to the memory device. The memory device may sense first data from a first region of the memory cell array, store the sensed first data in the first latch, transfer the sensed first data to the second latch, output the first data from the second latch to the memory controller, and transfer the first data from the second latch to a first program latch of the plurality of program latches, in response to a first read command.

The present application provides an on-chip cache apparatus, an on-chip cache on-chip cache read-write method and a computer-readable medium, the on-chip cache apparatus includes: a read-write processing module, a cache module and a memory module; the read-write processing module is connected with the cache module and the memory module respectively, and is configured to store packets into the cache module and the memory module, read packets stored in the cache module and the memory module, and transfer packets cached in the cache module to the memory module for storing; the cache module is connected with the memory module through the read-write processing module, and includes at least one cache register configured to temporarily cache packets; and the memory module is connected with the read-write processing module, and is configured to store the packets cached in the cache module.

A semiconductor device includes a substrate, a first external connection pad separated from the substrate in a first direction, which is a thickness direction thereof, a first coil separated from the substrate in the first direction and electrically connected to the connection pad, a first stacked body between the connection pad and the substrate and between the first coil and the substrate, the first stacked body including a first insulator, a first wiring therein, and a first pad electrically connected to the wiring, and a second stacked body between the first stacked body and the substrate, the second stacked body including a second insulator, a second wiring therein, a second pad electrically connected to the second wiring, and a second coil. The first insulator contacts the second insulator. The first pad contacts the second pad. A part of the first coil overlaps the second coil in the first direction.

A memory device includes a memory cell array having a plurality of memory cell groups with a corresponding plurality of independent channels, and the device and an operating method thereof perform an internal data processing operation for the memory cell groups. The memory device includes an internal command generator configured to generate one or more internal commands in order to perform an internal data processing operation in response to a reception of a command, and an internal common bus for a common internal processing channel which is disposed to be shared by the plurality of memory cell groups and configured to form a transmission path of data between the plurality of memory cell groups when the internal data processing operation is performed.

A method includes: providing a DDR interface between a host memory controller and a memory module; and providing a message interface between the host memory controller and the memory module. The memory module includes a non-volatile memory and a DRAM configured as a DRAM cache of the non-volatile memory. Data stored in the non-volatile memory of the memory module is asynchronously accessible by a non-volatile memory controller of the memory module, and data stored in the DRAM cache is directly and synchronously accessible by the host memory controller.

The present disclosure includes apparatuses and methods for compute in data path. An example apparatus includes an array of memory cells. Sensing circuitry is coupled to the array of memory cells. A shared input/output (I/O) line provides a data path associated with the array. The shared I/O line couples the sensing circuitry to a compute component in the data path of the shared I/O line.

Systems and methods are provided for using page buffers of memory devices connected to a memory controller through a common bus. A page buffer of a memory device is used as a temporary cache for data which is written to the memory cells of the memory device. This can allow the memory controller to use memory devices as temporary caches so that the memory controller can free up space in its own memory.

The present disclosure relates to a method for improving the reading and/or writing phase in storage devices including a plurality of non-volatile memory portions managed by a memory controller, comprising: providing at least a faster memory portion having a lower latency and higher throughput with respect to said non-volatile memory portions and being by-directionally connected to said controller; using said faster memory portion as a read and/or write cache memory for copying the content of memory regions including more frequently read or written logical blocks of said plurality of non-volatile memory portions.
A specific read cache architecture for a managed storage device is also disclosed to implement the above method.