A storage device including control circuitry, communicatively coupled to a non-volatile memory, configured to receive a parity bit that has been stored using a data structure, and to receive a first subset of host data that includes block data relating to a set of memory cells. The control circuitry may be configured to perform a read operation to identify a second subset of host data that includes additional block data relating to the set of memory cells. The control circuitry may be configured to decode the second subset of host data using the parity bit. The control circuitry may be configured to perform a write operation to write the block data to at least one or more memory cells that are part of the set of memory cells.

Some embodiments include an assembly having a stack of first and second alternating levels. The first levels are insulative levels. The second levels are device levels having integrated devices. Each of the integrated devices has a transistor coupled with an associated capacitor, and the capacitor is horizontally offset from the transistor. The transistors have semiconductor channel material, and have transistor gates along the semiconductor channel material. Each of the transistors has a first source/drain region along one side of the semiconductor channel material and coupled with the associated capacitor, and has a second source/drain region. Wordlines extend horizontally along the device levels and are coupled with the transistor gates. Digit lines extend vertically through the device levels and are coupled with the second source/drain regions. Some embodiments include methods of forming integrated structures.

A memory sub-system configured to encode data using an error correcting code and an erasure code for storing data into memory cells and to decode data retrieved from the memory cells. For example, the data units of a predetermined size are separately encoded using the error correcting code (e.g., a low-density parity-check (LDPC) code) to generate parity data of a first layer. Symbols within the data units are cross encoded using the erasure code. Parity symbols of a second layer are calculated according to the erasure code. A collection of parity symbols having a total size equal to the predetermined size can be further encoded using the error correcting code to generate parity data for the parity symbols.

A memory management circuit stores information indicative of reliability-types of regions of a memory array. The memory management circuitry responds to a request to allocate memory in the memory array to a process by determining a request type associated with the request to allocate memory. Memory of the memory array is allocated to the process based on the request type associated with the request to allocate memory and the stored information indicative of reliability-types of regions of the memory array. The memory array may be a shared memory array. The memory array may be organized into rows and columns, and the regions of the memory array may be the rows of the memory array.

Embodiments adaptively determine a read retry threshold voltage for a next read operation using meta information collected from previous failed read data. A controller obtains meta information associated with a read operation on a select page, the meta information including a read threshold voltage set. The controller determines a mathematical model for estimating a checksum value for data associated with a next read operation, using a set function of the read threshold voltage set and a set checksum value. The controller determines a set of parameters by performing polynomial regression on the mathematical model. The controller estimates a next read threshold voltage for the next read operation based on the set of parameters.

Some embodiments include an assembly having a stack of first and second alternating levels. The first levels are insulative levels. The second levels are device levels having integrated devices. Each of the integrated devices has a transistor coupled with an associated capacitor, and the capacitor is horizontally offset from the transistor. The transistors have semiconductor channel material, and have transistor gates along the semiconductor channel material. Each of the transistors has a first source/drain region along one side of the semiconductor channel material and coupled with the associated capacitor, and has a second source/drain region. Wordlines extend horizontally along the device levels and are coupled with the transistor gates. Digit lines extend vertically through the device levels and are coupled with the second source/drain regions. Some embodiments include methods of forming integrated structures.

A material layer stack, a non-volatile memory device comprising the stack, and arrays thereof are described. The material layer stack comprises first and second magnetic tunnel junctions and a first top electrode formed on a top face of the stack. A shoulder is formed on a lateral face of the stack and divides the stack into a lower portion and an upper portion, wherein a tunnel barrier of the first magnetic tunnel junction is comprised by the lower stack portion and a tunnel barrier of the second magnetic tunnel junction by the upper stack portion. A second top electrode is formed on the shoulder. Each magnetic tunnel junction is adapted to store a bit as a reconfigurable magnetoresistance of its magnetic electrodes. Preferably, a bottom face of the stack is connected to a conductor supporting current induced magnetic polarization switching for the first magnetic tunnel junction by spin-orbit torque; magnetic polarization switching for the second magnetic tunnel junction is preferably achieved by spin-transfer torque.

A memory management circuit stores information indicative of reliability-types of regions of a memory array. The memory management circuitry responds to a request to allocate memory in the memory array to a process by determining a request type associated with the request to allocate memory. Memory of the memory array is allocated to the process based on the request type associated with the request to allocate memory and the stored information indicative of reliability-types of regions of the memory array. The memory array may be a shared memory array. The memory array may be organized into rows and columns, and the regions of the memory array may be the rows of the memory array.

A memory sub-system configured to encode data using an error correcting code and an erasure code for storing data into memory cells and to decode data retrieved from the memory cells. For example, the data units of a predetermined size are separately encoded using the error correcting code (e.g., a low-density parity-check (LDPC) code) to generate parity data of a first layer. Symbols within the data units are cross encoded using the erasure code. Parity symbols of a second layer are calculated according to the erasure code. A collection of parity symbols having a total size equal to the predetermined size can be further encoded using the error correcting code to generate parity data for the parity symbols.

An apparatus and/or system is described including a memory device or a controller to perform programming and verification operations including application of a shared voltage level to verify two program voltage levels of a multi-level cell device. For example, in embodiments, the control circuitry performs a program operation to program a memory cell and performs a verification operation by applying a single or shared verify voltage level to verify that the memory cell is programmed to a corresponding program voltage level. In embodiments, the program voltage level is one of two consecutive program voltage levels of a plurality of program voltage levels to be verified by application of the shared verify voltage. Other embodiments are disclosed and claimed.