Methods, systems, and devices for decoding architecture for memory tiles are described. Word line tiles of a memory array may each include multiple word line plates, which may each include a sheet of conductive material that includes a first portion extending in a first direction within a plane along with multiple fingers extending in a second direction within the plane. A pillar tile may include one or more pillars that extend vertically between the word line plate fingers. Memory cells may each be couple with a respective word line plate finger and a respective pillar. Word line decoding circuitry, pillar decoding circuitry, or both, may be located beneath the memory array and in some cases may be shared between adjacent pillar tiles.

A memory device includes a memory cell array including a select transistor and a plurality of memory cells connected in series, each memory cell including a cell transistor and a variable resistance layer connected in parallel. During a write operation, a voltage setting circuit is controlled to apply a first voltage to a selected word line and a second voltage to non-selected word lines. The time period for applying the first voltage to the selected word line starts later than the time period for applying the second voltage to the non-selected word lines and ends earlier than the time period for applying the second voltage to the non-selected word lines.

A nonvolatile memory includes a first memory cell and a second memory cell above the first memory cell. The first memory cell includes a variable resistance layer extending in a first direction, a semiconductor layer extending in the first direction and in contact with the variable resistance layer, an insulator layer extending in the first direction and in contact with the semiconductor layer, and a first voltage applying electrode extending in a second direction and in contact with the insulator layer. The second memory cell includes a second voltage applying electrode in contact with the insulator layer. When a write operation is performed on the first memory cell, a first voltage is applied to the second voltage applying electrode, and when a write operation is performed on the second memory cell, a second voltage, lower than the first voltage, is applied to the first voltage applying electrode.

Methods and apparatuses are disclosed, such as those including a block of memory cells that includes strings of charge storage devices. Each of the strings may comprise a plurality of charge storage devices formed in a plurality of tiers. The apparatus may comprise a plurality of access lines shared by the strings. Each of the plurality of access lines may be coupled to the charge storage devices corresponding to a respective tier of the plurality of tiers. The apparatus may comprise a plurality of sub-sources associated with the strings. Each of the plurality of sub-sources may be coupled to a source select gate of each string of a respective subset of a plurality of subsets of the strings, and each sub-source may be independently selectable from other sub-sources to select the strings of its respective subset independently of other strings corresponding to other subsets.

A vertical nonvolatile memory device including a memory cell string using a resistance change material is disclosed. Each memory cell string of the nonvolatile memory device includes a semiconductor layer extending in a first direction and having a first surface opposite a second surface, a plurality of gates and a plurality of insulators alternately arranged in the first direction and extending in a second direction perpendicular to the first direction, a gate insulating layer extending in the first direction between the plurality of gates and the semiconductor layer and between the plurality of insulators and the semiconductor layer, and a dielectric film extending in the first direction on the surface of the semiconductor layer and having a plurality of movable oxygen vacancies distributed therein.

A variable resistance memory device including a stack including insulating sheets and conductive sheets, which are alternatingly stacked on a substrate, the stack including a vertical hole vertically penetrating therethrough, a bit line on the stack, a conductive pattern electrically connected to the bit line and vertically extending in the vertical hole, and a resistance varying layer between the conductive pattern and an inner side surface of the stack defining the vertical hole may be provided. The resistance varying layer may include a first carbon nanotube electrically connected to the conductive sheets, and a second carbon nanotube electrically connected to the conductive pattern.

Disclosed are a compute-in-memory array and module, and a data computing method; a storage cell is configured to form an array used for computation; the storage cell consists of bitcells serially connected in sequence; a bitcell comprises a switching device and a resistive memory; the switching device is connected in series or in parallel with the resistive memory; the write resistance value of the storage cell is determined by means of controlling the switching state of the switching device so as to change the resistance state of the resistive memory. Since resistive memories have different resistance states, a resistive memory can be set in different resistance states by means of the switching state of the switching device, such that the storage cell is at a required write resistance value, thereby enabling the quick implementation of a write operation of the bitcell.

According to one embodiment, a memory device includes: a variable resistance memory region; a semiconductor layer; an insulating layer; first and second word lines; and a first select gate line. When information stored in the first memory cell is read, or when information is written into the first memory cell, after a voltage of the first select gate line is set to a first voltage and voltages of the first and second word lines are set to a second voltage, the voltage of the first select gate line is increased from the first voltage to a third voltage. After the voltage of the first select gate line is increased to at least the second voltage, the voltage of the first word line is decreased from the second voltage to the first voltage, and the voltage of the second word line is increased from the second voltage to a fourth voltage.

A memory cell includes a first resistive memory element, a second resistive memory element electrically coupled with the first resistive memory element at a common node, and a switching element comprising an input terminal electrically coupled with the common node, the switching element comprising a driver configured to float during one or more operations.

Methods, systems, and devices for a cross-point pillar architecture for memory arrays are described. Multiple selector devices may be configured to access or activate a pillar within a memory array, where the selector devices may each be or include a chalcogenide material. A pillar access line may be coupled with multiple selector devices, where each selector device may correspond to a pillar associated with the pillar access line. Pillar access lines on top and bottom of the pillars of the memory array may be aligned in a square or rectangle formation, or in a hexagonal formation. Pillars and corresponding selector devices on top and bottom of the pillars may be located at overlapping portions of the pillar access lines, thereby forming a cross point architecture for pillar selection or activation. The selector devices may act in pairs to select or activate a pillar upon application of a respective selection voltage.