A standard potential used for reading is set flexibly according to the state of a storage device. A data memory cell group stores data. A reference memory cell group stores a plurality of reference potentials. A standard potential generating section selects a prescribed number of reference potentials from among the plurality of reference potentials stored in the reference memory cell group and generates the standard potential. A reference potential selection control section controls the selection by the standard potential generating section according to prescribed conditions. A sense amplifier amplifies data read out from the data memory cell group, by using the standard potential as a standard.

The present disclosure provides a memory device, which includes a plurality of electrically bipolar variable memory devices and a storage transistor. The electrically bipolar variable memory devices are electrically connected to a plurality of word lines respectively, the storage transistor is electrically connected to the electrically bipolar variable memory devices, where one end of each of the electrically bipolar variable memory devices is electrically connected to a corresponding one of the word lines, and another end of each of the electrically bipolar variable memory devices is electrically connected to the gate of the storage transistor.

According to one embodiment, in a nonvolatile semiconductor memory device, in a cell block, a local bit line is connected to a bit line via a select transistor. The local bit line extends in a third direction. A local source line is connected to a source line and extends in the third direction. A plurality of memory cells are connected in parallel between the local source line and the local bit line. Each of the memory cells includes a cell transistor and a resistance change element. The cell transistor has a gate connected to a corresponding one of the word lines and one end connected to one of the local bit line or the local source line. The resistance change element is connected between the other end of the cell transistor and the other one of the local bit line or the local source line.

Embodiments of the present invention include a memory cell that has a vertically-oriented fin. The memory cell may also include a resistive memory device located on a first lateral side of the fin. The resistive memory device may include a bottom electrode, a top electrode, and a resistive element between the bottom electrode and the top electrode. The memory cell may also include a vertical field-effect transistor having a metal gate and a gate dielectric contacting a second lateral side of the fin opposite the first lateral side.

A method of forming a filament in a resistive random-access memory (RRAM) device includes applying a cell voltage across a resistive layer of the RRAM device, detecting an increase in a current through the resistive layer generated in response to the applied cell voltage, and in response to detecting the increase in the current, using a first switching device to reduce the current through the resistive layer.

A memory device includes first to nth decks respectively coupled to first to nth row lines which are stacked over a substrate in a vertical direction perpendicular to a surface of the substrate, n being a positive integer, a first connection structure extending from the substrate in the vertical direction to be coupled to the first row line, even-numbered connection structures extending from the substrate in the vertical direction and respectively coupled to ends of even-numbered row lines among the second to nth row lines, and odd-numbered connection structures extending from the substrate in the vertical direction and respectively coupled to ends of odd-numbered row lines among the second to nth row lines. The even-numbered connection structures are spaced apart from the odd-numbered connection structures with the first row line and the first connection structure that are interposed between the even-numbered connection structures and the odd-numbered connection structures.

A method for programming at least one resistive memory cell of an array of resistive memory cells, includes a sequence of N programming cycles, N being an integer greater than or equal to 2, each programming cycle including a set procedure and a reset procedure, each set procedure including the application of a set technique chosen among a plurality of set techniques, the method including acquiring a bit error ratio value corresponding to each programming cycle for each set technique; and at each programming cycle, applying the set technique having the lowest bit error ratio value corresponding to the programming cycle.

IC devices with stacked backend memory with resistive switching devices are disclosed. An example IC device includes a support structure, a frontend layer with a plurality of frontend devices, and a backend layer with a plurality of resistive switching devices, the resistive switching devices being, e.g., part of memory cells of stacked backend memory. For example, the backend layer may implement stacked arrays of 1T-1RSD memory cells, with resistive switching devices coupled to some S/D regions of access transistors of the memory cells. Such memory cells may be used to implement stacked eMRAM or eRRAM, with access transistors being TFTs. Stacked TFT-based eMRAM or eRRAM as described herein may help increase density of MRAM or RRAM cells, hide the peripheral circuits that control the memory operation below the memory arrays, and address the scaling challenge of some conventional memory technologies.

A semiconductor storage device includes a memory cell including a core portion that extends in a first direction above a semiconductor substrate; a variable resistance layer that extends in the first direction and is in contact with the core portion; a semiconductor layer that extends in the first direction and is in contact with the variable resistance layer; a first insulator layer that extends in the first direction and is in contact with the semiconductor layer; and a first voltage applying electrode that extends in a second direction orthogonal to the first direction and is in contact with the first insulator layer. The core portion is a vacuum region, or a region containing inert gas.

A DIMA semiconductor structure is disclosed. The DIMA semiconductor structure includes a frontend including a semiconductor substrate, a transistor switch of a memory cell coupled to the semiconductor substrate and a computation circuit on the periphery of the frontend coupled to the semiconductor substrate. Additionally, the DIMA includes a backend that includes an RRAM component of the memory cell that is coupled to the transistor switch.