The invention provides a storage structure and an erase method thereof, capable of performing an erase operation on a plurality of memory blocks. The storage structure includes: a first storage body, a second storage body, a third storage body, and a controller. Memory blocks are sequentially alternately stored in the first memory bank, the second memory bank, and the third memory bank, and the controller is configured to control each memory block to sequentially undergo a first process, a second process and a third process. The erase method includes: when the memory block Bi undergoes the third process, the memory block Bi+1 undergoes the second process, and the memory block Bi+2 undergoes the first process at the same time; where i∈[1, n−2]. Three adjacent blocks undergo the first process, the second process, and the third process simultaneously.

An indication to perform a write operation at a memory component can be received. A voltage pulse can be applied to a destination block of the memory component to store data of the write operation, the voltage pulse being at a first voltage level associated with a programmed state. An erase operation for the destination block can be performed to change the voltage state of the memory cell from the programmed state to a second voltage state associated with an erased state. A write operation can be performed to write the data to the destination block upon changing the voltage state of the memory cell to the second voltage state.

Embodiments of the present disclosure are directed towards techniques and configurations for a memory apparatus configured with an erase command comprising a sequence of segments. In one embodiment, the memory apparatus is configured to generate an erase command in response to a request provided by a host to erase at least a portion of data stored in a memory device. The erase command comprises a sequence of erase segments that provide an erase voltage for erasing the portion of data stored in the memory apparatus. The memory apparatus is configured to grant access to the memory apparatus for servicing the memory access requests initiated by the host, during a time period between at least two adjacent erase segments in the sequence. Other embodiments may be described and/or claimed.

A memory device is disclosed configured to share word line switches (WLSW) between each word line of two adjacent erase blocks. The word lines are driven from both sides of the memory array to reduces resistive-capacitive (RC) loading during pre-charge/ramp-up periods and during discharge/ramp-down periods for various storage operations. The dual-sided driving of signals combines with synergistic erase block size management to lower read latency (tR) for non-volatile memory media.

A request to perform a write operation at a memory component can be received. A destination block of the memory component to store data of the write operation can be determined. A voltage pulse can be applied to the destination block that places a memory cell of the destination block at a voltage level associated with a high voltage state. Responsive to applying the voltage pulse to the destination block, an erase operation for the destination block can be performed to change the voltage level of the memory cell from the high voltage state to a low voltage state. A write operation can be performed to write the data to the destination block that is at the low voltage state.

A semiconductor memory device includes: a memory cell array including a plurality of conductive layers, a semiconductor layer, and charge accumulating sections; and a control circuit that executes an erase operation. The erase operation includes an erase mode that executes a first erase flow. The first erase flow includes: a first write operation in which a first program voltage is applied to the plurality of conductive layers; a first erase operation that is executed after the first write operation, and in which, while a first voltage is applied to a first conductive layer, a voltage higher than the first voltage is applied to the second conductive layer; and a second erase operation that is executed after the first erase operation, and in which, while the first voltage is applied to a second conductive layer, a voltage higher than the first voltage is applied to the first conductive layer.

A semiconductor memory device includes a first block and a second block arranged adjacent to each other in a Y direction. Each of the first and second blocks includes conductive layers extended in an X direction, memory trenches between the conductive layers, memory pillars provided across two conductive layers with a memory trench interposed therebetween, and transistors provided between the memory pillars and the conductive layers. One of the conductive layers provided at an end of the first block in the Y direction is electrically connected to one of the conductive layers provided at an end of the second block.

A semiconductor memory device comprises: a memory cell array comprising a plurality of conductive layers, a semiconductor layer, and charge accumulating sections; and a control circuit that executes an erase operation. The plurality of conductive layers include: one or a plurality not adjacent in a first direction, of first conductive layers; and one or a plurality not adjacent in the first direction, of second conductive layers different from the first conductive layers. The erase operation includes an erase mode that executes a first erase flow. The first erase flow includes: a first write operation in which a first program voltage is applied to the plurality of conductive layers; a first erase operation that is executed after the first write operation, and in which, while a first voltage is applied to the first conductive layer, a voltage higher than the first voltage is applied to the second conductive layer; and a second erase operation that is executed after the first erase operation, and in which, while the first voltage is applied to the second conductive layer, a voltage higher than the first voltage is applied to the first conductive layer.

A request to perform a write operation at a memory component can be received. A destination block of the memory component to store data of the write operation can be determined. A voltage pulse can be applied to the destination block that places a memory cell of the destination block at a voltage level associated with a high voltage state. Responsive to applying the voltage pulse to the destination block, an erase operation for the destination block can be performed to change the voltage level of the memory cell from the high voltage state to a low voltage state. A write operation can be performed to write the data to the destination block that is at the low voltage state.

A variety of applications can include systems and methods that include a memory system tester having an analyzer coupled to a test flow controller. The test flow controller can be arranged to generate test signals to a memory system with the analyzer arranged to couple to test pads of a package platform for the memory system. The analyzer can provide data to the test flow controller to conduct testing and/or debugging of the memory system, with the data based on real time monitoring of the test pads of the package platform. In various embodiments, the analyzer can provide data feedback to the test flow controller in real time such that the test flow controller can control the flow of test signals to the memory system in real time. Additional apparatus, systems, and methods are disclosed.