A memory cell array includes a plurality of memory blocks, each memory block having a plurality of memory cells stacked on a substrate in a direction perpendicular to the substrate. A row decoder circuit is connected to the plurality of memory cells through a plurality of word lines, selecting a first memory block of the plurality of memory blocks. A page buffer circuit is connected to the plurality of memory cells through a plurality of bit lines. A control logic circuit applies an erase voltage to the substrate during an erase operation, outputting a word line voltage having a first word line voltage and a second word line voltage to the row decoder circuit. During the erase operation, the row decoder circuit applies the first word line voltage to each word line of the first memory block and then applies the second word line voltage to each word line.

A memory device includes a memory cell array including a plurality of blocks, a power supply unit suitable for generating at least one erase voltage and supplying the at least one erase voltage to the memory cell array, a control logic suitable for receiving multi-block erase information for the same plane, sequentially transmitting block address information included in the multi-block erase information to the row decoder, and outputting an erase control signal to the power supply unit when a last block address information is transmitted, and a row decoder suitable for decoding the block addresses and selecting an erase block of the memory cell array.

A split gate NAND flash memory structure is formed on a semiconductor substrate of a first conductivity type. The NAND structure comprises a first region of a second conductivity type in the substrate with a second region of the second conductivity type in the substrate, spaced apart from the first region. A continuous first channel region is defined between the first region and the second region. A plurality of floating gates are spaced apart from one another with each positioned over a separate portion of the channel region. A plurality of control gates are provided with each associated with and adjacent to a floating gate. Each control gate has two portions: a first portion over a portion of the channel region and a second portion over the associated floating gate and capacitively coupled thereto.

A method is provided for operating a NAND array that includes a plurality of blocks of memory cells. A block of memory cells in the plurality of blocks includes a plurality of NAND strings having channel lines between first string select switches and second string select switches. The plurality of NAND strings shares a set of word lines between the first and second string select switches. A channel-side erase voltage is applied to the channel lines through the first string select switches in a selected block. Word line-side erase voltages are applied to a selected subset including more than one member of the set of word lines shared by NAND strings in the selected block to induce tunneling in memory cells coupled to the selected subset, while tunneling is inhibited in memory cells coupled to an unselected subset including more than one member of the set of word lines.

A split gate NAND flash memory structure is formed on a semiconductor substrate of a first conductivity type. The NAND structure comprises a first region of a second conductivity type in the substrate with a second region of the second conductivity type in the substrate, spaced apart from the first region. A continuous first channel region is defined between the first region and the second region. A plurality of floating gates are spaced apart from one another with each positioned over a separate portion of the channel region. A plurality of control gates are provided with each associated with and adjacent to a floating gate. Each control gate has two portions: a first portion over a portion of the channel region and a second portion over the associated floating gate and capacitively coupled thereto.