Disclosed are a testing apparatus and a testing method. When the testing apparatus is used to test a sample (11) to be tested, a first detection apparatus (21) and a second detection apparatus (22) can be switched by means of an objective lens switching apparatus (20), so as to acquire height information and structure information of the sample (11) to be tested. In the process, the sample (11) to be tested does not need to be transferred between testing apparatuses, thus, not only is pollution potentially created in the process of transferring the sample (11) to be tested avoided, and the probability of the sample (11) to be tested being polluted in the testing process reduced, but also a region to be tested of the sample (11) to be tested does not need to be determined repeatedly, improving the testing speed for the sample (11) to be tested.

An optical system can include a mirror that reflects incoming light to a sensor for detection. The position and/or orientation of the mirror can be controlled to reflect incoming light from different locations and/or directions. Position and/or orientation of the mirror may be tracked and/or detected by an optical position sensor. The position sensor can transmit a beam to a reflector on the mirror, and the reflected beam can be received by the position sensor. Characteristics of the reflected beam can be measured to determine the position and/or orientation of the mirror. For example, the beam can be used for interferometric and/or intensity measurements, which can then be correlated with a position and/or orientation of the mirror.

Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The plurality of interference signals are transformed by the at least one processor into a plurality of spectrum signals each corresponding to the respective one of the positions on the surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.

Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The interference signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.

Embodiments of systems for classifying interference signals are disclosed. In an example, a system for classifying interference signals includes an interferometer including a light source and a detector, and at least one processor. The interferometer is configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip. A spectrum of the light source is greater than a spectrum of white light. The at least one processor is configured to classify the interference signals into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.

Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals and a plurality of spectrum signals are received by at least one processor. Each of the interference signals and spectrum signals corresponds to a respective one of a plurality of positions on a surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.

An optical inspection apparatus includes an interferometer module, which is configured to direct a beam of coherent light toward an area under inspection and to produce a first image of interference fringes of the area. The apparatus also includes a triangulation module configured to project a pattern of structured light onto the area, and at least one image sensor configured to capture the first image of interference fringes and a second image of the pattern that is reflected from the area. Beam combiner optics are configured to direct the beam of coherent light and the projected pattern to impinge on the same location on the area. A processor is configured to process the first and second images in order to generate a 3D map of the area.

A lens refractive index detection device is disclosed which has a light source module, a lens center physical thickness detection module and a lens center optical thickness detection module. The light source module includes a first light source component and a second light source component for outputting a collimated light beam, a first light combining component, and a focusing component. The lens center physical thickness detection module includes a first imaging component and a second imaging component. The lens center optical thickness detection module includes a first photodetection component and a second photodetection component, a beam splitting component, a partial reflection mirror, and a movable reflection mirror. The lens refractive index detection device enables simple operation, fast and non-destructive on-line detection, and is also applicable to lenses with irregular surfaces, such as aspherical lenses, cylindrical lenses, and finished lenses. A lens refractive index detection method is also provided.

Exemplary systems, devices, methods, apparatus and computer-accessible media for providing and/or utilizing optical frequency domain imaging (OFDI) and fluorescence of structures and, e.g., multimodality imaging using OFDI techniques and fluorescence imaging techniques are described. For example, an arrangement can provide at least one electro-magnetic radiation to an anatomical structure. Such exemplary arrangement can include at least one optical core and at least one cladding at least partially surrounding the fiber(s). A region between the optical core(s) and the cladding(s) can have an index that is different from indexes of the optical core(s) and the cladding(s). The arrangement can also include at least one apparatus which is configured to transmit the radiation(s) via the optical core(s) and the cladding(s) to the anatomical structure.

The present disclosure relates to a tracking system for tracking the position and orientation of an object in an environment, the tracking system including: (a) a tracking base positioned in the environment; (b) a tracking target mountable to the object, wherein in use the tracking base is linked to the tracking target by: (i) a bidirectional light beam transmitted therebetween; and, (ii) a unidirectional light beam transmitted therebetween, said unidirectional light beam parallel to the bidirectional light beam; and, (c) at least one controller configured to determine a roll angle of the tracking target relative to the tracking base, the roll angle determined at least in part by signals received from a sensor housed in at least one of the tracking base and the tracking target that detects the unidirectional light beam.