A system for the automated validation of a semi-anechoic chamber (SAC) is disclosed. The system includes a receive assembly and a transmit assembly, each configured to autonomously relocate within the SAC. The system also includes a local client communicatively coupled to the transmit assembly. The local client is configured to send a validation arrangement to the transmit assembly describing a validation location and a distance. The transmit assembly is configured to receive the validation arrangement, move the transmit assembly to the validation location and send an instruction to the receive assembly, the instruction describing the distance. The receive assembly is communicatively coupled to the transmit assembly and configured to receive the instruction and move the receive assembly such that a separation between the transmit and receive assemblies is restored to the distance. Each validation arrangement corresponds to a validation point. A plurality of validation points defines a test volume.

A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

A sensor system that obtains and processes time-of-flight data (TOF) is provided. A TOF sensor obtains raw data describing various surfaces. A processor applies an averaging filter to the raw data to smooth the raw data for increasing signal-to-noise ratio (SNR) of flat surfaces represented in the raw data, performs a depth compute process on the raw data, as filtered, to generate distance data, generates a point cloud based on the distance data, and identifies the Z-planes in the point cloud.

Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals and a plurality of spectrum signals are received by at least one processor. Each of the interference signals and spectrum signals corresponds to a respective one of a plurality of positions on a surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.

A laser processing apparatus includes a laser light output section, a first scanner and a second scanner, a distance measurement light emitting section, a reference member which is arranged at a position which is the other end of a correction optical path formed with the distance measurement light emitting section as one end of the correction optical path and is arranged such that an optical path length of the correction optical path is a predetermined reference distance, a distance measurement light receiving section which receives distance measurement light reflected by the workpiece or the reference member, a distance measuring section which measures a distance to the workpiece or the reference member, and a distance correcting section which compares a measurement result of the distance to the reference member with the reference distance stored in advance to correct the measurement result obtained by the distance measuring section.

An optical system configured to measure a raised or receded surface feature on a surface of a sample may comprise a broadband light source; a tunable filter configured to filter broadband light emitted from the broadband light source and to generate a first light beam at a selected wavelength; a linewidth control element configured to receive the first light beam and to generate a second light beam having a predefined linewidth and a predetermined coherence length; collimating optics optically coupled to the second light beam and configured to collimate the second light beam; collinearizing optics optically coupled to the collimating optics and configured to align the collimated second light beam onto the raised or receded surface feature of the sample, and a processor system and at least one digital imager configured to measure a height of the raised surface or depth of the receded surface from light reflected at least from those surfaces.

A distance sensor is used for automatically determining the size of a wheel on a mobile machine. The distance sensor is mounted to detect distance information relating to a distance between the sensor and an outer circumferential surface of the wheel. The distance information is received by a controller configured to determine the radius of the wheel based at least in part on the distance information. The controller may compare the measured radius with data for a range of standard wheel sizes and determine which standard wheel size is fitted. The measured wheel radius and/or the determined standard wheel size can used as an input for a control system on the machine which requires wheel size data, such as an axle height adjustment system.

A measuring unit of a measuring apparatus includes a light source that emits light in a predetermined wavelength region, a condenser lens that applies the light emitted by the light source, to a plate-shaped workpiece held by a chuck table, a collimating lens that forms return light reflected by the plate-shaped workpiece into parallel light, a transmission filter that transmits interference light of the return light formed into the parallel light, a sensor that has coordinates for receiving the interference light transmitted through the transmission filter and detecting light intensity, and a controller that determines a coordinate position at which the light intensity detected by the sensor is high, as the thickness or height of the plate-shaped workpiece.

An auto clean machine comprising: a height computing device; and an obstacle determining device. The height computing device is turned on to compute a height or an overhang height of an obstacle when the obstacle determining device determines the obstacle exists in a predetermined region of the auto clean machine. The height computing device does not compute the height and the overhang height when the obstacle determining device does not determine the obstacle exists in the predetermined region.

A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.