The present invention provides a gyroscope structure. A frame disposed on a substrate, and a flexible element is correspondingly disposed a first, second, and third plate. The first plate has a second flexibility. The second plate is connected to the second plate, the second plate is connected to the third plate with a fourth flexible element, the second plate is provided with a first through-hole, and a rotating plate is pivotally connected in the first through-hole. The rotating plate is connected to a supporting column of the substrate by a fifth flexible part, and then a sensing element is provided on the substrate corresponding to the first, second, and third plates to sense the movement and movement of the plates. Rotating, in one embodiment, the first and third plates are provided with through-holes, and corresponding sensing elements and driving elements are provided.

The present invention provides a gyroscope structure. A frame disposed on a substrate, and a flexible element is correspondingly disposed a first, second, and third plate. The first plate has a second flexibility. The second plate is connected to the second plate, the second plate is connected to the third plate with a fourth flexible element, the second plate is provided with a first through-hole, and a rotating plate is pivotally connected in the first through-hole. The rotating plate is connected to a supporting column of the substrate by a fifth flexible part, and then a sensing element is provided on the substrate corresponding to the first, second, and third plates to sense the movement and movement of the plates. Rotating, in one embodiment, the first and third plates are provided with through-holes, and corresponding sensing elements and driving elements are provided.

A method for forming a MEMS structure for an inertial sensor from fused silica includes: depositing a conductive layer on one or more selected regions of a first surface of a fused silica substrate, and illuminating areas of the fused silica substrate with laser radiation in a pattern defining features of the MEMS structure for an inertial sensor. A masking layer is deposited at least on the one or more selected regions of the first surface of the fused silica substrate where the conductive layer has been deposited, such that the illuminated areas of the fused silica substrate remain exposed. A first etch of the exposed areas of the fused silica substrate is performed so as to selectively etch the pattern defining features of the MEMS structure for an inertial sensor.

A method for forming a MEMS structure for an inertial sensor from fused silica includes: depositing a conductive layer on one or more selected regions of a first surface of a fused silica substrate, and illuminating areas of the fused silica substrate with laser radiation in a pattern defining features of the MEMS structure for an inertial sensor. A masking layer is deposited at least on the one or more selected regions of the first surface of the fused silica substrate where the conductive layer has been deposited, such that the illuminated areas of the fused silica substrate remain exposed. A first etch of the exposed areas of the fused silica substrate is performed so as to selectively etch the pattern defining features of the MEMS structure for an inertial sensor.

Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.

A microelectromechanical resonator is provided with two proof masses that are coupled with an anti-phase coupling structure that includes a seesaw lever and a force-displacement lever. Moreover, a joint extends from the seesaw lever to the force-displacement lever and a mass connection element extends from each proof masse to the adjacent lever.

A microelectromechanical resonator is provided with two proof masses that are coupled with an anti-phase coupling structure that includes a seesaw lever and a force-displacement lever. Moreover, a joint extends from the seesaw lever to the force-displacement lever and a mass connection element extends from each proof masse to the adjacent lever.

A physical quantity sensor includes: an oscillating body having a support section and a movable section which is connected to the support section through connection portions, in which the movable section has a first movable portion and a second movable portion; a first fixed electrode which is disposed to face the first movable portion; a second fixed electrode which is disposed to face the second movable portion; and a dummy electrode which is disposed to face the second movable portion so as not to overlap the second fixed electrode and has the same potential as potential of the oscillating body, in which the first fixed electrode is disposed such that a portion thereof overlaps the support section when viewed in a plan view.

A physical quantity sensor includes: an oscillating body having a support section and a movable section which is connected to the support section through connection portions, in which the movable section has a first movable portion and a second movable portion; a first fixed electrode which is disposed to face the first movable portion; a second fixed electrode which is disposed to face the second movable portion; and a dummy electrode which is disposed to face the second movable portion so as not to overlap the second fixed electrode and has the same potential as potential of the oscillating body, in which the first fixed electrode is disposed such that a portion thereof overlaps the support section when viewed in a plan view.

An inertial force sensor includes: an acceleration detection element; a temperature sensor that detects an ambient temperature of the acceleration detection element; a bridge circuit that processes an output signal from the acceleration detection element; an AD converter that converts an analog signal output from the bridge circuit into a digital signal, and outputs the digital signal; a calculation circuit that performs calculation on the output signal from the AD converter; and a storage that stores correction data for correcting a variation in the output signal from the AD converter due to a temperature change. The correction data are coefficients of a formula expressed by a calibration curve that is a quadratic or higher-degree curve, and the storage stores, as the correction data, the coefficients of the calibration curve of each of a plurality of patterns that differ between a predetermined temperature or more and less than the predetermined temperature.