A temperature measuring device includes a device main body, a signal control module, a movable shutter module, and a first and a second non-contacting temperature sensing module. The movable shutter module includes an electric control driver, a movable shutter structure, and an electric control heater, and the movable shutter structure includes a black substance for generating a predetermined heating temperature from being heated by the electric control heater. The first non-contacting temperature sensing module is configured for measuring an object temperature of an object so as to obtain object temperature information of the object. The second non-contacting temperature sensing module is configured for measuring the predetermined heating temperature generated by the black substance of the movable shutter structure so as to obtain black body temperature information of the black substance. The first non-contacting temperature sensing module can be calibrated according to the black body temperature information.

Techniques are provided for variable sensitivity in infrared imaging. In one example, an infrared imaging system includes an infrared imager and a logic device. The infrared imager is configured to capture a first infrared image of a scene using a sensitivity setting. The logic device is configured to determine a temperature associated with the scene based on a second infrared image of the scene. The logic device is further configured to determine the sensitivity setting based on an ambient temperature associated with the infrared imager and the temperature associated with the scene. Related devices and methods are also provided.

Techniques for facilitating vacuum health detection for imaging systems and methods are provided. In one example, an imaging device includes a detector configured to generate a first reference signal. The imaging device further includes a buffer circuit configured to store a value of the first reference signal. The imaging device further includes a processing circuit coupled to the buffer circuit. The processing circuit is configured to determine a first predetermined value based on a first temperature associated with the detector. The processing circuit is further configured to determine vacuum integrity associated with the detector based at least on the value of the first reference signal and the first predetermined value. Related methods and systems are also provided.

A system for measuring temperature of one or more subjects within a scene including a reference object having an unknown emissivity, having an ambient temperature, the system comprising: a visible spectrum camera capable of acquiring images of the scene comprising (a) at least a Region of Interest (RoI) of each of the subjects, and (b) the reference object; a thermal image sensor capable of acquiring images of the scene comprising (a) at least the RoI of each of the subjects, and (b) the reference object; and a processing circuitry configured to: obtain (a) a visible spectrum image captured by the visible spectrum camera, and (b) a thermal image captured by the thermal image sensor, and (c) an indication of a scene ambient temperature within the scene; register the visible spectrum image and the thermal image onto a common coordinate system; identify (a) RoI pixels, on the common coordinate system, of the RoIs of the subjects within the visible spectrum image, (b) reference object pixels, on the common coordinate system, of the reference object within the visible spectrum image and (c) a parameter correlated to an emissivity of the reference object, based on the reference temperature and on the indication of the scene ambient temperature; determine (a) RoI temperatures by analyzing respective RoIs pixels on the thermal image, and (b) a reference temperature by analyzing the reference object pixels on the thermal image; and upon existence of a difference between the reference temperature and the scene ambient temperature, correct the RoI temperatures, based on the difference and utilizing the parameter, to compensate for the difference, giving rise to corrected RoI temperatures.

An infrared temperature sensor comprises a thermopile sensor and an infrared reflector, wherein the infrared reflector reflects the infrared ray radiated by a target to a first thermopile sensing element of the thermopile sensor to sense the temperature of the target. By appropriately designing the reflecting surface of the infrared reflector, a horizontal viewing angle of a sensing range of the infrared temperature sensor can be larger, while a vertical viewing angle is smaller. The thermopile sensor further comprises a second thermopile sensing element, which can sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by the temperature variation of the package structure, which results from the variation of the environmental temperature. Thus, the measurement accuracy is increased.

A two-dimensional terahertz radiation detector includes a spectral conversion element, an array of microlenses, and a matrix image sensor. Such a detector can be particularly compact, light, and inexpensive. For some embodiments, it can be used to produce multispectral images of an external scene, from terahertz radiation that originates from the scene.

This infrared imaging device includes: an infrared transmission lens which collects infrared light emitted from an object; an infrared imaging element having a screen in which pixels for converting infrared light collected by the infrared transmission lens to electric signals are arranged in a two-dimensional array; a signal processing unit which converts electric signals from the infrared imaging element to digital signals; an optical characteristics correction unit which performs optical characteristics correction for an output of the signal processing unit on the basis of non-image-formation information set in advance for the infrared transmission lens; a reference temperature detection unit which detects a reference temperature; and a temperature measurement unit which performs absolute temperature conversion for the object on the basis of an output of the optical characteristics correction unit and an output of the reference temperature detection unit.

An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.

A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

Systems, methods, and computer program products for thermal contrast determinations are provided. An example imaging system includes a first infrared (IR) imaging device that generates first IR image data of a field of view of the first IR imaging device and a computing device connected with the first IR imaging device. The computing device receives probe temperature data from a temperature probe indicative of an external environment of the imaging system and receives the first IR image data from the first IR imaging device. The computing device determines background temperature data based upon the first IR image data, determines gas temperature data based upon the probe temperature data, and determines a thermal contrast for each pixel based upon a comparison between the background temperature data and the gas temperature data. The computing device further determines a detection limit for each pixel as a function of thermal contrast.