A temperature measurement system includes a thermal camera configured to capture a thermal image of individuals in a viewing space of the thermal camera to detect temperatures of the individuals. A reference device is configured to present a reference temperature for detection by the thermal camera when the reference device is disposed in the viewing space of the thermal camera. The reference device is configured to maintain thermal stability in harsh or hazardous environments so that the system provides accurate and precise temperature detection of the individuals in the viewing space of the thermal camera.

A thermal radiation light detection device includes: a housing including a plurality of wall portions; a light entrance unit attached to a wall portion and configured to cause thermal radiation light to enter the housing; a light extraction unit disposed inside housing and configured to extract light of a first wavelength and light of a second wavelength from the thermal radiation light, the second wavelength being different from the first wavelength; a first light detection unit attached to a wall portion and configured to detect the light of the first wavelength; a second light detection unit attached to a wall portion and configured to detect the light of the second wavelength; and a first temperature detection unit attached to a wall portion, the wall portion to which the first temperature detection unit is attached being different from the wall portion to which the first light detection unit is attached.

Disclosed is an error correction unit enabling constant accurate measurement of a moving object by correcting an error attributable to a change in sensitivity of a thermal image sensor, a change in distance between a thermal image sensor and an object, or an ambient environment. Further disclosed is an object temperature detection device equipped with the same. The error correction unit includes a first arm member rotatably coupled to a thermal imaging camera unit, a heating element holder rotatably coupled to the first arm member, the heating element fixed to the heating element holder, and a temperature sensor configured to measure a temperature of the heating element. The heating element is positioned within an angle of view of the thermal imaging camera unit through rotational motion of the first arm member and the heating element holder. The temperature sensor measures the temperature of the heating element at a first time and a second time different from the first time so that the controller can use a temperature change value of the heating element. Data of the temperatures of the heating element, which are measured respectively at the first time and the second time, are transmitted to the controller.

A device may include a first infrared sensor, a second infrared sensor, a temperature detecting component, and an occupancy detecting component. The first infrared sensor may connect to the temperature detecting component through a first temperature signal path and the occupancy detecting component through a first occupancy signal path. The second infrared sensor may connect to the temperature detecting component through a second temperature signal path and the occupancy detecting component through a second occupancy signal path. The temperature detecting component may determine a temperature measurement by calculating an average of a value received from the first temperature signal path and a value received from the second temperature signal path. The occupancy detecting component may determine an occupancy measurement by calculating a difference of the value received from the first occupancy signal path and the value received from the second occupancy signal path.

A temperature measurement system for measuring a temperature of a measured surface includes: 1) a first temperature sensor; and 2) a reference surface including a second temperature sensor integrated therein. The first temperature sensor includes a field of view simultaneously covering both at least a portion of the measured surface and at least a portion of the reference surface, thus is configured for simultaneously taking a first measurement of both the portion of the measured surface and the portion of the reference surface. The first measurement of the reference surface taken by the first temperature sensor is compared to a second measurement taken by the second temperature sensor for use in calibrating the first temperature sensor.

A human body detecting device includes a pyroelectric infrared radial (PIR) sensor, a thermometer, a processor, an amplifying unit, and a plurality of amplification adjusting units. The PIR sensor is configured to sense infrared radiation and then generate an electronic signal. The thermometer is configured to sense an ambient temperature and then generate a temperature value. The microprocessor is electrically connected to the thermometer, and the amplifying unit is electrically connected to the pyroelectric infrared radial sensor and the microprocessor. The amplification adjusting units corresponding to a plurality of temperature intervals are electrically connected to the microprocessor and the amplifying unit. The microprocessor selects to enable one of the amplification adjusting units based on a comparison between the temperature value and the temperature intervals, such that the amplifying unit may modulate the electrical signal according to the enabled amplification adjusting unit.

In a method for noncontact, radiation thermometric temperature measurement, a short-circuit photocurrent that is proportional to a received radiant power is produced in a photodiode radiation detector that is operating photovoltaically without bias voltage. The photocurrent is processed in a current to voltage converter. Subsequently, a temperature signal corresponding to the radiant power is generated. A corrective current, dependent on a temperature of the photodiode radiation detector, is added to the short-circuit photocurrent to compensate a fault current, wherein the fault current is based on an input bias current and an input offset voltage of the current to voltage converter across a temperature-dependent shunt resistance of the photodiode radiation detector. A device with a corrective current source controlled by a microcontroller is provided that can be used to perform the method.

An IR camera includes: a thermal radiation capturing arrangement for capturing thermal radiation of an imaged view in response to input control unit(s) receiving user inputs from a user of the IR camera; a processing unit arranged to process the thermal radiation data in order for the thermal radiation data to be displayed by an IR camera display as thermal images; and an IR camera display arranged to display thermal images to a user of the IR camera. The processing unit is further arranged to determine at least one temperature reference value representing the temperature of the surrounding environment of the imaged view; and calculate at least one output power value indicative of an amount of energy dissipated in a part of the imaged view by using the temperature value of the thermal radiation data corresponding to said part of the imaged view and the at least one determined temperature reference value.

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for generating a first light wave by an emitter of the sensor system and detecting a second light wave by a detector of the sensor system. The second light wave is detected in response to the first light wave being reflected from a target object. The sensor system includes a first converter that obtains a first temperature measurement from a temperature sensor of the sensor system at least when the first light wave is generated or when the second light wave is detected. A temperature controller computes temperature coefficients to regulate a temperature of the sensor system. Each of the temperature coefficients are computed based on a difference between the first temperature and a reference temperature. The temperature controller generates a control signal to regulate the temperature of the sensor system based on the computed temperature coefficients.

FPAs on a wafer can be tested prior to dicing the wafer into individual dies. A focal plane array (FPA) can comprise an array of photodetectors, such as microbolometers, on a semiconductor substrate or die. FPAs can be manufactured on a wafer to make multiple FPAs on a single wafer that can be later diced or divided into individual FPAs. Prior to dicing the wafer, the FPAs can be tested electrically and radiometrically in bulk to characterize individual FPAs, to identify bad pixels, to identify bad chips, to calibrate individual FPAs, and the like. These test results can be used to determine acceptable FPAs and can be used to provide initial settings for imaging systems with the tested and integrated FPA.