There is provided a fiber optic temperature probe having a base, a first tube connected to the base, a second tube provided coaxially within the first tube, a probe tip extending through an opening in a distal end of the first tube; and an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube. There is also provided a fiber optic temperature probe having a base, a first tube connected to the base, a probe tip extending through an opening in a distal end of the first tube, an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube, and a first lens positioned between the probe tip and the optical fiber.

There is provided a fiber optic temperature probe having a base, a first tube connected to the base, a second tube provided coaxially within the first tube, a probe tip extending through an opening in a distal end of the first tube; and an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube. There is also provided a fiber optic temperature probe having a base, a first tube connected to the base, a probe tip extending through an opening in a distal end of the first tube, an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube, and a first lens positioned between the probe tip and the optical fiber.

An infrared-detecting device, includes an infrared detector configured to emit a signal representative of the thermal radiation of a hotspot, and a light source configured to emit an incident beam, preferably in a window of UV or visible wavelength. The infrared-detecting device furthermore comprises a synchronizing device connected to the light source and to the infrared detector or to the processing module, and configured to emit a synchronization signal, the infrared detector being configured to be activated in a preset time window depending on said synchronization signal.

An infrared-detecting device, includes an infrared detector configured to emit a signal representative of the thermal radiation of a hotspot, and a light source configured to emit an incident beam, preferably in a window of UV or visible wavelength. The infrared-detecting device furthermore comprises a synchronizing device connected to the light source and to the infrared detector or to the processing module, and configured to emit a synchronization signal, the infrared detector being configured to be activated in a preset time window depending on said synchronization signal.

An electromagnetic wave detection apparatus comprises a first image formation unit, a travel unit 18, a second image formation unit, and a first detector. The travel unit 18 includes a plurality of pixels px arranged along a reference surface. The electromagnetic wave detection apparatus has at least one of: an arrangement in which respective extension surfaces of the reference surface and a detection surface of the first detector intersect each other and a main axis of the second image formation unit intersects the reference surface and the detection surface of the first detector; and an arrangement in which respective extension surfaces of the reference surface and an object surface of the first image formation unit whose spacing to the travel unit is set and whose image surface is the reference surface intersect each other and a main axis of the first image formation unit intersects the reference surface.

An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

An infrared image sensor includes a first integrate circuit (IC), a bolometer disposed on or above one surface of the first IC configured to detect infrared rays passing through a lens module, a via electrically connecting the first IC and the bolometer, and a reflective layer disposed between the first IC and the bolometer, wherein the first IC includes at least one of a read-out (RO) element configured to perform analog processing for the bolometer to generate infrared sensing information and an image signal process (ISP) element configured to perform digital processing based on the bolometer to generate infrared image information, and at least one of an autofocusing (AF) control element and an optical image stabilization (OIS) control element configured to adjust a positional relationship between the lens module and the bolometer.

A three-dimensional displacement compensation method is provided. The method includes an obtaining step, a transforming step, a first determining step, a first calculating step and a compensating step. The obtaining step includes obtaining a current image of a measured element captured by a microscopic thermoreflectance thermography device. The transforming step includes two sub-steps. One sub-step uses Fourier transform to calculate a reference image to obtain a first result, and the other sub-step uses Fourier transform to calculate the current image to obtain a second result. The first determining step includes determining a peak point coordinate and a fitting diameter of a point spread function of an optical system of the device. The first calculating step includes calculating a three-dimensional displacement of the position to be compensated relative to the reference position. The compensating step compensates the position to be compensated.

A three-dimensional displacement compensation method is provided. The method includes an obtaining step, a transforming step, a first determining step, a first calculating step and a compensating step. The obtaining step includes obtaining a current image of a measured element captured by a microscopic thermoreflectance thermography device. The transforming step includes two sub-steps. One sub-step uses Fourier transform to calculate a reference image to obtain a first result, and the other sub-step uses Fourier transform to calculate the current image to obtain a second result. The first determining step includes determining a peak point coordinate and a fitting diameter of a point spread function of an optical system of the device. The first calculating step includes calculating a three-dimensional displacement of the position to be compensated relative to the reference position. The compensating step compensates the position to be compensated.

An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.