An example device can include a circuit assembly, an infrared sensor coupled to the circuit assembly, a switch coupled to the circuit assembly, an infrared lens coupled to a resistive element to alter a state of the switch when the infrared lens alters a position of the resistive element, and a light pipe ring positioned around the infrared lens to allow visible light to pass between an exterior and interior portion of an enclosure.

We disclose an Infrared (IR) device comprising a first substrate comprising a first cavity; a dielectric layer disposed on the first substrate; a second substrate disposed on the dielectric layer and on the opposite side of the first substrate, the second substrate having a second cavity. The device further comprises an optically transmissive layer attached to one of the first and second substrates; a further layer provided to another of the first and second substrates so that the IR device is substantially closed. Holes are provided through the dielectric layer so that a pressure in the first cavity is substantially the same level as a pressure in the second cavity.

An optical pyrometer having a coaxial light guide delivers laser radiation through optics to heat a localized area on a sample, and simultaneously collects optical radiation from the sample to perform temperature measurement of the heated area. Inner and outer light guides can comprise the core and inner cladding, respectively, of a double-clad fiber (DCF), or can be formed using a combination of optical fibers in one or more coaxial bundles. Coaxial construction and shared optics facilitate alignment of the centers of the heated and observed areas on the sample. The heated area can be on the order of micrometers when using a single-mode optical fiber core as the inner light guide. The system can be configured to heat small samples within a vacuum system of charged-particle beam microscopes such as electron microscopes. A method for using the invention in a microscope is also provided.

An example device can include a circuit assembly, an infrared sensor coupled to the circuit assembly, a switch coupled to the circuit assembly, an infrared lens coupled to a resistive element to alter a state of the switch when the infrared lens alters a position of the resistive element, and a light pipe ring positioned around the infrared lens to allow visible light to pass between an exterior and interior portion of an enclosure.

The present application discloses a measurement device and a measurement method for measuring a temperature and an emissivity of a measured surface. The measurement device comprises a reflection converter, an optical receiver and a data processor, wherein the reflection converter comprises a reflector and an absorber tube, the reflector has a through hole, and the absorber tube may be shifted between a first measurement position and a second measurement position relative to the reflector. In the first measurement position, the light incident end of the absorber tube approaches or contacts the measured surface, such that the optical receiver receives inherent radiation light emitted from the measured surface and forms a first electrical signal. In the second measurement position, the light incident end of the absorber tube is located at the through hole or outside the through hole of the reflector, such that the optical receiver receives the inherent radiation light emitted from the measured surface and reflective radiation light between a reflection surface of the reflector and the measured surface and forms a second electrical signal. The data processor is configured to determine a temperature and an emissivity of the measured surface according to the first electrical signal and the second electrical signal.

A signal barrier for a sensor device can include at least one wall that forms an inner space, wherein the at least one wall comprises a material for reducing an amount of a signal from entering the inner space, wherein the at least one wall is configured to be disposed adjacent to a transceiver element of the sensor device, wherein the transceiver element is directed to the inner space.

We disclose an Infrared (IR) device comprising a first substrate comprising a first cavity; a dielectric layer disposed on the first substrate; a second substrate disposed on the dielectric layer and on the opposite side of the first substrate, the second substrate having a second cavity. The device further comprises an optically transmissive layer attached to one of the first and second substrates; a further layer provided to another of the first and second substrates so that the IR device is substantially closed. Holes are provided through the dielectric layer so that a pressure in the first cavity is substantially the same level as a pressure in the second cavity.

Methods, apparatuses and systems for sensing are disclosed herein. An example sensor may include an omnidirectional reflector, a calibration source located inside the omnidirectional reflector and configured to generate one or more calibration beams, a first filter configured to filter one or more first beams including any of a first portion of the incoming beams collected and concentrated by the omnidirectional reflector, and a first detector configured to detect the filtered one or more first beams.

Methods, apparatuses and systems for sensing are disclosed herein. An example sensor may include an omnidirectional reflector, a calibration source located inside the omnidirectional reflector and configured to generate one or more calibration beams, a first filter configured to filter one or more first beams including any of a first portion of the incoming beams collected and concentrated by the omnidirectional reflector, and a first detector configured to detect the filtered one or more first beams.

The invention discloses an integrated device for ear temperature measurement and non-contact temperature measurement, comprising a main body shell, a temperature measurement control unit and a display unit in the main body shell and a temperature measurement probe at head of the main body shell. The temperature measurement probe is composed of a shell, a temperature sensor in the shell and a non-contact temperature measurement component on the shell. The non-contact temperature measurement component is dismountable and has a non-contact temperature measurement channel in. After the non-contact temperature measurement component and the shell of the temperature measurement probe are assembled, the non-contact temperature measurement channel and the shell of the temperature measurement probe will form a necessary infrared receiving channel to realize non-contact temperature measurement. After the non-contact temperature measurement component is demounted from the shell of the temperature measurement probe, the temperature measurement probe can realize ear temperature measurement independently.