Patent classifications
G01J5/0846
Device for measuring temperature distribution
The present invention pertains to a device for measuring a temperature distribution, which can measure a temperature distribution without contacting a minor sample having a three-dimensional structure. More particularly, the device for measuring the temperature distribution can measure a three-dimensional temperature distribution for a sample, wherein the temperature distribution in a depth direction (direction z) of the sample is measured by a thermo-reflectance technique using a chromatic dispersion lens, a diffraction spectrometer and an optical detection array; and the temperature distribution in parallel directions (direction x-y axes) of the sample is measured by the thermo-reflectance technique using a biaxial scanning mirror.
Stove guard utilizing different wavelengths
A stove guard comprises a data processing unit (101) and a temperature sensor arrangement (102) for receiving thermal radiation from objects in a specific field of view and for supplying detector signals representative of the received thermal radiation to the data processing unit (101). The temperature sensor arrangement (102) includes at least three detector elements (201, 202, 203), their sensitivity bands located at different positions along an optical radiation wavelength axis. The sensitivity band of one of said detector elements is limited to a wavelength range of less than 1.2 micrometers.
Edge-mountable semiconductor chip package
A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.
THERMAL QUALITY MAPPINGS
In some examples, a method for generating an interactive three-dimensional quantitative thermal heat flow mapping of an environment comprises generating a three-dimensional representation of the environment, the representation comprising multiple surfaces defining respective boundaries of the environment, generating a thermal image representing a surface temperature at multiple points on respective ones of the surfaces of the environment within the three-dimensional representation, determining a measure for an ambient temperature within the environment, determining respective measures for incident radiant temperature of the surfaces, determining respective measures for the emissivity of the surfaces, providing a measure of temperature outside of a surface, calculating, at each of the multiple points, a value for the instantaneous heat flow per unit area using the measures for surface temperature, ambient temperature within the environment and incident radiant temperature of the surfaces, and using the values for the instantaneous heat flow per unit area, and the measure of temperature outside of a surface, calculating respective measures for thermal transmittance at the multiple points.
MULTISPECTRAL PHOTODETECTOR ARRAY
A photodetector array comprising at least one first sensor and at least one second sensor on the horizontal surface of the array substrate. The at least one first sensor is sensitive to radiation in a first wavelength range which comprises long-wavelength infrared wavelengths, and the at least one second sensor is sensitive to radiation in a second wavelength range which comprises wavelengths shorter than long-wavelength infrared. The array substrate comprises a vertical cavity on its horizontal surface, and the first sensor comprises a layer of pyroelectric material (65) which extends horizontally across the vertical cavity in the first area. A first part of a layer of two-dimensional layered material at least partly covers the layer of pyroelectric material (65), and a second part of the layer of two-dimensional layered material at least partly covers the foundation of the second sensor.
Freeform surface reflective infrared imaging system
The present invention relates to a freeform surface reflective infrared imaging system comprising a primary mirror, a secondary mirror, a tertiary mirror, and an infrared light detector. Each reflective surface of the primary mirror, the secondary mirror, and the tertiary mirror is an xy polynomial freeform surface. A field of view of the freeform surface reflective infrared imaging system is larger than or equal to 40°×30°. An F-number of the freeform surface reflective infrared imaging system is less than or equal to 1.39.
SYSTEMS AND METHODS FOR SCREENING INDIVIDUALS FOR AN ELEVATED SKIN TEMPERATURE
The present disclosure discusses various systems and methods for screening individuals for an elevated skin temperature, including substantially reducing the footprint of conventional thermal imaging system. The footprint of the currently available thermal imaging system is reduced in part because rather than having a blackbody and a person being screened simultaneously located within the thermal camera's field of view, the present disclosure discusses a unique thermal imaging system that provides a reference temperature to the system for subsequent comparison to the thermal camera, using a blackbody, prior to the thermal scanning and imaging the person.
Microscale In-Situ Imaging Of Dynamic Temperature And Deformation Fields
An embodiment provides a system for measuring temperature and deformation fields of at least a portion of a sample, comprising a visible light camera, an infrared camera, and a beam splitter. The visible light camera is at a first location with respect to the sample and can take a visible light image of at least a portion of the sample at a first time. The infrared camera is at a second location with respect to the sample and can take an infrared image of the at least a portion of the sample at the first time. The beam splitter can receive a beam of light, comprising infrared and visible light, traveling in a direction normal to the at least a portion of the sample and direct the infrared light to the infrared camera and the visible light to the visible light camera.
Temperature calibration with band gap absorption method
A method and apparatus for calibration non-contact temperature sensors within a process chamber are described herein. The calibration of the non-contact temperature sensors includes the utilization of a band edge detector to determine the band edge absorption wavelength of a substrate. The band edge detector is configured to measure the intensity of a range of wavelengths and determines the actual temperature of a substrate based off the band edge absorption wavelength and the material of the substrate. The calibration method is automated and does not require human intervention or disassembly of a process chamber for each calibration.
Security sensor device
A security sensor device includes: a plurality of sensor units each of which includes an infrared ray detection element having a visual field in a predetermined target direction, the plurality of sensor units aligned in a predetermined arrangement direction; a plurality of optical systems through which detection rays transmit from a corresponding detection area to each infrared ray detection element, the plurality of optical systems aligned in the predetermined arrangement direction; a target object detection circuit into which an output signal is input from each infrared ray detection element; and a switching unit which is configured to change a configuration between each of the plurality of sensor units and the plurality of optical systems according to a user operation, so that two detections of low-place mounting detection and high-place mounting detection are respectively performed.