Patent classifications
G01J5/0846
Bolometer pixel readout integrated circuit including trigger sense circuit
A thermal imaging system includes a pixel array having a plurality of pixel groups. Each pixel group including a plurality of pixel rows and a trigger sense circuit including a pixel group input line in signal communication with the plurality of bolometer pixels pixel row containing a plurality of bolometer pixels. The pixel group further includes a selector switch that selectively establishes an electrical connection between the pixel group and the trigger sense circuit. The selector switch operates in a first state to disconnect the pixel group from the pixel group input line while connecting the pixel group to the integration unit such that the integration unit generates the image, and a second state to disconnect the pixel group from the integration unit while connecting the pixel group to the pixel group input line such that the trigger sense circuit monitors the pixel group for a high temperature bolometer.
Method of measuring temperature of an object to be measured, dust temperature and dust concentration
A first radiance meter is directed toward an object to be measured, radiance is measured through a space where dust is present with the use of at least two wavelengths by the first radiance meter, second radiance meters which are equal in number to one or more objects having temperatures different from that of the object to be measured are directed toward the objects, radiances are measured through the space with the use of at least two wavelengths by the second radiance meters respectively, and a temperature of the object to be measured, a temperature of the dust, and concentration of the dust are measured from the radiances measured by the first radiance meter and the second radiance meters.
SYSTEM AND METHODS FOR DETECTING, CONFIRMING, CLASSIFYING, AND MONITORING A FIRE
One variation of a method for detecting a fire includes: during a first time period: detecting an increase in ambient light intensity and detecting an increase in ambient humidity; responsive to the increase in ambient light intensity and the increase in ambient humidity, detecting a fire event; during a second time period: correlating a decrease in ambient light intensity with an increase in visual obscuration; detecting an increase in ambient air temperature; in response to a magnitude of the increase in visual obscuration remaining below a high obscuration threshold and a magnitude of the increase in ambient temperature remaining below a high temperature threshold, classifying the fire as an incipient fire; and, in response to the magnitude of the increase in visual obscuration exceeding the high obscuration threshold and the magnitude of the increase in ambient temperature exceeding the high temperature threshold, classifying the fire as a developed fire.
Intelligent vent hood
A vent hood device that is configured to monitor a stove, the vent hood device including, a camera, an infrared sensor that is configured to detect heat from a surface of the stove, and a processor that is configured to receive, from the infrared sensor, temperature data that indicates heat detected from the surface of the stove, receive, from the camera, video data captured by the camera, determine, based on the temperature data and the video data, that an adult is not within a field of view of the camera and the heat detected from the surface of the stove satisfies a heat criteria, and in response to determining that an adult is not within the field of view of the camera and the heat detected from the surface of the stove satisfies the heat criteria, provide an alert that indicates that the stove is unattended.
Infrared imaging detector
The present specification generally relates to the field of imaging device and particularly discloses an imaging device for detecting infrared radiation. The imaging device comprises a first set of detectors responsive to infrared electromagnetic radiation in a first wavelength band, a second set of detectors and a filter disposed above the second set of detectors to prevent registration of electromagnetic radiation outside a second wavelength band at the second set of detectors. The second wavelength band is a subset of the first wavelength band. The imaging device is configured to detect a deviation from an expected value of a level of electromagnetic radiation in a third wavelength band based on signals obtained from the first set of detectors and the second set of detectors. The third wavelength band is within the first wavelength band and outside the second wavelength band.
CALIBRATION OF A THERMAL IMAGING DEVICE FOR A SURFACE COOKING APPLIANCE
A thermal imaging system for a cooking appliance is capable of being calibrated for any arrangement of cooktop burners disposed on a surface of a cooking appliance. A thermal imaging system can be calibrated by processing a received thermal scan of a surface of a cooking appliance having a particular cooktop arrangement to identify a plurality of cooktop burners on the surface of the cooking appliance for the particular arrangement, determine a number of cooktop burners in the particular arrangement, and determine one or more locations of the cooktop to assign to each of the cooktop burners. Further, the determined one or more locations assigned to each of the cooktop burners can be stored in association with a respective cooktop burner. Once calibrated, the thermal imaging system can calculate a temperature for each of the cooktop burners to be used in performing subsequent control and/or safety functions.
APPARATUS AND METHOD FOR MEASURING THE SURFACE TEMPERATURE OF A SUBSTRATE
An apparatus for measuring surface temperature of a substrate being illuminated by a pulsed light beam configured to heat the substrate and by a beam of probing light, wherein the heated substrate emits a radiated beam of thermal radiation, wherein the apparatus includes an optical system configured to collect the radiated beam and a reflected beam of probing light propagating in substantially close directions, wherein the collected radiated beam and the collected reflected beam are separately routed to a respective detector via a respective routing element, the respective detectors being configured to measure the intensity of the collected radiated beam and collected reflected beam simultaneously and at the same wavelength, wherein the surface temperature is calculated based on the collected radiated beam and on the collected reflected beam.
INFRARED THERMOMETER CAPABLE OF SWITCHING FOREHEAD TEMPERATURE MEASUREMENT MODE AND EAR TEMPERATURE MEASUREMENT MODE AND SWITCHING METHOD
An infrared thermometer capable of switching a forehead temperature measurement mode and an ear temperature measurement mode and a switching method are disclosed. The infrared thermometer includes an infrared thermometer body and a forehead temperature measurement cover. The infrared thermometer body has a measuring probe and a printed circuit board. The printed circuit board is connected with a first electrical contact. The forehead temperature measurement cover has a thermistor and a second electrical contact. The forehead temperature measurement cover is detachably connected to the infrared thermometer body to selectively cover or expose the measuring probe for switching the forehead temperature measurement mode and the ear temperature measurement mode.
Edge-Mountable Semiconductor Chip Package
A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.
Techniques for device attachment with dual band imaging sensor
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.