G01J5/0853

Absorber structure for thermal detectors

An absorber structure for a thermal detector, the absorber structure including edges defining a basic form, a plurality of first legs of electrically conducting material joined in an electrically conductive manner to form, between the edges of the absorber structure, a grid having openings, the first legs forming at least one continuous connection between the edges of the absorber structure; and a plurality of second legs of electrically conducting material joined in an electrically conductive manner to the first legs, wherein the second legs protrude from the first legs into the openings of the grid and terminate at points of termination located at a distance from adjacent first legs.

On-board radiation sensing apparatus
11408773 · 2022-08-09 · ·

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.

HIGH-PERFORMANCE OPTICAL ABSORBER COMPRISING FUNCTIONALIZED, NON-WOVEN, CNT SHEET AND TEXTURIZED POLYMER FILM OR TEXTURIZED POLYMER COATING AND MANUFACTURING METHOD THEREOF
20220206194 · 2022-06-30 ·

A high-performance optical absorber, having a texturized base layer, the base layer comprising one or more of a polymer film and a polymer coating; and a surface layer located above and immediately adjacent to the base layer. The surface layer is joined to the base layer and the surface layer has a plasma-functionalized, non-woven carbon nanotube (CNT) sheet, wherein the base layer texturization comprises one or more of substantially rectangular ridges, substantially triangular ridges, substantially pyramidal ridges, and truncated, substantially pyramidal ridges.

Phononically-enhanced imager (PEI) pixel
11381761 · 2022-07-05 ·

An imager pixel comprising a micro-platform supported by phononic nanowires, the nanowires providing an extreme-level of thermal isolation from a surrounding substrate. The micro-platform in embodiments comprises thermal sensors sensitive to heat from absorbed incident longwave/shortwave photonic irradiation. In embodiments, the pixel photonic sensing structure comprises both a thermal sensor together with a separate photodiode/phototransistor/photogate for sensing RGB and NIR wavelengths. Some embodiments comprise a micro-platform with an integral Peltier thermoelectric element permitting in situ refrigeration to cryogenic temperatures.

Phononic devices and methods of manufacturing thereof

The present invention relates to a plurality of phononic devices and a method of manufacturing thereof. In one embodiment, highly sensitive superconducting cryogenic detectors integrate phononic crystals into their architecture. The phononic structures are designed to reduce the loss of athermal phonons, resulting in lower noise and higher sensitivity detectors. This fabrication process increases the qp generation recombination rate, thus, reducing the noise equivalent power (NEP) without sacrificing the scalability. A plurality of phononic devices, such as a kinetic inductance detector (KID), a transition edge sensor (TES) bolometer, and quarterwave backshort, can be manufactured according to the methods of the present invention.

MICROELECTROMECHANICAL INFRARED SENSING DEVICE
20220196479 · 2022-06-23 ·

A microelectromechanical infrared sensing device is provided, which includes a substrate, a sensing plate, a reflecting plate, a plurality of first supporting elements, a plurality of second supporting elements and a plurality of stoppers. The second supporting elements are connected to the sensing plate, such that the sensing plate is suspended above the substrate. The reflecting plate is disposed between the substrate and the sensing plate. The first supporting elements are connected to the reflecting plate, such that the reflecting plate is suspended between the substrate and the reflecting plate. When the reflecting plate moves toward the substrate and at least one of the stoppers contacts the substrate or the reflecting plate, the distance between the reflecting plate and the sensing plate increases.

Light converting systems employing thin light absorbing and light trapping structures with lens arrays

A light converting optical system employing a planar light trapping optical structure illuminated by a source of monochromatic light. The light trapping optical structure includes a photoabsorptive layer including quantum dots. The photoabsorptive layer is configured at a relatively low thickness and located between a broad-area optically transmissive surface configured to reflect light using a total internal reflection and an opposing broad-area reflective surface formed by a thin sheet of material configured to diffusely reflect light. The opposing surfaces confine and redistribute light within the light trapping structure, causing multiple transverse propagation of light through the photoabsorptive layer and enhanced absorption and light conversion. The light trapping optical structure may further incorporate an array of lenses or other optical elements located on a light path between the light source and the photoabsorptive layer.

Zero Power Micromechanical Switch-Based Sensing and Monitoring System
20220099495 · 2022-03-31 ·

Zero-power system for remote monitoring of heat sources is provided. The systems detect failure indicators of remote equipment including power substations, oil rigs, large inaccessible machinery in a factory, and communications equipment. The systems also can be used to detect the presence of people in buildings or in other locations, so as to improve HVAC utilization in large buildings. When the zero-power monitoring systems detect heat sources, such as the presence of people, failure indicators, or a targeted environmental signal, a circuit is closed using the energy of the detected radiation, and activating an RFID tag, a radio transmitter, or an alarm. The monitoring systems can remain deployed and active for many years without the need for battery replacement.

High-performance optical absorber comprising functionalized, non-woven, CNT sheet and texturized polymer film or texturized polymer coating and manufacturing method thereof

A high-performance optical absorber, having a texturized base layer, the base layer comprising one or more of a polymer film and a polymer coating; and a surface layer located above and immediately adjacent to the base layer. The surface layer is joined to the base layer and the surface layer has a plasma-functionalized, non-woven carbon nanotube (CNT) sheet, wherein the base layer texturization comprises one or more of substantially rectangular ridges, substantially triangular ridges, substantially pyramidal ridges, and truncated, substantially pyramidal ridges.

Photonic- and phononic-structured pixel for electromagnetic radiation and detection
11300453 · 2022-04-12 ·

A thermal pixel configured as an electromagnetic emitter and/or an electromagnetic detector. The thermal pixel comprises a micro-platform suspended with semiconductor nanowires from a surrounding support platform. The nanowires comprise phononic structure providing a decrease in thermal conductivity. In some embodiments, the pixel is structured for operation within a broad bandwidth or a limited bandwidth. Metamaterial and/or photonic crystal filters provide pixel operation over a limited bandwidth. In some other embodiments, the micro-platform comprises a nanotube structure providing a broadband emission/absorption spectral response.