An embodiment provides a system for measuring temperature and deformation fields of at least a portion of a sample, comprising a visible light camera, an infrared camera, and a beam splitter. The visible light camera is at a first location with respect to the sample and can take a visible light image of at least a portion of the sample at a first time. The infrared camera is at a second location with respect to the sample and can take an infrared image of the at least a portion of the sample at the first time. The beam splitter can receive a beam of light, comprising infrared and visible light, traveling in a direction normal to the at least a portion of the sample and direct the infrared light to the infrared camera and the visible light to the visible light camera.

The present disclosure relates to optical systems, vehicles, and methods for providing improved mechanical performance of a camera and corresponding optical elements. An example optical system includes an outer housing and an inner support member. The optical system also includes an optical window coupled to the outer housing and the inner support member. The optical window is configured to be temperature-controllable. The optical system also includes a camera coupled to the inner support member. The camera is optically coupled to the optical window. Additionally, the outer housing, the optical window, and the camera are configured to be impact resistant.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

Methods and systems of heating a substrate in a vacuum deposition process include a resistive heater having a resistive heating element. Radiative heat emitted from the resistive heating element has a wavelength in a mid-infrared band from 5 μm to 40 μm that corresponds to a phonon absorption band of the substrate. The substrate comprises a wide bandgap semiconducting material and has an uncoated surface and a deposition surface opposite the uncoated surface. The resistive heater and the substrate are positioned in a vacuum deposition chamber. The uncoated surface of the substrate is spaced apart from and faces the resistive heater. The uncoated surface of the substrate is directly heated by absorbing the radiative heat.

Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

A colliding object is suppressed from reaching a driver’s seat, and an occupant and an object in a vehicle compartment are suppressed from being thrown out of a vehicle. In a vehicle glass 1, a far-infrared transmitting region in which an opening portion and a far-infrared transmissive member 20 arranged in the opening portion are provided is formed in a light shielding region. The vehicle glass 1 includes a protective member 40 that is provided on a vehicle interior side of the far-infrared transmissive member 20 and overlaps with at least a part of the far-infrared transmissive member 20 when viewed from a direction orthogonal to a vehicle exterior side surface 20a of the far-infrared transmissive member 20.

The invention relates to an explosion-protected housing for means for transmitting and/or receiving electromagnetic radiation (2, 2a, 2b). The housing comprises a housing body (1) that is configured to receive such transmission and/or reception means (2, 2a, 2b) and a window element (5) having a first side (7) that faces the housing interior and an opposite second side (6) that faces away from the housing interior, wherein the window element (5) transmits electromagnetic radiation. The housing body (1) has a flanging (11) on the second side (6) of the window element (5), said flanging pressing the window element (5) in the direction of a seat (13) that is formed in the interior of the housing such that the housing is formed as a pressure-resistant housing and/or as a dust-tight housing.

A receiver is formed as the physical inverse or relief of at least a portion of a machined part or casting. The receiver has accommodations for sensor systems that monitor the temperature of the part during a radiant heating process which is placed on top of the casting receiver to move through the radiant heating process.