A thermistor element includes: a thermistor film; a pair of first electrodes in contact with one surface of the thermistor film; an insulation film opposite to a contact side of the pair of first electrodes, the contact side on which the pair of first electrodes is in contact with the thermistor film; and at least one opening portion located in a region which overlaps each of the first electrodes when viewed in a plan view and passing through the insulation film. Each first electrode has a first portion located where each of the first electrodes and the opening portion overlap when viewed in a plan view and a second portion outside of where each of the first electrodes and the opening portion overlap when viewed in a plan view and is over the first portion and second portion to be in contact with the one surface of the thermistor film.

An apparatus is provided for nanoantenna-enhanced detection of infrared radiation. The apparatus includes one or more detector pixels. A plurality of detector pixels can constitute a focal plane array (FPA). Each detector pixel carries at least a first and a second subpattern of nanoantenna elements, with elements of the second subpattern interpolated between elements of the first subpattern. Each detector pixel also includes separate collection electrodes for collecting photogenerated current from the respective subpatterns.

A radiation detector with a substrate and a membrane, which is suspended above the substrate by a spacer is described, wherein the spacer thermally insulates a radiation sensor, which is formed in the membrane, from the substrate. Further, the spacer includes a first layer, which is electrically conducting and contacts a first pole of the radiation sensor and of the substrate, and a second layer, which is electrically conducting and electrically insulated from the first electrically conductive layer and contacts a second pole of the radiation sensor and of the substrate, wherein the second pole differs in polarity from the first pole.

A method for processing a raw image characterized by raw measurements S.sub.p(i,j) that are associated with active bolometers B.sub.pix_(i,j) of an imager, which bolometers are arranged in a matrix array, the imager being at an ambient temperature T.sub.amb and furthermore comprising blind bolometers B.sub.b_(k), the method, which is executed by a computer that is provided with a memory, comprising the following steps: a) a step of calculating the electrical resistances R.sub.Tc(i,j) and R.sub.Tc(k), at the temperature T.sub.amb, of the active and blind bolometers, respectively, from their respective electrical resistances R.sub.Tr(i,j) and R.sub.Tr(k) at a reference temperature T.sub.r, said resistances being stored in the memory; b) a step of determining the temperatures T.sub.sc(i,j) actually measured by each of the active bolometers B.sub.pix_(i,j) from the electrical resistances calculated in step a) and from the raw measurements S.sub.p(i,j).

An infrared imager includes a first optical component, a second optical component, and at least one thin film dielectric layer. The first optical component has multiple first parallel conductors with a first spacing pattern, aligned in a plane perpendicular to an axis. The second optical component has multiple second parallel conductors with a second spacing pattern, aligned in a plane perpendicular to the axis, angularly offset from the first direction. The thin film dielectric layer includes a refractive index change (RIC) material disposed between and in contact with the first and second parallel conductors. The first optical component, second optical component, and at least one thin film dielectric layer form an antenna array configured to detect one or more predetermined infrared wavelengths based on at least one of the first spacing pattern or the second spacing pattern or the angular offset.

A measurement circuit for a resistive sensor comprises an integrator of information representative of the difference between a current passing through the sensor and a first reference current, and a circuit for making the output of the integrator depend on a reference level.

A bolometric detector of LWIR wavelengths, including: a substrate; a membrane suspended above the substrate by supporting elements; an absorbing element comprising several MIM structures each formed with a lower metal element, an upper metal element specific to each MIM structure and with a dielectric element positioned between the lower and upper metal elements; a thermometric element comprising at least one thermometric material; wherein: the membrane includes the upper metal element, the thermometric material and one portion of the dielectric element of each MIM structure, the upper metal elements of at least two MIM structure have different dimensions relatively to each other in the main plane of the membrane, and the dielectric element of each of the MIM structures includes at least one of the following materials having vibrational modes in the LWIR range: Al.sub.2O.sub.3, AlN, TiO.sub.2.

A thermistor element includes a thermistor film, a first electrode provided in contact with one surface of the thermistor film, and a pair of second electrodes provided in contact with the other surface of the thermistor film, wherein the thermistor film includes an oxide having a spinel crystal structure and having a [111] preferred orientation in a film thickness direction.

A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like.

Spectroscopy systems suitable for estimating the composition of test samples are disclosed. Embodiments of the present invention include an element that can be embedded within a sample and operatively couple with elements of the system located outside the sample, thereby enabling long-term monitoring of the sample. An embodiment includes radiation-emitting and radiation-detecting devices having periodic structures, such as photonic crystals and/or plasmonic metamaterials, which serve to filter the wavelengths of radiation at which they operate and/or enhance responsivity for those wavelengths. In some embodiments, the detecting devices are housed in a module suitable for long-term implantation within the sample. In some embodiments, the radiation-emitting and detecting devices are located external to the sample and are optically coupled with a mirror implanted within the sample. In some embodiments, an estimate of the composition of the test sample is generated at controller that is in communication with the emitter module.