In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

Disclosed are a temperature measurement circuit and method. The circuit includes a first temperature sensing circuit, a second temperature sensing circuit and a data processing unit. The first temperature sensing circuit is configured to generate a first measurement signal for characterizing a temperature based on an inputted first current signal, a magnitude of the first current signal being correlated to temperature. The second temperature sensing circuit is configured to generate a second measurement signal for characterizing the temperature based on an inputted second current signal, the second current signal being independent of temperature. The data processing unit is configured to determine a current temperature based on a first characteristic parameter corresponding to the first measurement signal and a second characteristic parameter corresponding to the second measurement signal.

A temperature measuring circuit, measuring apparatus and a measuring method thereof relating to the field of electronic circuits. The temperature measuring circuit includes control unit, wherein the control unit includes a first current output interface, a second current output interface, a first input/output interface, a second input/output interface, and a third input/output interface. Further, the first current output interface and the first input/output interface of the control unit are respectively electrically connected to a first interface of a temperature sensor; the second current output interface and the second input/output interface of the control unit are respectively electrically connected to a second interface of the temperature sensor; and the third input/output interface of the control unit is electrically connected to a third interface of the temperature sensor.

A temperature measuring circuit, measuring apparatus and a measuring method thereof relating to the field of electronic circuits. The temperature measuring circuit includes control unit, wherein the control unit includes a first current output interface, a second current output interface, a first input/output interface, a second input/output interface, and a third input/output interface. Further, the first current output interface and the first input/output interface of the control unit are respectively electrically connected to a first interface of a temperature sensor; the second current output interface and the second input/output interface of the control unit are respectively electrically connected to a second interface of the temperature sensor; and the third input/output interface of the control unit is electrically connected to a third interface of the temperature sensor.

The present invention provides a thermal sensor integrated IC having a resistor and a converting circuit. The resistor is implemented by at least one metal line, wherein a resistance of the resistor is varied with a temperature of the resistor, the resistor has a first terminal and a second terminal, and one of the first terminal and the second terminal is arranged to provide a voltage signal corresponding to the resistance. The converting circuit is coupled to the resistor, and is configured to convert the voltage signal to an output signal for determining the temperature. In one embodiment, the at least one metal line is made by copper.

The temperature sensor module includes: a temperature sensor element and a signal processing circuit. The signal processing circuit includes: a series-connection resistor which is connected in series to the temperature sensor element; a temperature detection circuit which detects a temperature; a first analog-digital conversion circuit which converts an output signal from the temperature detection circuit into a digital signal; a memory which stores a series-connection resistor data piece about a relationship between a temperature and the resistance value of the series-connection resistor; a digital signal processing circuit which uses the series-connection resistor data piece, to calculate, on the basis of the digital signal indicating the temperature of the signal processing circuit, a digital command signal for keeping the resistance value of the series-connection resistor at a constant value, and outputs the digital command signal; and a digital-analog conversion circuit which outputs the digital command signal to the series-connection resistor.

A method and device for temperature monitoring of a power transistor formed in a semiconductor die comprising are disclosed. A side of a temperature-sensing resistor disposed in the semiconductor die is coupled to a voltage input side of the power transistor. A controller coupled to a second side of the temperature-sensing resistor is configured to detect a voltage across the resistor and trigger a temperature related corrective action using the detected voltage.

A circuit arrangement (1) for monitoring the temperature of an electronic component (2), which, in particular, can be impinged with an electric current and can be connected to at least one voltage source (3). The circuit arrangement is able to guarantee safe monitoring of the temperature of an electronic component impinged with electric current by the electronic component (2) being part of at least one Wheatstone bridge (7) and by at least one switching device (8) being provided that influences the impingement of the electronic component (2) with electric current on the basis of a bridge transverse voltage of the Wheatstone bridge (7). Additionally, circuit arrangement (1) is well suited for use in a calorimetric mass flowmeter (18).

A circuit arrangement (1) for monitoring the temperature of an electronic component (2), which, in particular, can be impinged with an electric current and can be connected to at least one voltage source (3). The circuit arrangement is able to guarantee safe monitoring of the temperature of an electronic component impinged with electric current by the electronic component (2) being part of at least one Wheatstone bridge (7) and by at least one switching device (8) being provided that influences the impingement of the electronic component (2) with electric current on the basis of a bridge transverse voltage of the Wheatstone bridge (7). Additionally, circuit arrangement (1) is well suited for use in a calorimetric mass flowmeter (18).