A thermistor sensor arrangement for measuring chipset temperature is provided. According to various aspects of the present disclosure, a sensor assembly is placed between a heat sink of a chipset and a PCB on which the chipset is mounted. The sensor assembly includes a thermistor sensor, an electrical connector, and a resilient pad. The thermistor sensor includes a first end having a sensing element and a second end having sensor contacts. The electrical connector has a first interface to receive the sensor contacts, a second interface through which the signals are outputted, and a bottom surface to mount to the PCB. The resilient pad has an upper surface to which the sensing element is attached and a lower surface to engage with the PCB such that when the resilient pad is compressed, spring force of the resilient pad facilitates temperature measurement by pressing the sensing element against the heat sink.

A semiconductor device includes a device cell including a gate component configured to receive a gate control signal and a temperature sensing component adjacent to the device cell. Each of the temperature sensing component and the gate component includes polycrystalline silicon.

An ostomy bag can include one or more sensors for measuring one or more metrics. An ostomy wafer can also include one or more sensors for measuring one or more metrics. The sensors can be temperature sensors and/or capacitive sensors, for example, and the metrics can include bag fill, leakage, skin irritation, and phase of stoma output, among others.

Methods and apparatus for processing a substrate are provided herein. For example, a processing volume for processing a substrate and a pressure system in fluid communication with the processing volume and comprising a throttle valve assembly including a housing, a sensing device disposed in an interior of the housing, and a fan open to the interior of the housing, wherein, during operation of the pressure system to control a pressure within the processing volume, the sensing device is responsive to temperature changes in the interior of the housing such that the fan remains off when a temperature of the interior of the housing is less than a predetermined temperature and automatically turns on when the temperature within interior of the housing is equal to or greater than the predetermined temperature.

The present invention enables the achievement of: high density mounting by means of an electronic component for welding; and improvement of thermal responsivity and tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate; a function part and a bonding electrode part, which are provided on the insulating substrate; and a lead which is electrically connected to the bonding electrode part. The bonding electrode part is configured of: an adhesive active metal layer which is formed from a high-melting-point metal on the insulating substrate; a barrier layer which is formed from a high-melting-point metal on the active metal layer; and a bonding metal layer which is mainly composed of a low-melting-point metal and is formed on the barrier layer.

A device having a first terminal region and a second terminal region. The first terminal region includes fine-tune (FT) metal stripes that are separated from each other by a first distance along the longitudinal direction. The second terminal region is spaced apart from the first terminal region by at least an inter-terminal distance. The second terminal region includes coarse-tune (CT) metal stripes that are separated from each other by a second distance along the longitudinal direction. The second distance is greater than the first distance, and the inter-terminal distance greater than the second distance. Each of the FT metal stripes may be selected as a first access location, and each of the CT metal stripes may be selected as a second access location. A pair of selected first and second access locations access a sheet resistance defined by a distance therebetween.

This disclosure describes a slide comprising a substrate, a WISP, and a temperature sensor, wherein the slide is capable of communicating with an external communications device via the WISP. In some implementations, the WISP comprises an antenna, an integrated circuit, and a memory unit, that are powered wirelessly by an external device, such that it is capable of measuring, logging, and communicating data. The data, such as time and temperature, may be collected via sensors connected to the WISP. In some implementations, the WISP and temperature sensor are embedded in the substrate to prevent direct contact with mounted specimens. In some implementations the slide further comprises displayed content. In some implementations, the displayed content is linked to a database of information. The various implementations of this invention may describe a slide utilizing any number of the features described above in any combination.

A plurality of temperature sensors are disposed on a substrate and spaced from each other on a plurality of concentric virtual rings. The plurality of temperature sensors are each connected to one of a plurality of first common lines and one of a plurality of second common lines. The plurality of first common lines each include a first annular line portion located along the plurality of virtual rings, and a first connection line portion connecting the first annular line portion to at least one of the plurality of temperature sensors. The first annular line portion of each of the plurality of first common lines is located on an outer side of the plurality of virtual rings.

Various examples provide an electronic device that includes first and second resistor segments. Each of the resistor segments has a respective doped resistive region formed in a semiconductor substrate. The resistor segments are connected between first and second terminals. The first resistor segment is configured to conduct a current in a first direction, and the second resistor segment is configured to conduct the current in a second different direction. The directions may be orthogonal crystallographic directions of the semiconductor substrate.

Provided is a thermistor which has a smaller change in resistance value between before and after a heat resistance test and from which a high B constant is obtained, a method for manufacturing the same, and a thermistor sensor. The thermistor is a thermistor formed on a substrate and includes: an intermediate stacked portion formed on the substrate; and a main metal nitride film layer formed of a thermistor material of a metal nitride on the intermediate stacked portion, wherein the intermediate stacked portion includes a base thermistor layer formed of a thermistor material of a metal nitride and an intermediate oxynitride layer formed on the base thermistor layer, the main metal nitride film layer is formed on the intermediate oxynitride layer, and the intermediate oxynitride layer is a metal oxynitride layer formed through oxidation of the thermistor material of the base thermistor layer immediately below the intermediate oxynitride layer.