A temperature detection device includes a thermistor element that includes a thermosensitive body configured to sense heat of a coil element and an electric wire electrically connected to the thermosensitive body, and a holder assembling the thermistor element to the coil element. The holder includes a thermosensitive body holder that holds a reinforcing portion of the thermosensitive body disposed sideways along a front surface of the coil element and is provided with a first resin reservoir enclosing a thermosensitive body contact portion of the thermosensitive body, and an electric wire holder holding the electric wire. The thermosensitive body contact portion is in contact with the coil element while being enclosed with the first resin reservoir. According to the temperature detection device, it is possible to more accurately detect temperature of a coil with high responsiveness while promoting miniaturization of the temperature detection device.

An ostomy bag can include one or more sensors for measuring one or more metrics. An ostomy wafer can also include one or more sensors for measuring one or more metrics. The sensors can be temperature sensors and/or capacitive sensors, for example, and the metrics can include bag fill, leakage, skin irritation, and phase of stoma output, among others.

Disclosed is a sensor for detecting temperature of an aircraft. The sensor comprises a temperature sensor elongated with respect to an axis. The temperature sensor comprises a sheath elongated with respect to the axis. The temperature sensor comprises a central conductor disposed within the sheath and elongated with respect to the axis having a conductor material defining a conductor temperature coefficient having a conductor coefficient magnitude. The temperature sensor comprises an optical fiber disposed within the sheath. The temperature sensor comprises a thermistor disposed within the sheath and surrounding the central conductor, the thermistor having thermistor material defining a thermistor temperature coefficient defining a thermistor coefficient magnitude greater than the conductor coefficient magnitude.

An attachment structure for a temperature sensor that is attached to a flexible thin plate-shaped cable and detects the temperature of a unit cell of a battery pack having a plurality of unit cells connected with each other includes: the flexible thin plate-shaped cable; a chip-shaped temperature measuring element that is incorporated on a conductor exposed portion of the flexible thin plate-shaped cable and detects the temperature of the unit cell; and a metal leaf spring that is placed around the conductor exposed portion of the flexible thin plate-shaped cable and has a plurality of legs surrounding the temperature measuring element, and an elastic piece configured to energize the plurality of legs toward the unit cell. The temperature measuring element is sheathed with a moisture-proof material between the plurality of legs of the metal leaf spring.

A deep body thermometer includes a thermal resistor having a predetermined thermal resistance value, first and second temperature sensors that sandwich the thermal resistor in a thickness direction of the thermal resistor, and a temperature information processing unit to acquire a deep body temperature based on the thermal resistance value of the thermal resistor, a temperature detected by the first temperature sensor, and a temperature detected by the second temperature sensor. The first and second temperature sensors are disposed such that the first and second temperature sensors do not overlap each other as viewed from the thickness direction of the thermal resistor and a distance between the first temperature sensor and the second temperature sensor is greater than a thickness of the thermal resistor.

A semiconductor device includes a device cell including a gate component configured to receive a gate control signal and a temperature sensing component adjacent to the device cell. Each of the temperature sensing component and the gate component includes polycrystalline silicon.

An electronic device is provided. The electronic device includes a substrate, a coil unit comprising a coil disposed on a specified area of the substrate and configured to transmit or receive a signal, a first terminal, a second terminal, and a temperature sensor configured to detect temperature. The temperature sensor has a wire form and is disposed between the first terminal and the second terminal along at least part of a peripheral area of the substrate.

A device having a first terminal region and a second terminal region. The first terminal region includes fine-tune (FT) metal stripes that are separated from each other by a first distance along the longitudinal direction. The second terminal region is spaced apart from the first terminal region by at least an inter-terminal distance. The second terminal region includes coarse-tune (CT) metal stripes that are separated from each other by a second distance along the longitudinal direction. The second distance is greater than the first distance, and the inter-terminal distance greater than the second distance. Each of the FT metal stripes may be selected as a first access location, and each of the CT metal stripes may be selected as a second access location. A pair of selected first and second access locations access a sheet resistance defined by a distance therebetween.

A method of manufacturing a sensor include depositing a metal layer on a substrate and fabricating a calibration structure on the metal layer. The calibration structure can include a first calibration portion and a second calibration portion. The method may further include, performing a first calibration of the sensor by modifying the first calibration portion. In addition, the method can include placing a cover layer on a portion of the first calibration portion after the first calibration and then performing a second calibration of the sensor by modifying the second calibration.

A temperature sensing tape including a flexible, electrically insulating substrate, a plurality of temperature sensing elements disposed on the substrate, each temperature sensing element including a first electrode and a second electrode arranged in a confronting, spaced-apart relationship to define a gap therebetween, and a variable resistance material disposed within the gap and connecting the first electrode to the second electrode, wherein the first electrode of at least one of the temperature sensing elements is connected to the second electrode of an adjacent temperature sensing element by a flexible electrical conductor.