The present invention relates to a testing method for the thermal contact between a temperature sensor (50) and a battery cell (10) of a battery module (30), wherein the method comprises the steps of measuring a temperature T.sub.1 of the temperature sensor (50) at a time point t.sub.1, heating the temperature sensor (50) for a defined time (t.sub.2−t.sub.1), measuring a temperature T.sub.2 of the temperature sensor (50) at a time point t.sub.2 and/or a temperature T.sub.3 of the temperature sensor (50) at a time point t.sub.3, and determining the thermal contact between the temperature sensor (50) and the battery cell (10) based on at least one of the temperature differences ΔT.sub.2,1=(T.sub.2−T.sub.1), ΔT.sub.3,1=(T.sub.3−T.sub.1) and/or ΔT.sub.3,2=(T.sub.3−T.sub.2). The invention further relates to a testing circuit (60) for a temperature sensor (50) of a battery module (30), comprising a thermistor (61) with a first node (67) connected to a first supply voltage (65) and a second node (68) connected to ground (69), a switch (63) interconnected between the first node (67) of the thermistor (61) and a second supply voltage (66), and an analog-to-digital converter (64) connected in parallel to the thermistor (61). The invention further relates to a cell supervision circuit (40) for a battery module (30), comprising a circuit carrier (45), a testing circuit (60) according to any one of the claims 1 to 10, and a temperature sensor (50) surface mounted to the circuit carrier (45) and comprising a measuring head (51) with a thermistor (61) configured to be brought into thermal contact with a battery cell (10) of the battery module (30).

Embodiments of the disclosure disclose a method and an apparatus for implementing a virtual sensor (for example, a virtual thermistor) for checking temperature (or heating) of an electronic device by the electronic device. An electronic device according to various embodiments includes a plurality of electronic components mounted into the electronic device, and a processor operatively connected to the electronic components, wherein the processor is configured to classify a prediction area according to predetermined characteristics, configure a virtual thermistor corresponding to the prediction area, based on the classification characteristic of the prediction area, collect information on at least one prediction area, based on the virtual thermistor, and manage heating of the electronic device, based on the collected information. Various embodiments are possible.

Embodiments of the disclosure disclose a method and an apparatus for implementing a virtual sensor (for example, a virtual thermistor) for checking temperature (or heating) of an electronic device by the electronic device. An electronic device according to various embodiments includes a plurality of electronic components mounted into the electronic device, and a processor operatively connected to the electronic components, wherein the processor is configured to classify a prediction area according to predetermined characteristics, configure a virtual thermistor corresponding to the prediction area, based on the classification characteristic of the prediction area, collect information on at least one prediction area, based on the virtual thermistor, and manage heating of the electronic device, based on the collected information. Various embodiments are possible.

A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

A temperature detection device includes plural thermistors, a voltage source and plural temperature detection circuits. The first terminals of the thermistors are electrically connected with a common node. The voltage source is electrically connected with the common node directly. Each temperature detection circuit includes a voltage divider and a differential amplifier circuit. The voltage divider includes a first resistor and a second resistor. A first terminal of the first resistor is connected with the common node. A second terminal of the first resistor is connected with a first terminal of the second resistor and the second terminal of the corresponding thermistor. The second terminal of the second resistor is electrically connected with a ground terminal. The differential amplifier circuit includes a first input terminal connected with the first terminal of the first resistor, a second input terminal connected with the second terminal of the first resistor, and an output terminal.

A circuit device that is connected to a temperature detection element that detects a temperature of an object via an external signal line and an external signal ground line includes a connector that is connected to the external signal line and the external signal ground line, an internal signal line that is connected to the external signal line via the connector, an internal signal ground line that is connected to the external signal ground line via the connector, a controlling circuit that is connected to the internal signal line and the internal signal ground line and detects the temperature of the object, and a high-frequency filter that is inserted into at least one of a foremost stage of the internal signal line and a foremost stage of the internal signal ground line as viewed from the connector.

A circuit device that is connected to a temperature detection element that detects a temperature of an object via an external signal line and an external signal ground line includes a connector that is connected to the external signal line and the external signal ground line, an internal signal line that is connected to the external signal line via the connector, an internal signal ground line that is connected to the external signal ground line via the connector, a controlling circuit that is connected to the internal signal line and the internal signal ground line and detects the temperature of the object, and a high-frequency filter that is inserted into at least one of a foremost stage of the internal signal line and a foremost stage of the internal signal ground line as viewed from the connector.

A temperature sensor (116) comprises an electrical circuit (204) including a thermistor (206) intended to be placed next to an object (112); a temperature measurement module (222) configured for determining a measured temperature (T_M) of the thermistor (206) from a resistance of the thermistor (206); and a command module (224) configured for providing a command (C) to the electrical circuit (204) for modifying the electrical circuit (204) in a way that changes a current (IT) flowing in the thermistor (206). The temperature sensor (116) further comprises a thermal loss determination module (226) configured for determining a thermal loss (L) of the thermistor (206) from the thermistor measured temperature (T_M) and the command (C); and a temperature estimation module (228) configured for estimating a temperature (T0_E) of the object (112) from the thermistor measured temperature (T_M) and from the thermal loss (L) of the thermistor (TH).

A temperature sensor including a body made from a thermally and electrically conductive material, the body defined by a peripheral wall extending along a longitudinal axis from an open proximal end to a closed distal end. The proximal end defining an opening to an internal cavity of the body. A thermally responsive element including an outer surface, a temperature sensitive resistor electrically connected to a first lead, a second lead, and a connector block disposed substantially within the internal cavity. The inner surface of the peripheral wall defines the shape of a right circular cone at the distal end. The outer surface of the temperature sensitive resistor is in direct contact with the inner surface of the peripheral wall at the distal end. One of a thermally conductive and curable potting material and a thermally conductive grease disposed in the cavity and substantially surrounding the temperature responsive element.