Aspects of the subject technology relate to a sensor for a downhole tool. The downhole tool can include a collar and a sensor. The sensor can be secured to the collar for measuring one or more operational characteristics of the downhole tool during operation of the downhole tool. The sensor can include a substrate. The sensor can also include a plurality of strain gauges disposed on the substrate. The plurality of strain gauges can be configured to measure axial strains and torsional strains on the collar for measuring the one or more operational characteristics of the downhole tool.

The core-shell structured fiber-type strain sensor of the present disclosure, which includes a fibrous support forming a core and a multilayered shell layer formed on the fibrous support, exhibits improved strength and stiffness due to the core fiber, exhibits improved noise level due to an elastomer layer and allows manufacturing of a fiber-type sensor with improved linearity of measurement signals due to a sandwich-structured conductive layer, is advantageous in that stable strain measurement is possible without acting as a defect in a composite structure.

A strain sensor system having a first base plate with an elongate shape defining a first longitudinal axis, a first strain sensor disposed on the first base plate, a second base plate having an elongate shape defining a second longitudinal axis, a second strain sensor disposed on the second base plate, and a control unit configured to process measurement data produced by the first strain sensor and by the second strain sensor, wherein the first base plate and the second base plate are disposed such that the first longitudinal axis is arranged orthogonally or essentially orthogonally with respect to the second longitudinal axis.

A force sensor includes a first structure, four strain generation parts, and a second structure. The first structure is formed in such a way that a third axis penetrates therethrough. The four strain generation parts are provided along first and second axes on a reference plane formed by the first and second axes. The second structure is connected to the first structure with the strain generation parts interposed therebetween. The strain generation parts each includes a first beam part extending along the first axis or the second axis, and a second beam part extending in a direction orthogonal to the first beam part and connected to the first beam part at an intermediate part. The strain generation parts are formed in such a way that they are line-symmetric with respect to both the first axis and the second axis when projected in a direction of the third axis.

A force sensor includes a first structure, four strain generation parts, and a second structure connected to the first structure with the strain generation parts interposed therebetween. The strain generation part includes a first connection part connected to the first structure, a first branch part, which is a beam-like part branching into two from the first connection part toward the second structure and extending in directions separating from each other, a second branch part, which is a beam-like part connected to the first branch part with bent parts interposed therebetween and extending in directions approaching each other, and a second connection part where branched parts of the second branch part join and connects to the second structure. The strain generation parts are formed so that the strain generation parts become line-symmetric with respect to the first and second axes when projected in a direction perpendicular to the reference plane.

A printed circuit board including electronic components, a carrier equipped with a network of conductor tracks electrically connecting the electronic components and a strain gauge.

A method for monitoring at least one support structure in an above ground building, includes at least one strain gauge, wherein each of the strain gauges is attached to one of the support structures in the above ground building to detect the strain of the support structure at the area of attachment. An interrogator unit is connected to a gauge having a connection means providing access to the strain gauges for the interrogator unit, wherein the interrogator unit provides an output of strain values at each of the strain gauges. The embodiment also includes a monitoring system connected to the interrogator unit, wherein the monitoring system outputs an alarm signal when an evaluation of the strain value any of the strain gauges indicates a significant condition wherein the alarm signal in connected to the building control system to execute an action.

The invention relates to a strain-measuring structure, comprising a carrier, which is divided into regions along the predetermined breaking points only after being joined to the object to be measured. After the separation along the predetermined breaking points, the regions individually joined in the joining zones can be moved freely relative to one another in the event of strain of the object, without the strain-measuring structure applying significant forces to the object to be measured, which could distort the strain measurement. Measuring assemblies for measuring strain lie between the regions. Said measuring assemblies can be based on different principles, depending on the application. The invention further relates to a method for producing the strain-measuring structure, to a method for measuring the strain of objects, and to the use of the structure to measure strain. The invention further preferably relates to a system comprising the strain-measuring structure and a control device for reading out and preferably activating and joining the structure.

The invention relates to a strain gage and methods for making and using the same to measure strain of a surface of interest. In particular, the invention relates to a semiconductor strain gage held by a metal body using a ceramic interface between the gage and the body, which that can be attached to a surface of interest. The invention also relates to methods for making the ceramic interface and attaching the semiconductor strain gage to a surface of interest. The invention, including its various embodiments, also relates to using the semiconductor strain gage to measure strain at temperatures above 1000° F.

A sensor chip includes multiple sensing blocks each of which includes two or more T-patterned beam structures. Each T-patterned beam structure includes strain-detecting elements, at least one first detection beam, and a second detection beam extending from the first detection beam in a direction perpendicular to the first detection beam. Each T-patterned beam structure includes a connection portion formed by coupling ends of second detection beams in respective T-patterned structures, the connection portion including a force point portion. The sensor chip is configured to detect up to six axes relating to predetermined axial forces or moments around the predetermined axes, based on a change in an output of each of the strain-detecting elements, the output of each strain-detecting element changing in accordance with an input applied to a given force point portion.