Systems and methods for monitoring stress in 3D-printed building structures using embedded and surface sensors. The sensors may be embedded during or after the 3D printing process. The sensors may be strain gauges integrally formed in the 3D-printed building structure or positioned on the surface of the 3D-printed building structure. The embedded and surface sensors may measure tensile and compressive deformation occurring during the printing process, material relaxation process, the transportation process, and at a final location of the 3D-printed building structure. Deformation data collected by the sensors may be compared to accepted threshold values based on the material of the 3D-printed building structure.

Systems and methods for monitoring stress in 3D-printed building structures using embedded and surface sensors. The sensors may be embedded during or after the 3D printing process. The sensors may be strain gauges integrally formed in the 3D-printed building structure or positioned on the surface of the 3D-printed building structure. The embedded and surface sensors may measure tensile and compressive deformation occurring during the printing process, material relaxation process, the transportation process, and at a final location of the 3D-printed building structure. Deformation data collected by the sensors may be compared to accepted threshold values based on the material of the 3D-printed building structure.

A vehicle includes a plurality of track systems, a fluid pump, a plurality of fluid lines fluidly connecting the fluid pump to at least some of the tires of the wheels of each of the track systems, a plurality of pneumatic inflation actuators, a plurality of pneumatic deflation actuators, and a system controller. The system controller is in electronic communication with the fluid pump, the plurality of pneumatic inflation actuators, and the plurality of pneumatic deflation actuators. The system controller is operable to selectively adjust fluid pressure in select ones of the wheels of any one of the track systems of the vehicle by actuating corresponding ones of the plurality of pneumatic inflation actuators and the plurality of pneumatic deflation actuators. A track system has at least one of the leading idler wheels, trailing idler wheels, and mid-roller wheels including a tire containing a fluid.

A vehicle includes a plurality of track systems, a fluid pump, a plurality of fluid lines fluidly connecting the fluid pump to at least some of the tires of the wheels of each of the track systems, a plurality of pneumatic inflation actuators, a plurality of pneumatic deflation actuators, and a system controller. The system controller is in electronic communication with the fluid pump, the plurality of pneumatic inflation actuators, and the plurality of pneumatic deflation actuators. The system controller is operable to selectively adjust fluid pressure in select ones of the wheels of any one of the track systems of the vehicle by actuating corresponding ones of the plurality of pneumatic inflation actuators and the plurality of pneumatic deflation actuators. A track system has at least one of the leading idler wheels, trailing idler wheels, and mid-roller wheels including a tire containing a fluid.

A circuit is provided that includes a strain gauge resistor having a center axis and multiple conductor layer segments and a trim region extending along the center axis; wherein a first portion of the strain gauge resistor is located on one side of the center axis and a second portion of the strain gauge resistor is located on an opposite side of the center axis.

A device of force sensing, which includes a rigid structure and force sensors. The rigid structure includes rigid blocks spaced apart, and a strain amplification area is formed between two adjacent rigid blocks, every two force sensors in four force sensors are used as a group, and two groups of the force sensors are selectively arranged corresponding to two of the mounting surfaces of the strain amplification area, the four force sensors are connected to form different bridge circuits.

A device of force sensing, which includes a rigid structure and force sensors. The rigid structure includes rigid blocks spaced apart, and a strain amplification area is formed between two adjacent rigid blocks, every two force sensors in four force sensors are used as a group, and two groups of the force sensors are selectively arranged corresponding to two of the mounting surfaces of the strain amplification area, the four force sensors are connected to form different bridge circuits.

A semiconductor device is detachably mountable on a measurement target that includes sensors provided on a predetermined surface thereof. The semiconductor device includes a wiring board having a first surface, and a second surface opposite to the first surface, a semiconductor integrated circuit mounted on the first surface of the wiring board, measuring spring terminals mounted on the second surface of the wiring board, and projections provided on the second surface of the wiring board. Each of the measuring spring terminals makes contact with a terminal connecting to a corresponding one of the sensors to electrically connect the terminal and the corresponding one of the sensors, and each of the projections makes contact with the measurement target, in a state where the semiconductor device is mounted on the measurement target so that the predetermined surface of the measurement target opposes the second surface of the wiring board.

A strain sensor comprising a conductive member having a plurality of elements arranged adjacent to one another, and a non-conductive and elastically deformable material encapsulating the conductive member, wherein, in an equilibrium state, compressive forces cause at least one of the plurality of elements to contact at least a portion of an adjacent element, and wherein, when a strain is applied, a resulting elastic deformation causes at least one of the plurality of elements to space apart from an adjacent element such that the contacted portion decreases or is eliminated. A multi-axis force sensor comprising a sensing array comprising at least two planar sensors arranged radially on a planar substrate in antagonistic pairs, and a compressible member positioned between the substrate and a central portion of the sensing array, the compressible member acting to displace the central portion of the sensing array away from the substrate.

A strain sensor comprising a conductive member having a plurality of elements arranged adjacent to one another, and a non-conductive and elastically deformable material encapsulating the conductive member, wherein, in an equilibrium state, compressive forces cause at least one of the plurality of elements to contact at least a portion of an adjacent element, and wherein, when a strain is applied, a resulting elastic deformation causes at least one of the plurality of elements to space apart from an adjacent element such that the contacted portion decreases or is eliminated. A multi-axis force sensor comprising a sensing array comprising at least two planar sensors arranged radially on a planar substrate in antagonistic pairs, and a compressible member positioned between the substrate and a central portion of the sensing array, the compressible member acting to displace the central portion of the sensing array away from the substrate.